• Journal of the Korean Society for Precision Engineering
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• v.31 no.12
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• pp.1061-1066
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• 2014

Generally electrical circuits are fabricated as PCB(Printed Circuit Board) and mounted on a casing of the product. And it requires lots of other parts and some labor for assembly. Recently a molding technology is increasingly applied to embed simple circuits on a plastic casing. The technology is called as MID(Molded Interconnected Device). Therefore this paper introduces a new MID fabrication process by using direct 3D printing technology.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.446-450
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• 2007

It is strongly expected that inkjet printing method will be play and important role on printable electronics such as 3D integration of embedded ceramic devices(capacitor, resistor, inductor and electrode or circuit), Si-TFT and organic TFT including display C/F, RFID, FPCB, and etc. A inkjet printing method had been center of attention to strengthen the competitiveness of flat panel display on market and to open the new world of manufacturing process of printable electronics. We will survey the industrial tendency of printable electronics and flat panel display including some examples of inkjet printing and present the considerable points of inkjet printing method and some role of materials for successful inkjet printing.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.65 no.2
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• pp.142-150
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• 2016

This paper developed new manufacture process technology of slim type flexible flat lighting product used lower power white LED. Flexible flat lighting is applied to letter sign lighting, traffic lighting, interior wall lighting, flat lighting, aquarium back lighting, wreath light etc. Main manufacture process technology were developed drawing software for electronics circuit, inkjet electronic circuit pattern and inkjet white ink coating. For pattern printing it was utilized for piezoelectonic inkjet head printing technology. Also high vacuum pressure laminating technology was waterproofing for LED flat lighting protection. Hence, form process technology we were manufactured for flexible flat lighting product of the power 12 W, input voltage 48 V and plane size $480{\times}480mm$. It acquired a these validity from experiment results.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.12.1-12.1
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• 2009

For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

• Journal of Electrical Engineering and Technology
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• v.8 no.3
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• pp.603-609
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• 2013

In this paper, we describe the analysis of inkjet-printed silver (Ag) patterns on epoxy-coated substrates according to several reliability evaluation test method guidelines for conventional printed circuit boards (PCB). To prepare patterns for the reliability analysis, various regular test patterns were created by Ag inkjet printing on flame retardant 4 (FR4) and polyimide (PI) substrates coated with epoxy for each test method. We coated the substrates with an epoxy primer layer to control the surface energy during printing of the patterns. The contact angle of the ink to the coated epoxy primer was $69^{\circ}$, and its surface energy was 18.6 $mJ/m^2$. Also, the substrate temperature was set at $70^{\circ}C$. We were able to obtain continuous line patterns by inkjet printing with a droplet spacing of $60{\mu}m$. The reliability evaluation tests included the dielectric withstanding voltage, adhesive strength, thermal shock, pressure cooker, bending, uniformity of line-width and spacing, and high-frequency transmission loss tests.

• Proceedings of the Korean Printing Society Conference
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• 2007.11a
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• pp.59-64
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• 2007

We have manufactured low-curable silver pastes for gravure printing out of roll to roll printing process. When printing, the pastes be used different silver powder shape because of the printing characteristics. The pastes were prepared with silver powder by silver powder shape, polyester resin, solvent and homogenized on a standard three-roller mill. And the pastes exhibited a shear-thinning flow at viscosity profile. Moreover the adhesive strength and resistivity of silver film had good characteristics. With the manufactured paste in this study, RFID antenna circuit had flexible is manufactured and it had $10^{-4}{\sim}10^{-5}{\Omega}{\cdot}cm$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.108-108
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• 2007

Inkjet printing is a non-contact and direct writing associated with a computer. In the industrial field, there have been many efforts to utilize the inkjet printing as a new way of manufacturing, especially for electronic devices. The etching resist used in this process is an organic polymer which becomes solidified when exposed to ultraviolet lights and has high viscosity of 300 cPs at ambient temperature. A piezoelectric-driven ink jet printhead is used to dispense $20-40\;{\mu}m$ diameter droplets onto the copper substrate to prevent subsequent etching. In this study, factors affecting the pattern formation such as printing resolution, jetting property, adhesion strength, etching and strip mechanism, UV pinning energy have been investigated. As a result, microscale Etch resist patterning of printed circuit board with tens of ${\mu}m$ high have been fabricated.

• Proceedings of the KIPE Conference
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• 2003.07a
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• pp.110-114
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• 2003

In this paper, a new self-oscillated type high voltage charger controller circuit is proposed, which has variable constant current source characteristics to improve charge characteristic of charger roller. The proposed control method enables high quality printing characteristics regardless of the circumstance change such as ambient temperature or humidity by changing the current reference signal. To verify the proposed control method various experiments are performed.

• International Journal of Precision Engineering and Manufacturing
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• v.9 no.2
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• pp.50-53
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• 2008

A design approach using a one-dimensional (1D) lumped model was studied and applied to an industrial inkjet printing head design for micro patterning on printed circuit boards. For an accurate analysis, a three-dimensional piezoelectric-driven actuator model was analyzed and its jetting characteristics were applied to 1Danalysis model. The performance of the 1D lumped model was verified by comparing measured and simulated results. The developed 1D model helped to optimize the design and configuration of the inkjet head and could be implemented in the design of multi-nozzle inkjet printing heads to improve the jetting frequency and minimize crosstalk.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.31 no.12
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• pp.1017-1023
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• 2007

This study is intended to analyze the effect of thin ink-film thickness around rotating printing roll on the printing quality in the gravure printing process which is used for making electronics circuit like a RFID tag with a conductive ink. The present work numerically estimates the film thickness around rotating roller partially immersed in ink for which the volume of fluid (VOF) method was adopted to figure out the film formation process around rotating roller. Parameter studies were performed to compare the effect of ink properties (viscosity, surface tension), operating condition (roller rotating speed, initial immersed angle) on the film thickness. The result indicates that the film thickness has a strong dependency on the rotating speed, while the surface tension has negligible effect.