• Journal of the Korean Society of Manufacturing Process Engineers
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• v.2 no.2
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• pp.14-21
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• 2003

Rapid prototyping(RP) has been used for design verification and proto sample or mold manufacturing. Many RP systems have been introduced into the market during the past 15 years. However, until now, the systems have used mainly for external physical models (mono function), and have the basic but critical limitation of one material on one stage (mono material). To overcome the limitations of mono-material and mono-function of conventional. RP systems, the concept of Functional Phototype Development (FPD) is newly proposed in this paper FPD provides the necessary prototype functions such as mechanical, optical, chemical and electrical properties in order to meet the broad requirements of the industry. The paper illustrates the representative achievements of electronic components such as the multi-layer printed circuit board(MLB). Experimental results demonstrate that FPD has great potential applied to broad industrial uses and that It Will be a powerful tool in the neat future.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.73-78
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• 2016

An increase in the transistor density of integrated circuit devices leads to a very high increase in heat dissipation density, which causes a long-term reliability and various thermal problems in microelectronics. In this study, liquid cooling method was investigated using straight microchannels with various metal bumps. Microchannels were fabricated on Si wafer using deep reactive ion etching (DRIE), and Ag, Cu, or Cr/Au/Cu metal bumps were placed on Si wafer by a screen printing method. The surface temperature of liquid cooling structures with various metal bumps was measured by infrared (IR) microscopy. For liquid cooling with Cr/Au/Cu bumps, the surface temperature difference before and after liquid cooling was $45.2^{\circ}C$ and the power density drop was $2.8W/cm^2$ at $200^{\circ}C$ heating temperature.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.54-54
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• 2009

Ag thick film has been used for electrode materials with the excellent conductivity. Ag electrode is used in screen-printed silicon solar cells as a electrode material. Compared to photolithography and buried-contact technology, screen-printing technology has the merit of fabricating low-priced cells and enormous cells in a few hours. Ag paste consists of Ag powders, vehicles and additives such as frits, metal powders (Pb, Bi, Zn). Frits accelerate the sintering of Ag powders and induce the connection between Ag electrode and Si wafer. Thermophysical properties of frits and reactions among Ag, frits and Si influence on cell performance. In this study, Ag pastes were fabricated with adding different kinds of frits. After Ag pastes were printed on silicon wafer by screen-printing technology, the cells were fired using a belt furnace. The cell parameters were measured by light I-V to determine the short-circuit current, open-circuit voltage, FF and cell efficiency. In order to study the relationship between the reactivity of Ag, frit, Si and the electrical properties of cells, the reaction of frits and Si wafer on was studied with thermal properties of frits. The interface structure between Ag electrode and Si wafer were also measured for understanding the reactivity of Ag, frit and Si wafer. The excessive reactivity of Ag, frit and Si wafer certainly degraded the electrical properties of cells. These preliminary studies suggest that reactions among Ag, frits and Si wafer should optimally be controlled for cell performances.

• Journal of the Korean Ceramic Society
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• v.51 no.4
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• pp.362-366
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• 2014

Dye-sensitized solar cells (DSSCs) were synthesized using a $0.25cm^2$ area of a $TiO_2$ nanoparticle layer as the electrode and platinum (Pt) as the counter electrode. The $TiO_2$ nanoparticle layers (12 to 22 ${\mu}m$) were screen-printed on fluorine-doped tin oxide glass. Glancing angle X-ray diffraction results indicated that the $TiO_2$ layer is composed of pure anatase with no traces of rutile $TiO_2$. The Pt counter electrode and the ruthenium dye anchored $TiO_2$ electrode were then assembled. The best photovoltaic performance of DSSC, which consists of a $18{\mu}m$ thick $TiO_2$ nanoparticle layer, was observed at a short circuit current density ($J_{sc}$) of $14.68mA{\cdot}cm^{-2}$, an open circuit voltage ($V_{oc}$) of 0.72V, a fill factor (FF) of 63.0%, and an energy conversion efficiency (${\eta}$) of 6.65%. It can be concluded that the electrode thickness is attributed to the energy conversion efficiency of DSSCs.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.05a
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• pp.788-791
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• 2010

We design 64-bit ROM IP for RFID tag chips using printed CMOS non-volatile memory IP design technology for a printed CMOS process. The proposed 64-bit ROM circuit is using ETRI's $0.8{\mu}m$ CMOS porocess, and is expected to reduce process complexity and cost of RFID tag chips compared to that using a conventional silicon fabrication based on a complex lithography process because the poly layer in a gate terminal is using printing technology of imprint process. And a BL precharge circuit and a BL sense amplifier is not required for the designed cell circuit since it is composed of a transmission gate instead of an NMOS transistor of the conventional ROM circuit. Therefore an output datum is only driven by a DOUT buffer circuit. The Operation current and layout area of the designed ROM of 64 bits with an array of 8 rows and 8 columns using $0.8{\mu}m$ ROM process is $9.86{\mu}A$ and $379.6{\times}418.7{\mu}m^2$.

• Particle and aerosol research
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• v.6 no.3
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• pp.131-138
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• 2010

Flexible electronics are the electronics on flexible substrates such as a plastic, fabric or paper, so that they can be folded or attached on any curved surfaces. They are currently recognized as one of the most innovating future technologies especially in the area of portable electronics. The conventional vacuum deposition and photolithographic patterning methods are well developed for inorganic microelectronics. However, flexible polymer substrates are generally chemically incompatible with resists, etchants and developers and high temperature processes used in conventional integrated circuit processing. Additionally, conventional processes are time consuming, very expensive and not environmentally friendly. Therefore, there are strong needs for new materials and a novel processing scheme to realize flexible electronics. This paper introduces current research trends for flexible electronics based on (a) nanoparticles, and (b) novel processing schemes: nanomaterial based direct patterning methods to remove any conventional vacuum deposition and photolithography processes. Among the several unique nanomaterial characteristics, dramatic melting temperature depression (Tm, 3nm particle~$150^{\circ}C$) and strong light absorption can be exploited to reduce the processing temperature and to enhance the resolution. This opens a possibility of developing a cost effective, low temperature, high resolution and environmentally friendly approach in the high performance flexible electronics fabrication area.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.6
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• pp.583-588
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• 2015

Flexible tactile sensors can provide valuable feedback to intelligent robots regarding the environment around them. This is especially important when robots such as, service robots share a workspace with humans. This paper presents a contact force measurement algorithm of a flexible tactile sensor. This sensor is manufactured by a direct-writing technique, which is one 3D printing method, using multi-walled carbon nano-tubes. An analog signal processing circuit has been designed and implemented to reduce noise contained in the sensor output. In addition, a digital version of the Butterworth filter was implemented by software running on a microcontroller. Through various experiments, characteristics of the sensor system have been identified. Based on three traits, an algorithm to detect the contact and measure the contact force has been developed. The entire system showed a promising prospect to detect the contact over a large and curved area.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.10
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• pp.1529-1535
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• 2010

For the reliable use of inkjet technology as patterning tools, the jetting of the inkjet dispenser needs to be monitored for real-time detection of any malfunction. We present a self-sensing circuit that can be used to detect jetting failure by measuring electrical signals only. In addition, practical problems involved in the monitoring of inkjets in multinozzle printheads are discussed. In the study, software was developed and presented to demonstrate the feasibility of the proposed method for detecting inkjet jetting failure in a printing system.

• 유체기계공업학회:학술대회논문집
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• 2006.08a
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• pp.505-508
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• 2006

An electrostatic ink jet head can be used for manufacturing processes of large display systems and printed circuit boards (PCB) as well as inkjet printers because an electrostatic field provides an external force which can be manipulated to control sizes of droplets. The existing printing methods such as thermal bubble and piezo inkjet heads have shown difficulties to control the ejection of the droplets for printing applications. Thus, the new inkjet head using the electrostatic force has been proposed in this study. In order to prove the theory of the developed electrostatic ink jet head, the applicable and basic theory has been studied using distilled water and water with sodium dodecyl surfate (SDS). Also, a numerical analysis has been performed to calculate the intensity of the electrostatic field using the Maxwell's equation. Furthermore, experiments have been carried out using a downward glass capillary with outside diameter of $500{\mu}m$. The gravity, surface tension, and electrostatic force have been analyzed with high voltages of 0 to 5kV. It has been observed that the droplet size decreases and the frequency of the droplet formation and the velocity of the droplet ejection increase with increasing the intensity of the electrostatic field. The results of the experiments have shown good agreement with those of numerical analysis.

• 한국가시화정보학회:학술대회논문집
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• 2007.11a
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• pp.128-133
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• 2007

An electrostatic inkjet head can be used for manufacturing processes of large display systems and printed circuit boards (PCB) as well as inkjet printers because an electrostatic field provides an external force which can be manipulated to control sizes of droplets. The existing printing methods such as thermal bubble and piezo inkjet heads have shown difficulties to control the ejection of the droplets for printing applications. Thus, the new inkjet head has been proposed using the electrostatic force. A numerical analysis has been performed to calculate the intensity of the electrostatic field using the Maxwell's equation. Also, experiments have been carried out to investigate the droplet movement using a downward capillary with outside diameter of $500{\mu}m$. Gravity, surface tension, and electrostatic force have been analyzed with high voltages for a drop-on-demand ejection. It has been observed that the droplet size decreases and the frequency of the droplet formation and the velocity of the droplet ejection increase with increasing the intensity of the electrostatic field using high-speed camera.