• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.316-316
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• 2012

본 연구에서는 Si wafer에 마스크 공정 및 Slit-etching 공정을 적용하여 25 um 피치의 probe unit을 개발하기 위해 Deep Si Etching 장비를 이용하여 식각공정 조건에 따른 특성을 평가하였다. 25 um pitch는 etch 폭의 크기에 따라 3종류로 설계하였으며, 식각공정은 2수준, 4인자 실험계획법에 의해 8회 실험을 수행하였다. 실험계획법에 의해 미니탭을 활용하여 최적조건을 구한 결과 12.5 um etch 폭에서는 가스유량은 200 sccm, 에칭시간 7 sec, 코일 파워 1500W, 에칭 압력은 43.7 mtorr의 조건이 etch 형태 및 profile angle이 목표치에 근접한 결과를 얻었다. 또한 probe pitch를 30~60 um까지 증가시켰을 경우 Etch depth는 증가하였으며, 식각율 또한 증가한 현상을 보였다. 재현성 실험을 위해 위의 최적조건을 이용하여 2회 반복하여 실험한 경우 모든 시편이 목표치에 도달하였다. 이는 미세피치화 되는 프로브 유닛의 기초데이터로 활용될 수 있다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.1
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• pp.29-35
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• 2020

Car inspection systems are regularly carried out by the state to ensure the safety and emission status of cars, thereby improving the safety and quality of life by reducing fine dust and greenhouse gases that are the main culprits of vehicle defects and air pollution. These automobile inspections are largely divided into either regular or comprehensive inspections. This study analyzed the smoke measuring probes used in the lug - down 3 mode. In the previously issued paper "Improvement of Soot Probe Efficiency for Automotive Emission Measurement," an improved smoke measurement probe(B) improved on the problems that arise from the current smoke measurement probe (A). In this study, a technique that can improve the probe's inhalation efficiency over the improved (B) probes was applied to probes (C). Probe (C) involves a structure designed close to the center of the circumference of the exhaust pipe, and the suction efficiency was improved by adding a variable center unit.

• Journal of Biosystems Engineering
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• v.22 no.1
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• pp.59-67
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• 1997

An experimental apparatus was developed for the rapid determination of thermal conductivity by transient probe method. The theoretical basis for transient probe method has been investigated. The mathematical model for this method is the Carslaw and Jaeger model which is used perfect line source theory. The small needle probe which is equipped with thermocouple and heating element is constructed. A software that performs data analysis and acquisition is programmed. The influence of the power dissipated per unit length of the probe has been assessed for glycerin. The result showed no significant correlation between thermal conductivity and power input. Determination made with this experimental apparatus were found to agree well with the recommended thermal conductivity data.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.152-152
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• 2008

Micro probe with Ni-Co tip was designed. Unit processes for fabricating the micro probe were developed. We are investigated the micro probe tip using by Ni-Co alloy. One-step and three-step needle was fabricated by plating process, CMP, and photolithography process. The plating thickness was varied by current density and time. Futher data will be extract by different process conditions.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.296-296
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• 2012

LCD panel 검사를 위한 Probe unit은 대형 TV 및 모바일용 스마트폰을 중심으로 각광을 받고 있는 소모성 부품으로 최근 pitch의 미세패턴화가 급속히 진행되고 있다. 본 연구에서는 Slit Wafer 제작 공정을 최적화하기 위해 25 um pitch의 마스크를 설계, 제작하였다. 단공과 장공을 staggered 형태로 배열하여 25 um/25 um line/space pitch로 설계하였다. 또한 단위실험을 위해 직접 25 um pitch로 설계하여, 동일한 실험조건을 적용하여 최적 조건을 찾고자 하였다. 반응변수는 Etch rate 및 profile angle로 결정하였으며, 약 200~400 um 에칭된 slit의 상단과 하단의 폭, 그리고 식각깊이를 SEM 측정사진을 통해 정한 후 etch rate 및 profile angle을 결정하였다. 인자는 식각속도 및 wall의 각도를 결정하는 식각 및 passivation 가스의 유량, chamber 압력(etching/passivation), 식각시간 등으로 정하였으며, 이들의 최대값과 최소값 2 수준으로 실험계획을 설계하였다. 식각 조건에 따라 8회의 실험을 수행하였다. 가스의 유량은 SF6 400 sccm, C4F8 400 sccm, 식각 싸이클 시간은 5.2~10.4 sec, passivation 싸이클시간 4 sec로 하였으며, 압력은 식각시 7.5 Pa, passivation 시 10 Pa로 할 경우가 가장 sharp하게 나타났다. Coil power 와 platen power는 각각 2.6 KW, 0.14 KW로 하였으며, 최적화를 위한 인자의 값들은 이 범위에서 조절하였다. 이러한 인자의 조건 조절을 통해 etch rate는 5.6 um/min~6.4 um/min, $88.9{\sim}89.1^{\circ}$의 profile angle을 얻을 수 있었다.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.10a
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• pp.449-453
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• 2000

In metal cutting, the machining accuracy is more affected by thermal errors than by geometric errors. This paper models of the thermal errors for error analysis and develops on-the-machine measurement system by which the volumetric error are measured and compensated. The thermal error is modeled by means of angularity errors of a column and thermal drift error of the spindle unit which are measured by the touch probe unit with a star type styluses, a designed spherical ball artifact, and five gap sensors. In order to analyze the thermal characteristics under several operating conditions, experiments performed with the touch probe unit and five gap sensors on the vertical and horizontal machining centers.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.7
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• pp.25-32
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• 2021

In the previous study, a study was conducted to improve the exhaust gas intake efficiency by improving the existing soot measurement probe in the shape and angle of the exhaust port. As a result, it can be seen that the smoke measurement performance according to the shape and angle is improved. In previous studies, the performance of the soot probe was not confirmed for the Korean KD 147 mode, which has a low suction flow rate and a long inspection time. So, we would like to confirm the improvement of the smoke probe performance of the Korean KD 147 mode, which is close to the actual driving conditions. The probe used in this study is another type of probe, and has a circular ring shape instead of a rib and variable center position unit, so the probe center hole is located close to the center of the exhaust pipe.

• International Journal of Precision Engineering and Manufacturing
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• v.9 no.3
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• pp.27-32
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• 2008

This paper describes a contact atomic force microscope (AFM) that can be used for high-speed precision measurements of microstructured surfaces. The AFM is composed of an air-bearing X stage, an air-bearing spindle with the axis of rotation in the Z direction, and an AFM probe unit. The traversing distance and maximum speed of the X stage are 300 mm and 400 mm/s, respectively. The spindle has the ability to hold a sample in a vacuum chuck with a maximum diameter of 130 mm and has a maximum rotation speed of 300 rpm. The bandwidth of the AFM probe unit in an open loop control circuit is more than 40 kHz. To achieve precision measurements of microstructured surfaces with slopes, a scanning strategy combining constant height measurements with a slope compensation technique is proposed. In this scanning strategy, the Z direction PZT actuator of the AFM probe unit is employed to compensate for the slope of the sample surface while the microstructures are scanned by the AFM probe at a constant height. The precision of such a scanning strategy is demonstrated by obtaining profile measurements of a microstructure surface at a series of scanning speeds ranging from 0.1 to 20.0 mm/s.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.4
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• pp.1210-1215
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• 2010

The probe card are test modules which are to classify the good semiconductor chips and thin film before the packaging process. In the rapid growth a technology of semiconductor, the number of pads per unit area is increasing and pad arrays are becoming irregular. Therefore, the technology of probe card needs narrow width and lots of probe tip. In this paper, the probe tip based on the MEMS(Micro Electro Mechanical System)technology was developed a new MEMS probe tip for vertical probe card applications. For the structural designs of probe tip were performed to mechanical characteristics and structural analysis using FEM(Finite Element Method). Also, the contact force of MEMS probe tip compared with FEM results and experimental results. Finally, the MEMS probe card was developed a fine pitch smaller than $50{\mu}m$.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.73-77
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• 2017

Recently, fingerprint sensors have widely used for personal information security, and require quality evaluation to reduce an error of their recognition rate. Quality of fingerprint sensors is evaluated by variation of their electrical resistance introducing by contacts between a probe tip and a sensor electrode, Investigation on the materials compatability and structure optimization of probe is required to reduce deformation of sensor electrode for repeatability of quality testing. Nickel, steel(SK4), beryllium copper, and phosphor bronze were considered as probe materials, and beryllium copper was the most appropriate for materials of probe tips, considering indentation and contact resistance while being contacted probe tips on electrodes. Probes of an inspection part were manufactured with the single-unit structure for physical damage prevention and parallel processing capability. Inspection repeatability was evaluated by voltage variation of fingerprint sensors when the specific current was applied. A single-unit inspection part with beryllium copper probe tips showed excellent repeatability within ${\pm}0.003V$ of its voltage variation.