• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.19 no.1
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• pp.1-6
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• 2013

Confectionary and food products were collected from Korea and Japan. Types of packaging structure, amount of packaging materials used, basis weight of paperboard, and product to packaging ratio were evaluated for understanding confectionery and food packaging in both countries. Also, new packaging samples were designed and fabricated for reducing the use of packaging resources and for optimizing the product to packaging ratio. Korean confectionary products showed much higher empty space inside package than that of Japanese products, while food products were not significantly different between tow countries. There were no significant differences in the basis weight of paperboard collected. All of the re-designed confectionary products showed more than 15% saving in packaging resource compared to current confectionary products.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.37-45
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• 2006

The mobile-phone which Camera was put on was released at the end of 2000 and dramatically puts up the deployment ratio because not only simple Camera but also a function that the photograph which I took is dispatched was added. It is the force that demand in this year presses 600,000,000 sale of a mobile-phone is estimated to be 960,000,000 of them in 2006, and to be able to include two errands with a support model after 3G. A person of entry to a camera-module appear much. In addition, the various kinds of products open markedly which a product comes to be known widely in the world, and the application range has opened widely, and considered QCDT come to be key issues for answer to market demand. By manufacturing industry, there is peculiar culture to each industry, camera-module is the composition the various industries. The construction of true Supply-chain becomes unavoidable to make a good product. I describe the point that the situation of each supply-chain and the direction for the future by the view point of module assembly maker.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.19 no.2
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• pp.95-102
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• 2013

Exfoliated graphite (EFG) with high aspect ratio was incorporated with high density polyethylene (HDPE) for use as high barrier packaging material such as water-sensitivity electric product and pharmaceutical packaging. Also HDPE/EFG nanocomposite films were prepared by adding the compatibilizer for effective dispersion and compatibility. Their chemical properties, crystal structure properties, thermal properties and water barrier properties of as-prepared HDPE/EFG nanocomposite films were investigated as a function of EFG contents. It showed that there is a weak interfacial interaction between HDPE and EFG, however, the water vapor permeations were decreased from 127 to 78 (70 ${\mu}m{\cdot}g/m^2$, $day{\cdot}atm$) by addition of EFG. Especially, the physical properties of HDPE/EFG nanocomposite films were effectively increased up to 0.5 wt%, however, there were no significant improvement of properties in nanocomposite films at the additional EFG loading. To maximize their performance of the nanocomposite films, further research is required to enhance the dispersion of EFG and compatibility of EFG in HDPE matrix.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.41-45
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• 2018

As the size of semiconductor chip shrinks, the electronic industry has been paying close attention to fan-out wafer level packaging (FO-WLP) as an emerging solution to accommodate high input and output density. FO-WLP also has several advantages, such as thin thickness and good thermal resistance, compared to conventional packaging technologies. However, one major challenge in current FO-WLP manufacturing process is to control wafer warpage, caused by the difference of coefficient of thermal expansion and Young's modulus among the materials. Wafer warpage induces misalignment of chips and interconnects, which eventually reduces product quality and reliability in high volume manufacturing. In order to control wafer warpage, it is necessary to understand the effect of material properties and design parameters, such as chip size, chip to mold ratio, and carrier thickness, during packaging processes. This paper focuses on the effects of thickness of chip and molding compound on 12" wafer warpage after PMC of EMC using finite element analysis. As a result, the largest warpage was observed at specific thickness ratio of chip and EMC.

• Design & Manufacturing
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• v.1 no.1
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• pp.17-21
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• 2007

In the manufacture and processing of large plastic materials, product quality is tested and verified through several techniques such as injection processing, residual stress through injection molding and shrinkage. With regards to the injection molding process, common problems such as inconsistent density is seen when different points of the product are discovered to have varying thickness levels. Sink marks in product are then evident. This occurs when there is poor molding conditions caused about by poor runner and packaging systems incorporated into the process. We designed the runner system which is possible balanced filling to cavities using CAE program $Moldflow^{TM}$ and then obtained optimal processing conditions by Taguchi's Robust Design technique.

• Journal of Biosystems Engineering
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• v.28 no.4
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• pp.315-324
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• 2003

If an optimum design technique is applied in the design of packaging container for bulk-type products, merits on the side of not only economic and compression performance but distribution efficiency are expected. Accordingly, minimum board area (mRBA), compression strength (CS) and compression strength per unit area (mCSPA) are important design parameters in optimum design of packaging container for bulk-type products. In this study, mathematical models for mRBA, CS and mCSPA of container as algorithm for optimum design program were developed. In order to develop these models, compression test by various dimensions of container and response surface analysis for mRBA, CS, and mCSPA of container were carried out. In the developed models, volume, W/L ratio and depth of container were principal independent variables. On the found of these models, optimum design program having faculties of outward and inward optimum design and information design was developed. Though the packaging specifications are same, required board area, board combination and cost of the corrugated board required container manufacture were greatly different by boundary conditions in outward design. Moreover, about 6.3∼10.1% in weight of container was lighter, and about 13.2∼25.6% in cost of container was reduced when the program was applied for 2 kinds of bulk-type products.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.23 no.3
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• pp.173-181
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• 2017

This study was conducted to investigate the packaging characteristics including pack sources and pack components of processed foods in Korea. For the survey, 704 food package samples were selected based on the consumption of top 10 brackets in each food item. They were consisted of 1,245 packaging components. Seven specific items were firstly investigated including product name, capacity of the food, package component, package source, food contact area, food contact ratio, and package thickness. The processed foods in Korea can be classified into 16 pack sources and 21 pack components, respectively. By using this information, the data were analyzed specifically. The collected data were analyzed in 8 major categories: frequency of use by pack components and pack sources, pack components by the products, pack sources by the products and pack components, pack thickness/food contact ratio by the products, food contact ratio by pack components and pack sources. Consequently, this survey will provide various information of the packaging characteristics of processed foods in Korea.

• Korean Journal of Food Science and Technology
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• v.35 no.6
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• pp.1110-1116
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• 2003

The effects of packaging methods on the storage quality of minimally processed (prepeeled) onions were investigated to determine the optimal packing design. Various packaging treatments used for modifying headspace atmospheres included two passive MAP using LDPE and PP films, two active MAP using a gas mixture of 20% $O_2/10%\;CO_2/balance\;N_2$ and an ethylene scavenging sachet, and moderate vacuum packaging (MVP). The quality attributes of onion samples were evaluated periodically in terms of flesh weight loss, color of cut surface, decay ratio, microbial counts, and sensory properties during storage at $10^{\circ}C$ for 28 days. Packaging methods did not significantly influence surface color, weight loss, and microbiological populations of mesophiles, psychrotrophs, and lactic acid bacteria. They did, however, affect sensory characteristics as well as decay occurrence. Results indicated that seal-packaging with a gas-permeable plastic film under a mild vacuum condition could retain better onion quality in terms of microbial decay and visual sensory aspects as compared with the other packages.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.47 no.4
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• pp.60-65
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• 2015

In order to improve the strength of paper, mixing ratio of Sw-BKP and Hw-BKP and PVA (polyvinyl alcohol) fibers dosage were investigated. When the Sw-BKP fraction was increased, strength properties were increased because of average fibers length increased. When PVA fraction increased, paper strength was increased, but there was dissolution of PVA in water. The reason for improving handsheet strength that contained PVA was due to increased bonding action between the fibers by the PVA. The addition of PVA to kraft pulp would be helpful for packaging paper materials to increase strength and fracture toughness.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.43 no.1
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• pp.26-33
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• 2020

The plastic waste problem is deepening all over the world. Plastic wastes have serious impacts on our lives as well as environ- mental pollution. The production and use of plastics increases every year, but once they are produced, they usually roam the earth for hundreds or thousands of years to pollute the environment. Although there is growing interest in plastic issues around the world and environmental regulations are being tightened, but no clear solution has yet been found. This study suggests Environmental degradation index (EDI). EDI can help raise consumers' attention to plastic wastes. In addition, EDI will contribute to reduce them in the future. As far as we know, this is the first study. We developed EDI for the confectionery packaging. This study defines four factors that may affect the environment of confectionery packaging: greenhouse gas emissions, energy consumption, methane emissions, and packaging space ratio. Then we quantify the value of each element and compute EDI as the sum of the four component values. In order to evaluate the feasibility of EDI proposed in this study, confectionery-packaging materials distributed in Korea were collected and analyzed. First, the types of confectionery are classified into pies, biscuits, and snacks and basic data was collected. Then the values of the four components were calculated using existing research data on the environment. We can use the proposed EDI to determine how much a product packing affects the environment.