• Title/Summary/Keyword: ProcessInduced Deformation

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Manufacturing of Cold-rolled TRIP Steel by Reversion Process (역변태에 의한 냉연 TRIP강의 제조기술)

  • 진광근;정진환;이규영
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 1999.08a
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    • pp.356-365
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    • 1999
  • The present study is aimed at developing the TRIP(transformation induced plasticity) aided high strength low carbon steel using reversion process. An excellent combination of elongation over 40% and tensile strength abut 100kgf/$\textrm{mm}^2$ achieved in processing of 0.15C-0.5 Si-6Mn steel by slow heating to intercritial temperature region and accelerated cooling into room temperature. This good combination is caused by TRIP phenomena of retained austenite in steels during deformation. The stability of retained austenite is very important for the good ductility and it depends on the diffusion of carbon and manganeses during heat treatment. The accelerated cooling after holding at annealing temperature retards the formation of pearlite and provides the carbon enrichment in retained austenite in steel, resulting in the increase in elongation of the cold-rolled TRIP steel. On the other hand, heat treating the steel at 600$^{\circ}C$ for 5 hour before cold rolling increases elongation but reduces the amount of retained austenite after reversion processing. It is accounted that the heat treating is effective for the increase in the stability of retained austenite.

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Evaluation of the Residual Stress with Respect to Supporting Type of Multi-layer Thin Film for the Metallization of Pressure Sensor (압력센서의 배선을 위한 다층 박막의 지지조건 변화에 따른 잔류응력 평가)

  • Shim, Jae-Joon;Han, Geun-Jo;Han, Dong-Seup
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.5
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    • pp.532-538
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    • 2004
  • MEMS technology applying to the sensors and micro-electro devices is complete system. These microsystems are made by variable processes. Especially, the mentallization process has very important functions to transfer the power operating the sensor and signal induced from sensor part. But in the structures of MEMS the local stress concentration and deformation are often yielded by an irregular geometrical shape and different constraint. Therefore, this paper studies the effect of supporting type and thickness ratio about thin film of the substrate on the residual stress variation when the thermal loads is applied to the multi-layer thin film fabricated by metallization process. Specimens were made from several materials such as Al, Au and Cu. Then, uniform thermal load was applied, repeatedly. The residual stress was measured by FE Analysis and nano-indentation method using AFM. Generally, the specimen made of Al induced the larger residual stress than that of made of other materials. Specimen made of Cu and Au having the low thermal expansion coefficient induces the minimum residual stress. Similarly, the lowest indentation length was measured by nano-indentation method in the Si/Au/Cu specimen. Particularly, clusters are created in the specimen made of Cu by thermal load and the indentation length became increasingly large by cluster formation.

EFFECTS OF PROCESS INDUCED DEFECTS ON THERMAL PERFORMANCE OF FLIP CHIP PACKAGE

  • Park, Joohyuk;Sham, Man-Lung
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.11a
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    • pp.39-47
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    • 2002
  • Heat is always the root of stress acting upon the electronic package, regardless of the heat due to the device itself during operation or working under the adverse environment. Due to the significant mismatch in coefficient of thermal expansion (CTE) and the thermal conductivity (K) of the packaging components, on one hand intensive research has been conducted in order to enhance the device reliability by minimizing the mechanical stressing and deformation within the package. On the other hand the effectiveness of different thermal enhancements are pursued to dissipate the heat to avoid the overheating of the device. However, the interactions between the thermal-mechanical loading has not yet been address fully. in articular when the temperature gradient is considered within the package. To address the interactions between the thermal loading upon the mechanical stressing condition. coupled-field analysis is performed to account the interaction between the thermal and mechanical stress distribution. Furthermore, process induced defects are also incorporated into the analysis to determine the effects on thermal conducting path as well as the mechanical stress distribution. It is concluded that it feasible to consider the thermal gradient within the package accompanied with the mechanical analysis, and the subsequent effects of the inherent defects on the overall structural integrity of the package are discussed.

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A Study for Reducing Tension Loosening in CRT Tension Mask (CRT 텐션 마스크의 장력 이완 저감을 위한 연구)

  • 정일섭
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.6
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    • pp.214-221
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    • 2003
  • Tension mask assembly is positioned right behind the glass-made front panels of CRT type display devices. The frame-supported thin metal sheet contains numerous slits, through which electron beams are focused to enhance definition. Pretension is imposed on the masks, especially for enlarged flat screens, in order to avoid vibration due to acoustic or mechanical impact. High temperature assembly process subsequent to pretensioning, however, degenerates the creep resistance of common mask materials, and if tensile stress is high enough, tension on the mask may be loosened substantially due to creep deformation. In this study, the assembly is modeled as a combined structure of beams and wire array, and a numerical simulation is attempted for pretensioning followed by high temperature process. According to a model study, small amount of creep strain is likely to be generated, but its adverse influence is not negligible. Some structural modification measures to reduce the creep-induced tension loosening are proposed and evaluated. Also, optimal configuration of frame structure is sought for, which maintains high tension of masks and minimizes the possible creep of frame simultaneously.

The Finite Element Analysis for Prediction of Residual Stresses Induced by Cold Expansion (홀확장 잔류응력 예측을 위한 유한요소해석)

  • Kim, Cheol;Yang, Won-Ho;Ko, Myung-Hoon;Heo, Sung-Pil;Hyun, Cheol-Seung
    • Proceedings of the KSME Conference
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    • 2000.11a
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    • pp.470-474
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    • 2000
  • Cold expansion of fastener holes is a mechanical process widely used in the aerospace industry. This treatment leads to an improvement of fatigue behavior due to the developed compressive residual stresses on the hole surface. The residual stress profile depends on the parameters of cold expansion, which are, expanding rate, inserting direction of mandrel, material properties etc. and the method to confirm this profile is only measurement by X-ray diffractometer. Despite its importance to aerospace industries, little attention has been devoted to the accurate modelling of the process. In this paper, Two-dimensional axisymmetric finite element simulations have been conducted for the cold expansion in an aluminium plate in order to predict the magnitude and distribution of the residual stress and plastic deformation. Maximum compressive residual stress could be increase about 7 percent using the 2-step cold expansion method.

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Effects of Substrate Materials on the Porosity Formation of Spary Cast Deposit (분사주조 성형체의 기공형성에 대한 기판재료의 영향)

  • Kim, Dong-Gyu
    • Journal of Korea Foundry Society
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    • v.13 no.5
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    • pp.476-483
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    • 1993
  • The influence of substrate materials on the degree of basal porosity during spray casting process has been investigated. Different conditions of droplet spreading on the substrate were induced by varying the substrate material. Flat sections of cast iron and aluminum have been spray deposited via spray casting process onto an aluminum substrate, a low carbon steel substrate, and an alumina based refractory substrate. Results for cast iron and aluminum sprayed onto the aluminum substrate showed significant improvements in the surface condition and degree of basal porosity with evidence of substrate deformation that round pits ranging from $5{\mu}m$ to $20{\mu}m$ in diameter are distributed on the surface of aluminum substrate. The lowest level of porosity was developed in alumina based refractory material. Several mechanisms for porosity formation were discussed with droplet impact pressure and droplet spreading. Adopting a spray cutting mechanism for removing the periphery of spray cone, porosity level was remarkably decreased.

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Combined hardening and localized failure with softening plasticity in dynamics

  • Do, Xuan Nam;Ibrahimbegovic, Adnan;Brancherie, Delphine
    • Coupled systems mechanics
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    • v.4 no.2
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    • pp.115-136
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    • 2015
  • We present for one-dimensional model for elastoplastic bar with combined hardening in FPZ - fracture process zone and softening with embedded strong discontinuities. The simplified version of the model without FPZ is directly compared and validated against analytical solution of Bazant and Belytschko (1985). It is shown that deformation localizes in an area which is governed by the chosen element size and therefore causes mesh sensitivity and that the length of the strain-softening region tends to localize into a point, which also agrees with results obtained by stability analysis for static case. Strain increases in the softening domain with a simultaneous decrease of stress. The problem unloads elastically outside the strain-softening region. The more general case with FPZ leads to more interesting results that also account for induced strain heterogeneities.

Form-Joining Process with the Aid of Adhesive for Joining of Sheet Metal Pair (중첩된 박판간의 결합을 위한 접착-성형공정)

  • 정창균;김태정;양동열
    • Transactions of Materials Processing
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    • v.13 no.4
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    • pp.342-349
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    • 2004
  • The form-joining process (or clinching) uses a set of die and punch to impose the plastic deformation-induced geometric constraint on a sheet metal pair. The joining strength from the process ranges 50-70 percent of that of the resistance spot welding. In this paper, a new form-joining process with the aid of an adhesive is proposed in which an epoxy adhesive is applied to a sheet metal pair, and before it cures the pair is clinched to cause the geometric constraint in the form of a protrusion. In order to reduce the forming load and the height of protrusions, a new die and punch set with a very small clearance is devised to reduce the depth of drawing and the forming load. Taguchi method is employed to find the optimal values of design parameters. To implement each case of the orthogonal array, the finite element method is used. The experiments show that in the tensile-shear test, the bonding strength of the new form-joining process with an epoxy adhesive is approximately the same as that of the resistance spot welding; and in comparison with the other two form-joining processes with an epoxy adhesive, the height of protrusions is reduced by more than 65 percent and the forming load by 50 percent.

Variation of Residual Welding Stresses in Incoloy 908 Conduit during the Jacketing of Superconducting Cables

  • Lee, Ho-Jin;Kim, Ki-Baik;Nam, Hyun-Il
    • Progress in Superconductivity and Cryogenics
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    • v.5 no.1
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    • pp.71-75
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    • 2003
  • The conduit fer superconducting cable is welded and plastically deformed during the jacketing process to make the CICC (Cable-in-Conduit-Conductors) fer a fusion magnet. The jacketing process of KSTAR (Korea Superconducting Tokamak Advanced Research) conductors is composed of several sequential steps such as rounding, welding, sizing, and square-rolling. Since the welded zone in Incoloy 908 conduit is brittle and easy to have flaws, there may be a possibility of stress corrosion cracking during the heat treatment of coil when both the induced tensile residual stress and the concentration of oxygen in the furnace are sufficiently high. The steps of the jacketing process were simulated using the finite element method of the commercial ABAQUS code, and the stress distribution in the conduit in each step was calculated, respectively. Furthermore, the variations of residual welding stresses through the steps of the jacketing process were calculated and analyzed to anticipate the possibility of the stress corrosion cracking in the conduit. The concentrated high tensile residual welding stresses along the welding bead decrease by the plastic deformation of the following sizing step. The distribution in residual stresses in the conductor for magnet coil is mainly governed by the last step of square-rolling.

Development of Thermal Distortion Analysis Method Based on Inherent Strain for TMCP Steels (TMCP 강판의 고유변형도 기반 열변형 해석법 개발)

  • Ha, Yun-Sok;Yang, Jin-Hyuk;Won, Seok-Hee;Yi, Myung-Su
    • Journal of Welding and Joining
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    • v.26 no.3
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    • pp.61-66
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    • 2008
  • As ships become to be larger than ever, the thicker plate and the higher tensile steel plate are used in naval shipyard. Though special chemical composition is needed for high-tensile steels, recent high-tensile steels are made by the TMCP(Thermo-Mechanical control process) skill. The increase of yield stress and tensile stress of TMCP steels is induced from bainite phase which is transformed from austenite, but that increased yield stress can be vanished by another additional thermal cycle like welding and heating. As thermal deformations are deeply related by yield stress of material, the study for prediction of plate deformation by heating should reflect principle of TMCP steels. This study developed an algorithm which can calculate inherent strain. In this algorithm, not only the mechanical principles of thermal deformations, but also the predicting of the portion of initial bainite is considered when calculating inherent strain. The simulations of plate deformation by these values showed good agreements with experimental results of normalizing steels and TMCP steels in welding and heating. Finally we made an inherent strain database of steels used in Class rule.