• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.721-724
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• 2001

In this paper, we present the effect the length the MSL(Microstrip Line) on the oscillation characteristic of the fabricated VCOs(Voltage Controlled Oscillator) designed and analyzed by RF circuit simulator Serenade(ANSOFT Co.) and fabricated by screen printing method on the alumina substrate. We have fabricated VCOs with 3 different MSL length and each MSL length of the VCO is 140mi1, 280mil and 560mi1. The oscillation frequency of each sample(VCO) was tuned to UHF band(750MHz∼900MHz) varying the capacitance. The experimental result shows the phase noise -82∼-97[dBc/Hz] at a 50 [kHz] offset frequency, the pushing figure 94∼318[kHz] at 3${\pm}$0.15[V] and the harmonics 13∼21 [dBc] between MSL length 140mi1s and 560mi1. The frequency and output variation width are 779∼898[MHz], -36∼-33[dBm] at MSL length 140mi1; 818∼836[MHz], -27.19∼-27.06[dBm] at 280mi1;751.54∼751.198[MHz],-33.44∼ -33.31[dBm] at 560mi1. we examined 3 VCOs oscillation characteristic difference through comparison with phase noise, oscillation power and frequency by control voltage change, harmonics and pushing figure for each sample.

• 마이크로전자및패키징학회지
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• 제8권2호
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• pp.37-42
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• 2001

The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.150-155
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• 2006

Carbon nanotubes backlight unit (CNT-BLU) that lightened by field emission was developed into practicability. According to our novel structure, AC mode circuit design and simple printing process, CNT-BLU could achieve 85% of uniformity, 8000 nits of brightness and low material and fabrication cost. Based on these performances, this new planar backlight technology has chances to proceed to mass production and has the potential to replace traditional backlight technology because of its good properties, like the simple processes, easy to large scale, low surface temperature, low power consumption, optical film-free and Hg-free, etc.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 D
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• pp.1379-1381
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• 1998

Powder electroluminescent device (PELD) structured conventionally dielectric and phosphor layer, between electrode and their layer fabricated by screen printing splaying or spin coating method. To promote performance of PELDs, we approached the experiments for different structure and thickness variation of PELD. Thickness variation($30{\mu}m{\sim}130{\mu}m$) was taken. To investigate electrical and optical properties of PELDs, EL spectrum, transferred charge density using Sawyer-Tower's circuit brightness was measured. Variation of structure in PELDs was as follows: WK-1 (ITO/BaTiO3/ZnS:Cu/Silver paste), WK-2 (ITO/BaTiO3/ZnS:Cu/BaTiO3/ZnS:Silver paste), WK-3 (ITO/BaTiO3/ZnS:Cu/BaTiO3/Silver paste), WK-4(ITO/BaTiO3+ZnS:Cu/Silver paste) As a result, structure of the highest brightness appeared WK-4 possessed 60 ${\mu}m$ thickness. The brightness was 2719 cd/$m^2$ at 100V, 400Hz.

• 한국기계가공학회지
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• 제19권8호
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• pp.73-80
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• 2020

The 3D printing of electronics has been a major application topics in additive manufacturing technology for a decade. In this paper, wireless power transfer (WPT) technology for 3D electronics is studied to supply electric power to its inner circuit. The principle of WPT is that electric power is induced at the recipient antenna coil under an alternating magnetic field. Importantly, the efficiency of WPT does rely on the design of the antenna coil shape. In 3D printed electronics, a flat antenna that can be placed on the printed plane within a layer of a 3D printed part is used, but provided a different antenna response compared to that of a conventional PCB antenna for NFC. This paper investigates the WPT response characteristics of a WPT antenna for 3D printed electronics associated with changes in its design elements. The effects of changing the antenna curvature and the gap between the wires were analyzed through experimental tests.

• Current Photovoltaic Research
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• 제2권3호
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• pp.130-134
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• 2014

We have fabricated the selective emitter solar cell using double textured nanowires structure. The $40{\times}40mm2$-sized silicon substrates were textured to form the pyramid-shaped surface and the nanowires were fabricated by metal assisted chemical etching process using Ag nanoparticles, subsequently. The heavily doped and shallow emitters for selectiv eemitter solar cells were prepared through the thermal $POCl_3$ diffusion and chemical etch-back process, respectively. The front and rear electrodes were prepared following conventional screen printing method and the widths of fingers have been optimized. The selective emitter solar cell using double textured nanowires structure achieved a conversion efficiency of 17.9% with improved absorption and short circuit current density.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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• pp.27-34
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• 2001

The BGA Package has been the area array package of choice for several rears. Recently, the transition has been to finer pitch configuration called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch, requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and piece equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• 대한기계학회논문집B
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• 제31권2호
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• pp.141-150
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• 2007

This paper presents a lumped model to predict crosstalk characteristics of thermally driven inkjet print heads. Using the lumped R-C model, heating characteristics of the head are predicted to be in agreement with IR temperature measurements. The inter-channel crosstalk is simulated using the lumped R-L network. The values of viscous flow resistance, R and flow inertance, L of connecting channels are adjusted to accord with the 3-D numerical simulation results of three adjacent jets. The crosstalk behaviors of a back shooter head as well as a top shooter head have been investigated. Predictions of the proposed lumped model on the meniscus oscillations are consistent with numerical simulation results. Comparison of the lumped model with experimental results identifies that abnormal two-drop ejection phenomena are related to the increased meniscus oscillations because of the more severe crosstalk effects at higher printing speeds. The degree of crosstalk has been quantified using cross-correlations between neighboring channels and a critical channel dimension for acceptable crosstalk has been proposed and validated with the numerical simulations. Our model can be used as a design tool for a better design of thermal inkjet print heads to minimize crosstalk effects.

• 한국군사과학기술학회지
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• 제19권3호
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• pp.294-301
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• 2016

In this paper, we designed the transparent circuit analog radar absorbing structure using printed metal grid mesh for enhanced optical transmittance. To obtain wideband electromagnetic absorption and enhanced optical transparency at X-band, we proposed the resistive FSS(Frequency Selective Surface) using printed metal mesh pattern on transparent glass with PEC(Perfect Electric Conductor) plane using ITO(Indium Thin Oxide) coating. We then fabricated the proposed structure to verify the simulation results obtained from commercial EM simulator. The comparisons between the simulation and measured results show good agreements. The results also show that the proposed radar absorbing structure can provide wideband reflection as well as better optical transparency. We can apply this proposed structure to the canopy of stealth aircraft and other stealth and security applications for visible transparency.

• Design & Manufacturing
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• 제13권3호
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• pp.1-11
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• 2019

Recently, studies on the development of flexible electronic devices by combining flexible materials and a conductor have been actively performed as interest in wearable devices. Especially, carbon nanotubes (CNT) or graphene coating have been used to construct a circuit to induce improvement in flexibility and rigidity. Various technologies have been developed in the surface coating of conductive materials, which are key to the manufacture of flexible electronic devices. Surface coating products with 3D coating and micro-patterns have been proposed through electrospinning, electrification, and 3D printing technologies. As a result of this advanced surface coating technology, there is a growing interest in manufacturing gradient conductive surfaces. Gradient surfaces have the advantage that they are adapted to apply a gentle change or to inspect optimum conditions in a particular region by imparting continuously changing properties. In this study, we propose a manufacturing technique to produce a continuous gradient conductive surface by combining a partial stretching of elastomer and a conductive material coating, and introduce experimental results to confirm its performance.