• Journal of the Korean Operations Research and Management Science Society
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• v.27 no.3
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• pp.93-114
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• 2002

This paper suggests a dynamic balanced scorecard (DBSC) model employing the concept of system dynamics (SD), which could overcome the limitations inherent in the conventional balanced scorecard (BSC) and facilitate strategic learning process in organizations. The BSC has been a successful framework for measuring an organization＇s performance in various Perspectives through translating an organization＇s vision and strategy into an interrelated set of key performance indicators and specific actions. The BSC, while having significant strengths over traditional performance measurement methods, however, has its own limitations, due to its static nature, such as overlooking two-way causation between performance Indicators and neglecting the impact of delayed feedback flowing from the adoption of new strategies or policy changes. To overcome these limitations, we employs SD, a methodology for understanding complex systems where dynamic feedback among the interrelated system components significantly impact on the system outcomes. The SD simulation model in the form of DBSC we suggest in this paper would serve as a useful strategic learning tool for facilitating an organization＇s communication process through various scenario analyses as well as predicting the dynamic behavior pattern of their key performance measures over a future time frame. For the demonstration purpose, we apply the DBSC model to Korea Coal Corporation (KoCoal ) BSC case.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator. removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistancy. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfact Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator, removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistency. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfect Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.2
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• pp.321-328
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• 2019

A military shelter for communication and information is necessary to optimize the integrated combat ability of weapon systems in the network centric warfare. Therefore, the military shelter is required for EMI shielding performance. This study examines the stable measurement points for EMI shielding effectiveness of a military shelter for communication and information. The measurement points were found by analyzing the EMI shielding effectiveness measurement data with data mining technique and process capability analysis. First, a support vector machine was used to separate the measurement point that has stable EMI shielding effectiveness according to set condition. Second, this process was conducted with process capability analysis. Finally, the results of data mining technique were compared with those of process capability analysis. As a result, 24 measurement points with stable EMI shielding effectiveness were found.

• Proceedings of the Korean Society for Quality Management Conference
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• 2006.04a
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• pp.334-337
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• 2006

This paper considers the problem of selecting the most profitable process mean for production processes where measurement errors exist in inspection systems. For such situations, a sequential inspection procedure is proposed to reduce measurement errors. The decision to accept, reject, or take an additional inspection of an item is made at every measurement point until the number of repeated measurements reaches its upper bound. An expected profit model is constructed and the optimal process mean, the cut-off values, and the upper bound of the number of repeated measurements are obtained when accepted(rejected) items are sold at regular(reduced) price. A numerical study is performed to investigate the performance of the proposed procedure.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.1897-1902
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• 2005

The objective of this paper is to estimate the concentration distribution in flow field inside the pipeline based on electrical impedance tomography. Special emphasis is given to the development of dynamic imaging technique for two-phase field undergoing a rapid transient change. Nonlinearity-compensation extended Kalman filter is employed to cope with unexpected measurement uncertainty. The nonlinearity-compensation extended Kalman filter compensates for the influence of measurement uncertainty and solves the instability of extended Kalman filter. Extensive computer simulations are carried out to show that nonlinearity-compensation extended Kalman filter has enhanced estimation performance especially in the unexpected measurement environment.

• International Journal of Railway
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• v.8 no.1
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• pp.1-4
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• 2015

An accurate measurement of the train-track interaction forces is important for track performance evaluation. In the field calibration test as a wheel load measurement process, the calibration system creates a different boundary condition in comparison with that in the train wheel passage. This study aims to evaluate a reliability of the field calibration test in the process of wheel load measurement. Finite element models were developed to compare the deformed shapes, bending moment and shear force profiles on the rail section. The analysis results revealed that the deformed shapes and their associated bending moment profiles on the rail are significantly different in two numerical simulations of the calibration test and the train wheel load passage. However, the shear stress profile on the rail section of the strain gauge installation in the field was almost identical, which may imply that the current calibration test is sufficiently reliable.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.8 no.3
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• pp.654-659
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• 2007

This study suggests a measure method for measuring variables that are used for hotel corporations' CRM performance. For this purpose, I present a combined method between factor analysis and AHP(Analytic Hierarchy Process) analysis. Factor analysis gives us a result that shows a group of highly correlated variables and another group of less correlated variables. Thus, factor analysis can only give information of factor categorization. Although researchers add ANOVA analysis or regression analysis, these efforts can not connect its results with factor analysis. Therefore, In hotel CRM performance analysis, calculation of each factor's importance is strongly required. For that reason, I suggest a method that combines AHP analysis with factor analysis for Hotel CRM performance measurement.

• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.8-13
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• 2023

High bandwidth memory a core technology of the future memory semiconductor industry, is attracting attention. Temporary bonding and debonding process technology, which plays an important role in high bandwidth memory process technology, is also being studied. In this process, total thickness variation is a major factor determining wafer performance. In this study, the reliability of the equipment measuring total thickness variation is identified, and the servo motor settling, and wafer total thickness variation measurement accuracy are analyzed. As for the experimental variables, vacuum, acceleration time, and speed are changed to find the most efficient value by comparing the stabilization time. The smaller the vacuum and the larger the radius, the longer the settling time. If the radius is small, high-speed rotation performance is good, and if the radius is large, low-speed rotation performance is good. In the future, we plan to conduct an experiment to measure the entire of the wafer.

• Journal of Institute of Control, Robotics and Systems
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• v.10 no.2
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• pp.171-177
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• 2004

Many instrumentations have been used to acquire the performance data of military systems fer many years. But they could not satisfy environmental specifications(vibration, shock, temperature) and processing speed to apply for the performance test of military systems because of having developed as common vehicles/fixed installation equipments. Thus a new rugged embedded measurement system is required to process large data in high processing speed(Maximum sample rate:1.25Mhz/ch) with rugged environmental specifications. We have developed embedded measurement systems by using PXI(PCI extension for Instrumentation)bus interface composed of a stand alone controller and versatile data acquisition boards(analog, digital, vision, temperature and small signal conditioner) on PC-based environment to solve these problems. Operation programs have been developed using Lab_View and the performances have been validated experimentally.