• 한국재료학회:학술대회논문집
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• 한국재료학회 2012년도 춘계학술발표대회
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• pp.63.1-63.1
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• 2012

In recent years, the functional inks for printed electronics that can be combined with a variety of printing techniques have attracted increasingly significant interest for use in low cost, large area, high performance integrated electronics and microelectronics. In particular, the development of solution-processable conductor, semiconductor and insulator materials is of great importance as such materials have decisive impacts on the electrical performance of various electronic devices, and, therefore, need to meet various requirements including solution processability, high electrical performance, and environmental stability. Semiconductor inks such as IGO, CIGS are synthesized by chemical solution method and microwave reaction method for TFT and solar cell application. Fine circuit pattern with high conductivity, which is valuable for flexible electrode for PCB and TSP devices, can be printed with highly concentrated and stabilized conductor inks such as silver and copper. Solution processed insulator such as polyimide derivatives can be use to all printed TFT device. Our research results of functional inks for printed electronics provide a recent trends and issues on this area.

• 반도체디스플레이기술학회지
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• 제13권4호
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• pp.33-36
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• 2014

In this paper, a carbon strain gauge for large strain was developed. The carbon strain gauge was fabricated by forming PCB and antenna pattern using Cu/Ni/Au film and carbon resistor pattern using screen printing process on plastic film substrate. It was possible to develop low-cost disposable strain gauge since the carbon paste was cheap and the fabrication process was simple. The wireless communication type carbon strain gauge was fabricated by integrating signal processing circuit, antenna and power all together on the same substrate as a strain gauge. The wireless communication type carbon strain gauge has a merit of being available immediately at the spot without any particular system.

• 한국인쇄학회지
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• 제18권2호
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• pp.13-27
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• 2000

The UV curing industry is one of the most wide application fields in the coating and printing inks industry. Applications extend to general coating for paper, board, wood tapes, compact discs and holograms, ink, photoresists for imaging processes and adhesives for welding and sealing in circuit boards. The UV-curing resins have advantages of quick set, space saving, clean environment and efficient use of energy. The purpose of this study has been to control of morphology structures consist of UV-curing resins and alkyd resins. Therefore, we are investigated with regard to rheology properties on the exposure to UV-curing, structures and mechanical properties for curing films.

• 한국산업융합학회 논문집
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• 제12권4호
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• 한국전자파학회논문지
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• 제28권12호
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• pp.1007-1010
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• 2017

본 논문에서는 건물 내에서 통신성능 저하의 원인이 되는 인접 채널의 신호를 제어하기 위해 대역 저지 특성을 갖는 주파수 선택 표면구조를 설계하였다. 제안된 구조는 입사파의 편파 및 입사각에 안정적인 주파수 특성 구현을 위해 프랙탈 형상 기반의 소형화된 단위구조를 사용하였으며, 실제 적용성을 고려, 적은 제작비용으로 대량생산이 용이한 인쇄전자 기술을 이용하여 얇은 필름형 주파수 선택 표면구조를 제작하였다. 전통적인 회로제작 방식인 PCB 공정이 아닌 전도성 Ag 잉크를 이용한 스크린 프린팅 공정을 통해 생산성 및 환경성을 개선하였으며, 설계한 결과를 바탕으로 자유공간 측정을 통해 입사파의 편파 및 입사각에 대한 안정적인 특성을 검증하고, 실제 건물 내벽에 적용 후, 수신 신호강도 측정을 통해 주파수 선택 성능을 확인하였다.

• 한국전자파학회논문지
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• 제28권4호
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• pp.261-268
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• 2017

본 논문에서는 FSSH(Folded Slot Spherical Helix) 자기 다이폴 안테나에 관한 추가적인 연구를 통해 안테나 시작품 제작에 용이성을 갖는 구조를 제안하고, 그 방사 특성을 분석하였다. FSSH 자기 다이폴 안테나의 folded element 개수와 그 사이 간의 거리 및 금속면의 두께를 조절하여 전기적 소형 크기에서 높은 효율을 유지하면서 상대적으로 간소화된 안테나 구조를 제안하였다. 시뮬레이션을 통해 제안된 안테나의 넓은 고효율 대역폭 특성을 non-Foster 정합회로를 통해 실질적으로 사용할 수 있음을 확인하였다. SLS(Selective Laser Sintering) 3D 프린팅 기술을 통해 안테나 시작품을 제작 및 측정하였다. 측정값은 구리 테이프 경계면의 높은 저항 손실로 인해 시뮬레이션에 비해 낮은 Q값 특성을 보인다.

• 한국전기전자재료학회논문지
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• 제25권10호
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• pp.849-856
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• 2012

Chip on board type white light emitting diode on metal core printed circuit board with high thixotropy silicone is fabricated by vacuum printing encapsulation system. Encapsulant is chosen by taking into account experimental results from differential scanning calorimeter, shearing strength, and optical transmittance. We have observed that radiant flux and package efficacy are increased from 336 mW to 450 mW and from 11.9 lm/W to 36.2 lm/W as single dome diameter is varied from 2.2 mm to 2.8 mm, respectively. Double encapsulation structure with 2.8 mm of dome diameter shows further significant enhancement of radiant flux and package efficacy to 667 mW and 52.4 lm/W, which are 417 mW and 34.8 lm/W at single encapsulation structure, respectively.

• 한국전기전자재료학회논문지
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• 제23권7호
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• pp.571-574
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• 2010

Surface recombination loss should be reduced for high efficiency of solar cells. To reduce this loss, the BSF (back surface field) is used. The BSF on the back of the p-type wafer forms a p+layer, which prevents the activity of electrons of the p-area for the rear recombination. As a result, the leakage current is reduced and the rear-contact has a good Ohmic contact. Therefore, the open-circuit-voltage (Voc) and fill factor (FF) of solar cells are increased. This paper investigates the formation of the rear contact process by comparing aluminum-paste (Al-paste) with pure aluminum-metal(99.9%). Under the vacuum evaporation process, pure aluminum-metal(99.9%) provides high conductivity and low contact resistance of $4.2\;m{\Omega}cm$, but It is difficult to apply the standard industrial process to it because high vacuum is needed, and it's more expensive than the commercial equipment. On the other hand, using the Al-paste process by screen printing is simple for the formation of metal contact, and it is possible to produce the standard industrial process. However, Al-paste used in screen printing is lower than the conductivity of pure aluminum-metal(99.9) because of its mass glass frit. In this study, contact resistances were measured by a 4-point probe. The contact resistance of pure aluminum-metal was $4.2\;m{\Omega}cm$ and that of Al-paste was $35.69\;m{\Omega}cm$. Then the rear contact was analyzed by scanning electron microscope (SEM).

• 한국전기전자재료학회논문지
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• 제27권10호
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• pp.623-629
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• 2014

For the semiconductor device safety from over current in the digital electronic circuit system must be surely designed that it's surface mount type micro fuse device. In this paper, We has analysed to the fusing character of micro fuse as a function changed thickness of thermosetting ink epoxy. To the change of thermosetting ink epoxy thickness with in production lot, in the electrically character (fusing test in the 2 multiple over current and 10 multiple over current, surface temperature test in the 1.25 multiple over current) of micro fuse has been tested. According to the electrically character result, changed thickness of thermosetting ink epoxy in designed micro fuse withheld direct effect in both end resistance changes. Also, because high thermal energy in the micro fuse test of over current was occurred to effect such as thermal runaway and explosion. Therefore, screen printing process in the design of micro fuse using thermosetting ink epoxy is very important for production quality improvement.

• 공업화학
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• 제32권4호
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• pp.456-460
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• 2021

본 연구에서는 탄소 및 은 잉크를 사용하여 스크린 인쇄 공정을 통한 전위차 나트륨 이온(Na⁺) 센서를 제작하였다. 센서의 두 전극 구성은 Na⁺ 용액에서 네른스트 거동에 따라 전극의 전위차를 발생하였다. 제조된 Na⁺ 센서는 이상적인 네른스트 민감도, 빠른 응답 시간 및 낮은 검출 한계를 보여주었다. 네른스트 반응은 센서의 반복성 및 장기 내구성 테스트 시 안정적이었다. 탄소 전극에 코팅된 Na⁺ 선택막은 간섭 이온에 대해 나트륨 이온을 선택적으로 통과시켜 우수한 선택성을 증명하였다. 휴대용 Na⁺ 센서는 인쇄 회로 시스템을 사용하여 제작되었으며 다양한 실제 샘플에서 Na⁺ 농도를 성공적으로 측정하는 것을 증명하였다.