• 제목/요약/키워드: Process technology

검색결과 33,797건 처리시간 0.05초

기술의 동태적 발전 과정을 통한 기업성장 -현대자동차 사례연구- (A Company Growth by the Dynamic Development Process of Technology -A Case Study on Hyundai Motor Company-)

  • 박종찬
    • 기술혁신학회지
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    • 제4권1호
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    • pp.32-48
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    • 2001
  • Many Korean companies have grown up through technology import, learning, development, innovation and export. This process is called as "the dynamic development process of technology". Among many companies which have grown up by way of this process, the Hyundai Motor Company has shown a very remarkable achievement in technological growth. In short, this paper deals with the growth of Korean companies in the view of the dynamic development process of technology. As a case study, the paper analyzes the Hyundai Motor Company.r Company.

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MLCC 적층용 진공척의 자기연마와 ELID연삭을 이용한 미세버 제거 기술 (Deburring Technology of Vacuum Plate for MLCC Lamination Using Magnetic Abrasive Polishing and ELID Process)

  • 이용철;신건휘;곽태수
    • 한국기계가공학회지
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    • 제14권3호
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    • pp.149-154
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    • 2015
  • This study has focused on the deburring technology of a vacuum plate for MLCC lamination using electrolytic in-process dressing (ELID) grinding, and the magnetic-assisted polishing (MAP) process. The surface of the vacuum plate has many micro-holes for vacuum suction. They are easily blocked by the burrs created in the surface-flattening process, such as the conventional grinding process. In this study, the MAP process, the ELID grinding process, and an ultrasonic vibration table are examined to remove the micro-burrs that lead to the blockage of the holes. In the results of the experiments, the MAP process and ELID grinding technology showed significant improvements of surface roughness and deburring performance.

자취 군집화를 통한 프로세스 마이닝의 성능 개선 (Improving Process Mining with Trace Clustering)

  • 송민석;;;정재윤
    • 대한산업공학회지
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    • 제34권4호
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    • pp.460-469
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    • 2008
  • Process mining aims at mining valuable information from process execution results (called "event logs"). Even though process mining techniques have proven to be a valuable tool, the mining results from real process logs are usually too complex to interpret. The main cause that leads to complex models is the diversity of process logs. To address this issue, this paper proposes a trace clustering approach that splits a process log into homogeneous subsets and applies existing process mining techniques to each subset. Based on log profiles from a process log, the approach uses existing clustering techniques to derive clusters. Our approach are implemented in ProM framework. To illustrate this, a real-life case study is also presented.

PSA 공정에 의한 이성분 및 삼성분 혼합기체로부터 수소분리 (Hydrogen Separation from Binary and Ternary Mixture Gases by Pressure Swing Adsorption)

  • 강석현;정병만;최현우;안의섭;장성철;김성현;이병권;최대기
    • Korean Chemical Engineering Research
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    • 제43권6호
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    • pp.728-739
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    • 2005
  • 활성탄을 흡착제로 이용한 2bed-6step PSA 공정에서 이성분 혼합기체 $H_2/Ar$(80%/ 20%)와 삼성분 혼합기체 $H_2/Ar/CH_4$(60%/ 20%/ 20%)의 수소 분리를 연구하였다. 비등온-비단열 상태에서 LRC 등온식과 LDF 모델을 고려하여 공정실험과 공정모사를 하였으며, 주기정상상태에 도달할 때까지 탑 내의 농도와 온도변화를 각각 알아보았다. 두 공정 모두에서 수소에 대한 순도 99%와 회수율 75%의 결과를 얻을 수 있었다. 이때, PSA 공정에 미치는 영향으로는 공급유량, 흡착압력 그리고 P/F ratio를 변수로 실험과 전산모사를 수행하여 결과를 비교하였다. 이 결과로부터, 다성분에서 최적의 공정조건을 결정에서 중요한 결정요인과 삼성분에서 최적의 공정조건을 알아보았다.

반도체 전공정의 하드마스크 스트립 검사시스템 개발 (Development of Hard Mask Strip Inspection System for Semiconductor Wafer Manufacturing Process)

  • 이종환;정성욱;김민제
    • 반도체디스플레이기술학회지
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    • 제19권3호
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    • pp.55-60
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    • 2020
  • The hard mask photo-resist strip inspection system for the semiconductor wafer manufacturing process inspects the position of the circuit pattern formed on the wafer by measuring the distance from the edge of the wafer to the strip processing area. After that, it is an inspection system that enables you to check the process status in real time. Process defects can be significantly reduced by applying a tester that has not been applied to the existing wafer strip process, edge etching process, and wafer ashing process. In addition, it is a technology for localizing semiconductor process inspection equipment that can analyze the outer diameter of the wafer and the state of pattern formation, which can secure process stability and improve wafer edge yield.