• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.27 no.3
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• pp.203-210
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• 2021

With the development of package printing technology, the package has expanded from the basic function of protecting products to the marketing function through package design. Color, the visual element that composes the package design, is delivered to the consumer most quickly and effectively. As color marketing of these package designs expands, accurate color reproduction that the product wants to express is becoming more important. The color of an object is transmitted by absorption and scattering of light. Spectral reflectance refers to the intensity of light reflected by an object at different wavelengths by the spectral effect. As a result, the color of the object is expressed in various colors. Packaged printing inks have their own absorption and scattering coefficients, and the Kubelka-Munk model for color reproduction and prediction defines the relationship between these correlation coefficients through reflectance. In the Kubelka-Munk model for color reproduction and prediction, the relationship between the absorption and scattering coefficients (K/S) of printed material is predicted as the sum of the K/S values according to the mixing ratio of all color ink used. In this study, the reflectance of the measured print is reversely calculated at the mixing ratio of print ink using the Kubelka-Munk model. Through this, the relationship value of the ink-specific absorption/scattering coefficient constituting the final printed material is predicted. Delta E is derived through the predicted reflectance, and the similarity between the measured value and the predicted value is confirmed.

• Proceedings of the Korean Reliability Society Conference
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• 2001.06a
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• pp.277-278
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• 2001

The successful operation of a product In service depends upon the effective provision of logistic support in order to achieve and maintain the required levels of performance and customer satisfaction. Logistic support encompasses the activities and facilities required to maintain a product (hardware and software) in service. Logistic support covers maintenance, manpower and personnel, training, spares, technical documentation and packaging handling, storage and transportation and support facilities.The cost of logistic support is often a major contributor to the Life Cycle Cost (LCC) of a product and increasingly customers are making purchase decisions based on lifecycle cost rather than initial purchase price alone. Logistic support considerations can therefore have a major impact on product sales by ensuring that the product can be easily maintained at a reasonable cost and that all the necessary facilities have been provided to fully support the product in the field so that it meets the required availability. Quantification of support costs allows the manufacturer to estimate the support cost elements and evaluate possible warranty costs. This reduces risk and allows support costs to be set at competitive rates.Integrated Logistic Support (ILS) is a management method by which all the logistic support services required by a customer can be brought together in a structured way and In harmony with a product. In essence the application of ILS:- causes logistic support considerations to be integrated into product design;- develops logistic support arrangements that are consistently related to the design and to each other;- provides the necessary logistic support at the beginning and during customer use at optimum cost.The method by which ILS achieves much of the above is through the application of Logistic Support Analysis (LSA). This is a series of support analysis tasks that are performed throughout the design process in order to ensure that the product can be supported efficiently In accordance with the requirements of the customer.The successful application of ILS will result in a number of customer and supplier benefits. These should include some or all of the following:- greater product uptime;- fewer product modifications due to supportability deficiencies and hence less supplier rework;- better adherence to production schedules in process plants through reduced maintenance, better support;- lower supplier product costs;- Bower customer support costs;- better visibility of support costs;- reduced product LCC;- a better and more saleable product;- Improved safety;- increased overall customer satisfaction;- increased product purchases;- potential for purchase or upgrade of the product sooner through customer savings on support of current product.ILS should be an integral part of the total management process with an on-going improvement activity using monitoring of achieved performance to tailor existing support and influence future design activities. For many years, ILS was predominantly applied to military procurement, primarily using standards generated by the US Government Department of Defense (DoD). The military standards refer to specialized government infrastructures and are too complex for commercial application. The methods and benefits of ILS, however, have potential for much wider application in commercial and civilian use. The concept of ILS is simple and depends on a structured procedure that assures that logistic aspects are fully considered throughout the design and development phases of a product, in close cooperation with the designers. The ability to effectively support the product is given equal weight to performance and is fully considered in relation to its cost.The application of ILS provides improvements in availability, maintenance support and longterm 3ogistic cost savings. Logistic costs are significant through the life of a system and can often amount to many times the initial purchase cost of the system.This study provides guidance on the minimum activities necessary to Implement effective ILS for a wide range of commercial suppliers. The guide supplements IEC60106-4, Guide on maintainability of equipment Part 4: Section Eight maintenance and maintenance support planning, which emphasizes the maintenance aspects of the support requirements and refers to other existing standards where appropriate. The use of Reliability and Maintainability studies is also mentioned in this study, as R&M is an important interface area to ILS.

• The Journal of the Korea Contents Association
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• v.16 no.1
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• pp.42-51
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• 2016

For changes in the distribution structure these days, consumer demand is moving rapidly from offline to online. The consumers' mentality to purchase products conveniently is reflected in this phenomenon. Also for agricultural products, safety to protect contents, brand and design which can provide credibility to consumers are recognized as most important than ever. Especially, strawberry is thin-skinned so that the quality of product may deteriorate even with weak impact and shaking, so it is significantly influenced by the structural packaging or material. Also, strawberry is frequently distributed through direct trading, it is the reality that the package design of strawberry is less competitive than that of other products due to inadequate environments of commercial farms. That is, the demand of strawberry increases everyday but the strawberry package cannot fulfill the needs of producers and consumers. In order to reinforce competitiveness in strawberry sales, it is urgent to carry out fundamental studies regarding the development of package. Therefore, the purpose of this study is to supplement and improve issues arising from the usage of current strawberry package. Through the analysis of strawberry package elements (shape, material, design) and understand the points of improvement sought by producers and consumers through IPA MAP (importance, satisfaction level) analysis.

• Journal of Practical Engineering Education
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• v.15 no.1
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• pp.209-221
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• 2023

In the external inspection and packaging stages of products used in the semiconductor manufacturing process, there is a problem in which particles are adsorbed to the product itself or a carrying tool due to electrostatic discharge. This study presents a methodology that can improve the problem of adsorption of particles to a product by using a practical TRIZ technique. By applying the proposed practical TRIZ-based methodology, the problem was defined, and contradictions caused by product waiting time were derived. Among the derived contradictions, physical contradictions were set and the concept of 'space separation' was applied to derive solutions such as 'installation of Ionizer' and 'improvement of the layout of the workroom'. As a result of the experiment by applying 'Ionizer Installation' and 'Workroom Layout Improvement' derived through the application of practical TRIZ, it was confirmed that the particle adsorption problem that occurs during the waiting time of the product can be solved.Through this study, it is expected that workers, facility engineers, and technical engineers working at manufacturing processes will be able to effectively solve the problems they face through creative thinking and change of ideas by using practical TRIZ techniques, and contribute to innovative technology development and productivity improvement.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.39 no.2
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• pp.85-93
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• 2006

This study was conducted to evaluate the optimal processing conditions of smoke-dried powdered oysters and to determine their shelf-life during storage for development of a natural oyster flavoring substance. The optimal conditions for processing of smoke-dried oyster powder with freshy oyster were as follows. Raw shelled oysters were rinsed with 3% saline solution, drained, boiled for 10 minutes at $98^{\circ}C$, and then smoked for 1 hour at $50^{\circ}C$, followed by drying for 4 hours at $80^{\circ}C$ Smoke-dried oyster powder with oyster scraps were prepared as flavoring material. The smoked oyster scraps were submerged in oyster sauce far 10 minutes at room temperature and then dried with hot air for 5 hours at $50^{\circ}C$. The smoke-dried oysters and smoke-dried oyster scraps were then pulverized to 50 mesh and packed in tea bags or vacuum-packed in laminated plastic film bags (PE/PVDC/CPP, $12{\mu}m/15{\mu}m/50{\mu}m$). Compared to non smoke-dried powdered oysters, the smoking and dipping in oyster sauce enhanced the flavor and prevented lipid oxidation of the smoke-dried powdered oyster product. Shelf-life tests indicated that the vacuum-packaging method preserved the quality of smoke-dried powdered oysters stored for 150 days at room temperature.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.11
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• pp.6472-6477
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• 2014

This study examined the trends of an illustration artist's art marketing widening its area in recent years and proposes a design concept of color cosmetics. Art marketing is a type of culture marketing and means marketing through exhibitions, performances and other artistic activities. Free artistic sensibility expression in which the artistic motif is melted into a product beyond the works of a particular artist, and the product, in turn, can be reflected in the canvas, has attracted attention. The works of illustrators are widening their area into the item in life not canvas. This paper proposes the color cosmetics design that reflect art marketing. The main target who proposed the design concept was trend-oriented and in their early to mid-20s with a strong personality, showing a strong tendency of attracting attention and being recognized. To emphasize the design concept of color cosmetics packaging design, the progressive image of the target class was reflected through brilliant and intense color combination. The cultural value and meaning are provided as the artistic mood becomes a part of life.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.1
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• pp.1-6
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• 2010

This study presents the preform injection molding and the blow molding of the injection stretch-blow molding process for PET bottles. The numerical analysis of the injection molding and the blow molding of a preform is considered in this paper using CAE with a view to minimize the warpage and the thickness. In order to determine the design parameters and processing conditions in injection/blow molding, it is very important to establish the numerical model with physical phenomenon. In this study, a three dimensional model has been introduced for the purpose and flow simulations of filling, post-filling and cooling process are carried out. The simulations resulted in the warpage in good agreement with the measurements. Also, from the result of numerical analysis, we appropriately predicted the warpage, deformation and thickness distribution along the product walls.

• The Research Journal of the Costume Culture
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• v.30 no.1
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• pp.102-120
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• 2022

With the growing importance of ESG as a must-have business strategy, this study attempted to analyze the current state of ESG practices in the Korean fashion businesses. The ESG cases of fashion business were collected from news articles searched on the largest Korean internet portal by November 2021 from October 2020 when the number of articles began to increase meaningfully. Three hundred ninety one ESG cases of 112 fashion manufacturing brands and 332 ESG cases of 49 retail brands were analyzed. Casual and outdoor/sportswear brands among fashion manufacturers were most active in ESG practices, and various online and offline retailers were practicing ESG. Approximately one-third of the fashion brands were positioned as eco-friendly concept. While environmental practices were the most practiced ESG, governance was the least practiced. Among environmental practices, fashion manufacturing businesses were most active in eco-friendly product development, while retail businesses were in eco-friendly campaign-event-service and eco-friendly packaging. The most active social practice was the contribution to communities, followed by retail businesses' sharing growth with partner businesses. Governance practices were focused on the structure and operation of the board. Various ESG collaborations with various partners were also observed. The research result is meaningful verifying and diagnosing the ESG practices of the Korean fashion businesses.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).