• International Journal of Quality Innovation
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• v.6 no.3
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• pp.70-94
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• 2005

The IC packaging industry heavily relies on shop floor information, necessitating the development of a model to flexibly define shop floor information and timely handle manufacturing data. This study presents a novel data model of product manufacturing flow to define shop floor information to effectively respond to accelerated developments in IC package industry. The proposed data model consists of four modules: operation template setup, general process setup, enhanced bill of manufacture (EBOMfr) setup, and work-order process setup. The data model can flexibly define the required shop floor information and decision rules for shop floor product manufacturing flow, allowing one to easily adopt changes of the product and on the shop floor. However, to handle floor dynamics of the IC packaging industry, this work also proposes a WIP (i.e. work-in-process) system for monitoring and controlling the product manufacturing flow on the shop floor. The WIP system integrates the data model with a WIP execution module. Furthermore, an illustrative example, the MIRL WIP System, developed by Mechanical Industrial Research Laboratories of Industrial Technology Research Institute, demonstrates the effectiveness of the proposed model.

• Design & Manufacturing
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• v.2 no.2
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• pp.15-19
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• 2008

In this paper, the automatic assembly and packaging system was developed for PET blow molding products. The PET blow molding products mainly are used in groceries case and are in great demand. Generally, the molding process is compose of 4 processes such as plastic resin injection, molding, ejecting and packaging. In case of packaging process, although amount of work per hour is very large, all processes are still performed by the manual work. For this reason, the automatic packaging system was developed with the function of automatic hand-grip part assembly. For the development of system, the existing processes and the shape of molding product were analyzed and specifications were deducted. Finally, the automatic assembly and packaging system was developed and applied to the manufacturing field.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2007.04a
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• pp.67-79
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• 2007

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.31-34
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• 2016

System In Package (SiP) is getting popular and momentum for the recent wearable, IoT and connectivity application apart from mobile phone. This is driven by market demands of cost competitive, lighter and smaller/thinner and higher performance. As one of many semiconducting assembly products, Leadframe product has been widely used for low cost solution, light/ small and thin form factor. But It has not been applied for SiP although Leadframe product has many advantages in cost, size and reliability performance. SiP is mostly based on laminate substrate and technically difficult on Leadframe substrate because of a limitation in SMT performance. In this paper, Leadframe based SiP product has been evaluated about key technical challenges in SMT performance and electrical shield technology. Mostly Leadframe is considered not available to apply EMI shield because of tie-bar around package edge. In order to overcome two major challenges, connection bars were deployed properly for SMT pad to pad and additional back-side etching was implemented after molding process to achieve electrical isolation from outer shield coating. This product was confirmed assembly workability as well as reliability.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.02a
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• pp.37-59
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• 2004

In the case of Ni/Au finished pad on the package side, the solder joint of SnAgCu system can bring brittle fracture under impact load such as drop test. Therefore, it's difficult to prevent the brittle fracture of lead-free solder, by controlling Cu content. The failure locus existing on the interface between $(Ni,Cu)_3Sn_4\;and\;(Cu,Ni)_6Sn_5$ IMC layers must be changed to other site in order to avoid brittle fracture due to impact load. It was not found any clear evidence that there were two IMC layers exist. But it was strongly assumed these were two layers which have different Cu-Ni composition. From the above analysis it was assumed that Cu atom in the solder alloy or substrate seemed to affect IMC composition and cause to IMC brittle fracture.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.11 no.2
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• pp.101-107
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• 2005

The term 'antimicrobial' packaging encompasses any packaging technique(s) used to control microbial growth in the food product. These include packaging materials and edible films and coatings that contain antimicrobial agents, and also techniques that modify the atmosphere within the package. In recent years, antimicrobial packaging has attracted much attention from the food industry because of the increase in consumer demand for minimally processed, preservative-free products. Reflecting this demand, the preservative agents must be applied to packaging in such a way that only low levels of preservatives come into contact with the food. The film or coating technique is considered to be more effective, although more complicated to apply. New antimicrobial packaging materials are being developed continually. Many of them exploit natural agents, to control common food-borne microorganisms. Current trends suggest that in due course, packaging will generally incorporate antimicrobial agents and the sealing systems will continue to improve. The focus of packaging in the past has been on the appearance, size and integrity of the package. A greater emphasis on safety features associated with the addition of antimicrobial agents is perhaps the next area for development in packaging technology.

• Industrial Engineering and Management Systems
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• v.3 no.1
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• pp.71-77
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• 2004

In this paper, the difficulties involved in analyzing and designing a management system for product development are discussed with reference to reducing the impact of products on the environment. We propose some models and methods to analyze information behavior in the process of product development based on a fusion model which integrates the assessments of users’ needs, the environment, and available technology. These models and methods are subsequently applied to the development of a new packaging material. The results of this case study allow us to identify effective information for the design of a management system for product development to reduce the impact of products on the environment.

• Proceedings of the IEEK Conference
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• 2009.05a
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• pp.344-346
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• 2009

Cell type packaging line is more suitable for the products with various models and small quantities like mobile phone or mp3 player than conveyor type packaging line. Cell type packaging line is applicable to package various product models, but it can cause wrong product compositions and missing of items. So, automatic missing item detection system is needed. We designed an missing item detection system with a bar code reader, infrared sensors, and s digital camera. and also developed the programs for sensor data acquisition, image data processing, GUI, and data management.

• Food Science and Industry
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• v.50 no.2
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• pp.12-26
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• 2017

Processing steps such as washing and cutting, involved in preparing fresh-cut produce causes tissue damage, leading to rapid quality deterioration. Major defects of fresh-cut produce are discoloration, softening, off-odor development, and microbial growth. Packaging of fresh-cut produce has been changed to reduce these quality problems. Flexible packaging film is widely used to pack fresh-cut produce. Vacuum packaging was the popular packaging method in the beginning of fresh-cut industry in Korea. Vacuum packaging creates high $CO_2$ and low $O_2$ levels to control browning of fresh-cut produce. However, these conditions induce some visual defects and off-odor development. Discoloration problem was also found when fresh-cut produce was packaged with conventional packaging film or plastic tray. Modified atmosphere (MA) packaging is effective for prolonging shelf-life of fresh-cut produce by decreasing $O_2$ and increasing $CO_2$ concentration in the package. Retail MA packaging using different oxygen transmission rate (OTR) film and micro-perforated film has started to be applied to fresh-cut produce in Korea. Proper MA package design that provides optimum range of $O_2$ and $CO_2$ partial pressures is one of the major challenges in the industry. An initial package flushing with $N_2$ or an low $O_2$/high $CO_2$ atmosphere is also used to more rapidly establish steady-state MA condition. Film OTR and $O_2$ flushing affects the fermentative volatile production, off-odor development, electrolyte leakage, discoloration, $CO_2$ injury, microbial population of fresh-cut produce. There is also a demand for convenient packaging to attract consumers. Rigid fresh-cut produce container for retail market has increased since the packaging provides excellent protection from physical damage during transport. Rigid tray used as actual serving vessel for the consumer is increasing in Korea. The tray with flexible lid to wrap or seal fresh-cut produce is more and more gaining popularity. Further practical technology to control quality change and microbial growth for each fresh-cut product has been studied since various fresh-cut items were required. The fresh-cut industry also focuses on searching for more convenient and environmentally friendly packaging.

• Food preservation and processing industry
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• v.15 no.2
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• pp.23-31
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• 2016

Dairy products, including milk, cheese, cream, yogurt, and butter, constitute excellent sources of essential nutrients such as calcium, proteins, and vitamin D; therefore, nutritionists recommend a constant daily dietary intake of dairy products. Packaging is an important feature that ensures high-quality products are delivered to consumers; different packaging materials and forms are required depending on the products. Packaging forms include pouches for butter, cheese, and milk powder; cartons for liquid, frozen, and coagulated milk; packets for pasteurized liquid milk; bottles for milkshakes and other liquid products; and cups for frozen and coagulated products. The increase in mobile lifestyles among consumers will lead to smaller households and greater preference for convenience, which will promote individual and smaller packaging for dairy products. This article reviews the development of packaging materials and forms, packaging requirements, and future considerations for the packaging of dairy products.