• Tribology and Lubricants
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• 제32권2호
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• pp.44-49
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• 2016

Diamond mechanical polishing (DMP) is a crucial process in a sapphire wafering process to improve flatness and achieve the target thickness by using free abrasives. In a DMP process, material removal rate (MRR) is a key factor to reduce process time and cost. Controlling mechanical parameters, such as velocity and pressure, can increase the MRR in a DMP process. However, there are limitations of using high velocities and pressures for achieving a high MRR owing to their side effects. In this paper, we present the lapping characteristics and improvement of MRR by using a fixed abrasive plate through an experimental study. The change in MRR as a function of velocity and pressure follows Preston's equation. The surface roughness of a wafer decreases as the plate velocity and pressure increases. We observe a sharp decrease in MRR over the lapping time at a high velocity and pressure in the velocity and pressure test. An analysis of surface roughness (Rq and Rpk) indicates that wear of abrasives decreases the MRR sharply. In order to investigate the effect of abrasive wear on the MRR, we utilize a cutting fluid and a rough wafer. The cutting fluid delays the wear of abrasives resulting in improvement of MRR drop. The rough wafer maintains the MRR at a stable rate by self-dressing.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.499-502
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• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal bar. Bonding mechanism between Cu and Ti was assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding was developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. Finite element analyses for extrusion of Cu-Ti bimetal bars were performed for various process conditions. The deformation history at the contact surface was traced and the proposed new bonding criterion was applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the extrusion of Cu-Ti bimetal bar is suggested.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 추계학술대회 논문집
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• pp.393-397
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• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion fur pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• 소성∙가공
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• 제13권8호
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• pp.723-730
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• 2004

This paper describes the analysis of extrusion process and integrity for a condenser tube which is a component of the heat exchanger in automobile and all conditioning apparatus. Recently, according to the development of analysis method using the computer, the numerical simulation have been applied to the 3-dimensional hot extrusion process with complex section area of the non-steady statement and then results of the analysis have been applied to optimal die design and process design. In this paper, firstly, the die design was performed for a condenser tube with a multi-hole section and the rigid-plasticity FE analysis performed of extrusion process. Secondly, we estimated metal flow of billet, extrusion load, welding pressure in chamber etc. and evaluated the pressure and elastic strain of the die land and mandrel tooth profile through a stress analysis of the die. Finally, the extrusion test was performed to estimate the validity of FE analysis. This paper confirmed that the designed extrusion die of the research is satisfactorily designed fur integrity of condenser tube.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 추계학술대회 논문집 전기물성,응용부문
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• pp.103-104
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• 2006

$Pb(Zr,Ti)O_3(PZT)$ is very attractive ferroelectric materials for ferroelectric random access memory (FeRAM) applications because of its high polarization ability and low process temperature. However, Chemical Mechanical Polishing (CMP) pressure and velocity must be carefully adjusted because FeRAM shrinks to high density devices. The contaminations such as slurry residues due to the absence of the exclusive cleaning chemicals are enough to influence on the degradation of PZT thin film capacitors. The surface characteristics of PZT thin film were investigated by the change of process parameters and the cleaning process. Both the low CMP pressure and the cleaning process must be employed, even if the removal rate and the yield were decreased, to reduce the fatigue of PZT thin film capacitors fabricated by damascene process. Like this, fatigue characteristics were partially controlled by the regulation of the CMP process parameters in PZT damascene process. And the exclusive cleaning chemicals for PZT thin films were developed in this work.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1989년도 한국자동제어학술회의논문집; Seoul, Korea; 27-28 Oct. 1989
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• pp.302-307
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• 1989

A pressure tracking control of hydroforming process is considered in this paper. To account for nonlinearities and uncertainties of the process, an iterative learning control scheme is proposed using Cerebellar Model Arithmatic Computer (CMAC). The experimental result shows that the proposed learning control is superior to any fixed gain controller in the sense that it enables the system to do the same work more effectively as the number of operation increases.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.794-795
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• 2006

Metal powder for dust core application was developed. The powder can be produced improved high-pressure water atomization process. The process has produced powder of spherical shape and lower coercivity. The dust core obta ined shows lower core loss.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2002년도 동계연구발표회 논문개요집
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• pp.232-233
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• 2002

Nanostructed high energy Nd-Fe-B based bulk magnet can be prepared by hot-working process (hot press and die-upset) from melt-spun amorphous or nanocrystalline powder.[1] Recently, we have investigated a modified method, current-applied pressure-assisted (CAPA) process, to produce nanocrystalline isotropic and anisotropic NdFeB magnets. The process consists of current-applied pressing the melt-spun powders to obtain isotropic precursor subsequent current-applied deforming the precursor to obtain textured magnet.[2-3] (omitted)

• 한국조리학회지
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• 제20권3호
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• pp.13-21
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• 2014

본 연구에서는 순환형 감압건조 및 초고압 추출공정을 이용하여 전통적인 기존 추출공정과 비교함으로써 복합 추출공정에 의한 감귤의 항산화 활성 증진을 확인하고자 연구를 수행하였다. 건조공정을 거친 후 초고압 처리 추출물의 수율이 20.41~28.19%로 높은 추출 수율을 나타내어 건조전 열수추출공정(17.21%)과 비교하여 약 1.6배의 높은 추출수율을 나타내었다. 순환형 감압건조와 초고압 공정을 병행하였을 시 총 폴리페놀과 플라보노이드 함량이 순환형 감압건조공정을 거치지 않은 것보다 다소 증가되는 것으로 보아 활성성분의 용출이 증진된 것으로 보인다. DPPH radical 소거 활성은 15분 초고압 처리한 추출물이 48.21%로 높은 활성을 나타내었다. 전처리 공정에 따른 감귤 시료의 주사전자현미경(SEM)을 통해 순환형 감압건조 후 초고압 추출이 감귤 내부 조직까지 영향을 주어 세포벽이 깨어지면서 조직 및 구조가 변화한 것으로 판단되며, 이를 통해 수율 및 활성 성분의 용출 증가가 이루어 진 것으로 사료된다. 따라서, 감귤의 건조 및 초고압 추출공정의 최적화를 통한 활성물질의 추출 극대화를 통해 추출수율을 향상시킬 것으로 판단된다.

• 전력전자학회:학술대회논문집
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• 전력전자학회 1998년도 전력전자학술대회 논문집
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• pp.328-331
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• 1998

Because of the powerful tolerance of overload, dynamic response and anti-erosion, Reluctive Pressure Transducer(RPT), as a measuring element of oil pressure equipment is applied to the measuring system of vessels, air craft. The Electrical reluctance appeared in the pressed diaphragm. To process the reluctance as a electric signal, bridge circuit is used. The design using the reluctance of pressure sensor is described in this paper. For the high efficiency of the sensitive RPT, pressure sensor structure is presented and electrical signal processing is simulated.