• 한국재료학회지
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• 제15권6호
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• pp.426-430
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• 2005

Chemical mechanical polishing (CMP) is an essential process in the production of integrated circuits containing copper interconnects. The effect of alanine in reactive slurries representative of those that might be used in copper CMP was studied with the aim of improving selectivity between copper(Cu) film and tantalum-nitride(TaN) film. We investigated the pH effect of nano-colloidal silica slurry containing alanine through the chemical mechanical polishing test for the 8(inch) blanket wafers as deposited Cu and TaN film, respectively. The copper and tantalum-nitride removal rate decreased with the increase of pH and reaches the neutral at pH 7, then, with the further increase of pH to alkaline, the removal rate rise to increase soddenly. It was found that alkaline slurry has a higher removal rate than acidic and neutral slurries for copper film, but the removal rate of tantalum-nitride does not change much. These tests indicated that alanine may improve the CMP process by controlling the selectivity between Cu and TaN film.

• Journal of the Korean Wood Science and Technology
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• 제41권5호
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• pp.456-465
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• 2013

Log cross sections of yellow poplar were dried in a radio frequency vacuum (RFV) dryer under alternating vacuum and release (AVR) process. The average moisture content (MC), temperature and vapor pressure at the volumetric center were monitored as functions of time. Three different log thicknesses (33, 60 and 75mm) were tested. The results show that the AVR process caused an increase in the drying rate when the moisture content was above fiber saturation point (FSP, about 30% MC) but that it had an inverse effect on the drying rate when the MC was below FSP. The effect of the AVR process on the drying rate decreased, and the severity of heart checks increased, with the increase in the thickness of the specimens.

• 대한지구과학교육학회지
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• 제2권1호
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• pp.48-54
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• 2009

This study aims to find out any effect of a POE model in the earth science unit of middle school(POE: prediction-observation-explanation). So this report compared and analyzed the effect that POE class and teacher-oriented class have on the level of learner science process skill and science academic achievement. Two groups, which were composed of 66 students and 64 students of middle school 2rd grade in Gyeongsangnamdo for this study, respectively, were selected as an experimental group and a comparative group. Through the pretest, the level of learner science process skill and science academic achievement were investigated. And learner science process skill and science academic achievement was verified with t-test. The findings of the study are as follows: First, as a result of analyzing the pre-test and the post-test for finding out the effect of class offering the POE model on learner science process skill, the class offering the POE model was shown effective for improving learner science process skill. However, the POE class was found significantly effective for improving the sub-factors of operationally defining, designing investigations, graphing and interpreting data, but not effective for identifying and stating hypothesis, identifying variables. Second, as a result of analyzing the pre-test and the post-test for finding out the effect of class offering the POE model on learner science academic achievement the class offering the POE model was shown effective for learner science academic achievement.

• 한국기계가공학회지
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• 제5권2호
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• pp.3-9
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• 2006

HSM(High-speed Machining) is widely used in rapid manufacturing of precision products and molds of various materials. Improvement in cutting efficiency is one of the important subjects in the HSM process. To analyse the dynamic behavior during a very short cutting time, the computational analysis code, LS-DYNA3D, was employed for the simulation of the mechanism of HSM for aluminium 7075. This cutting mechanism includes some difficult points in simulation, for example, material and geometrical non-linearity, high-speed dynamic impact, contact with friction, etc. In this paper, a finite element model considering the strain rate effect is proposed to predict the cutting phenomena such as chip deformation, strain and stress distributions, which will help us to design the HSM process.

• 환경위생공학
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• 제13권2호
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• pp.66-75
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• 1998

The computer simulation model was used to forecast the concentrations of COD$_{cr}$, NH$_{4}$$^{+}$-N and NO$_{3}$$^{-}$-N in each reactors. In the biological wastewater treatment system, the computer simulation model was used to observe the behavior of pollutants especially. In this research, effect of SRT, feeding pattern and recirculation rate on UCT(University of Cape Town) process was evaluated by computer simulation model. T-N removal was affected to the SRT. SRT for effective T-N removal was 15 days or longer. Feeding pattern in UCT process was affected to the T-N removal. Feeding pattern which 100% loading to the first reactor was most effective for T-N removal. The effect of recirculation rate was clear for T-N removal. The recirculation from anoxic reactor to anaerobic reactor was not need but the recirculation from oxic reactor to anoxic reactor was need. In aspect of nitrogen removal efficiency, A/O process was higher than UCT process.

• 한국물환경학회지
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• 제23권5호
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• pp.577-580
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• 2007

The influence of flow rate has been investigated on the treatment efficiency of continuous cycling electrolytic process employing artificial and actual photographic wastewater which containing silver ion. For artificial wastewater, the treatment efficiency of process was found to rise ca. three times when the flow rate of wastewater was increased from 3 mL/min to 15 mL/min. The process efficiency was doubled under the same condition regarding actual wastewater. The effect of flow rate on the treatment efficiency was observed to be altered according to the metal ionic form and solution composition. The coefficient of mass transfer was estimated using model equation, which verified that the raised treatment efficiency at higher flow rate was due to the increased mobility of ionic species.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2006년도 춘계학술대회 논문집
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• pp.43-47
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• 2006

Since the sheet metal forming of Mg alloy is performing at elevated temperature, the effect of process conditions related with the forming temperature is very important factor. Therefore, the investigation for process variables is necessary to design the tools and process conditions. In this study, the effects of process variables were studied by the experimental and FE analysis using the square cup deep drawing. The temperature, forming speed, and lubricant condition were investigated. When forming temperature was $250^{\circ}C$, speed forming was low, and teflon sheet was used as lubricant, the formed parts were good without defects.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.844-847
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• 2001

The application of laser direct etching has been discussed, and believed that the process is a very powerful method for micro machining. This study is focused on the micro patterning technology using laser direct etching process with no chemical damage of the material surface. A new introduced concept of energy synergy effect for surface micro machining is the combination of chemically ion reaction and laser thermal process. The etchant can't etch the material in room temperature, and used Ar laser has not power enough to machine. But, the machining is occurred in local area of the material by the combined energy. Using this process, the material is especially prevented from chemical damage for electric property. We have tested this new concept, and achieved a line with $1{mu}m$ width. The Ar laser with 488nm wavelength was used. The material was Si(100) wafer, and etchant is KOH solution. The application and flexibility of this process is in great hopes for MEMS structures and fabrication of the micro electric device parts.

• 산업기술연구
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• 제21권A호
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• pp.279-284
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• 2001

In this study, we analyzed the $NO_X$ removal effiency by the low temperature plasma process and investigated the effect of several process variables. Most of NO is converted into $NO_2$ and, later, into $HNO_3$ which reacts with $NH_3$ to form $NH_4NO_3$ particles. As the frequency of appling voltage increases, as the applied voltage increases or as the residential time increases, removal efficiency of the NO supplied initially increase. The removal efficiency of $NO_X$ also increases with the increase of $NH_3$ supplied.

• 한국공작기계학회논문집
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• 제18권2호
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• pp.144-153
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• 2009

It is widely known that no-slip assumptions are often violated on regular basis in micrometer- or nanometer-scale fluid flow. In the case of cavity-filling process of nanoimprint lithography(NIL), slip phenomena take place naturally at the solid-to-liquid boundaries, that is, at the mold-to-polymer or polymer-to-substrate boundaries. If the slip or partial slip phenomena are promoted at the boundaries, the processing time of NIL, especially of thermal-NIL which consumes more tact time than that of UV-NIL, can be significantly improved. In this paper it is aimed to elucidate how the cavity-filling process of NIL can be influenced by the slip phenomena at boundaries and to what degree those phenomena increase the process rate. To do so, computational fluid dynamics(CFD) analysis of cavity filling process has been carried out. Also, the effect of mold pattern shape and initial thickness of polymer resist were considered in the analysis, as well.