• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.1
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• pp.47-52
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• 2007

A material mixing method to obtain an optimal topology for a structure in a thermal environment was suggested. This method is based on Evolutionary Structural Optimization(ESO). The proposed material mixing method extends the ESO method to a mixing several materials for a structure in the multicriteria optimization of thermal flux and thermal stress. To do this, the multiobjective optimization technique was implemented. The overall efficiency of material usage was measured in terms of the combination of thermal stress levels and heat flux densities by using a combination strategy with weighting factors. Also, a smoothing scheme was implemented to suppress the checkerboard pattern in the procedure of topology optimization. It is concluded that ESO method with a smoothing scheme is effectively applied to topology optimization. Optimal topologies having multiple thermal criteria for a printed circuit board(PCB) substrate were presented to illustrate validity of the suggested material mixing method. It was found that the suggested method works very well for the multicriteria topology optimization.

• Journal of IKEEE
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• v.17 no.3
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• pp.324-331
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• 2013

In this paper, we implemented memristor emulator circuit on Printed Circuit Board (PCB) and observed the inherent pinched hysteresis characteristic of memristors by measuring the emulator circuit on PCB. The memristor emulator circuit implemented on PCB is composed of simple discrete devices not using any complicated circuit blocks thus we can integrate the memristor emulator circuits in very small layout area on Silicon substrate. The programmable gain amplifier is designed using the proposed memristor emulator circuit and verified that the amplifier's voltage gain can be controlled by programming memristance of the emulator circuit by circuit simulation. Threshold switching is also realized in the proposed emulator circuit thus memristance can remain unchanged when the input voltage applied to the emulator circuit is lower than VREF. The memristor emulator circuit and the programmable gain amplifier using the proposed circuit can be useful in teaching the device operation, functions, characteristics, and applications of memristors to students when thet cannot access to device and fabrication technologies of real memristors.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.545-545
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• 2007

Recently, innovative process has been investigated in order to replace the conventional high-cost micro patterning processes on the electronic products. To produce desirable profit margins from this low cost products, printed circuit board(PCB), will require dramatic changes in the current manufacturing philosophies and processes. Innovative process using metal nano particles replaces the current industry standard of subtractive etched of copper as a highly efficient way to produce robust circuitry on low cost substrates. An advantage of using metal nano particles process in patterned conductive line manufacturing is that the process is additive. Material is only deposited in desired locations, thereby reducing the amount of chemical and material waste. Simply, it just draws on the substrate as glass epoxy or polyimide with metal nano particles. Particles, when their size becomes nano-meter scale, show some specific characteristics such as enhanced reactivity of surface atoms, decrease in melting point, high electric conductivity compared with the bulk. Melting temperature of metal gets low, the metal nano particles could be formated onto polymer substrates and sintered under $300^{\circ}C$, which would be applied in PCB. It can be getting the metal line of excellent electric conductivity.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.7-12
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• 2002

In the measurement of the RF properties, the LTCC substrate must be considered as a system including various conductor patterning processes. In this paper, the LTCC substrate system is compared with a conventional PCB(Printed Circuit Board) substrate such as FR-4, Duroid and Teflon, etc. The microstrip resonator method is employed for the measurement of the RF properties in the range of DC to 20 GHz. Experimental results show that the ring resonator method is suitable for system loss measurement, and the series gap resonator method for dielectric constant measurement. The process of conductor patterning and its effect on the system loss were also studied.

• Journal of Electrical Engineering and Technology
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• v.8 no.3
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• pp.603-609
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• 2013

In this paper, we describe the analysis of inkjet-printed silver (Ag) patterns on epoxy-coated substrates according to several reliability evaluation test method guidelines for conventional printed circuit boards (PCB). To prepare patterns for the reliability analysis, various regular test patterns were created by Ag inkjet printing on flame retardant 4 (FR4) and polyimide (PI) substrates coated with epoxy for each test method. We coated the substrates with an epoxy primer layer to control the surface energy during printing of the patterns. The contact angle of the ink to the coated epoxy primer was $69^{\circ}$, and its surface energy was 18.6 $mJ/m^2$. Also, the substrate temperature was set at $70^{\circ}C$. We were able to obtain continuous line patterns by inkjet printing with a droplet spacing of $60{\mu}m$. The reliability evaluation tests included the dielectric withstanding voltage, adhesive strength, thermal shock, pressure cooker, bending, uniformity of line-width and spacing, and high-frequency transmission loss tests.

• ETRI Journal
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• v.46 no.4
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• pp.581-594
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• 2024

In this study, a planar printed circuit board (PCB) coil with FR4 substrate was designed and simulated using the finite element method, and the results were analyzed in the frequency domain. This coil can be used in wireless power transfer (WPT) as a transmitter or receiver, eliminating wires. It can also be used as the receiver in radio frequency energy-harvesting (RF-EH) systems by optimizing the planar PCB coil to convert radio-wave energy into electricity, and it can be employed as an excitation (transmitter) or receiver coil in nuclear magnetic resonance (NMR) spectroscopy. This PCB coil can replace the conventional coil, yielding a reduced occupied volume, a fine-tuned design, reduced weight, and increased efficiency. Based on the calculated gain, power, and electromagnetic and electric field results, this planar PCB coil can be implemented in WPT, NMR spectroscopy, and RF-EH devices with minor changes. In applications such as NMR spectroscopy, it can be used as a transceiver planar PCB coil. In this design, at frequencies of 915 MHz and 40 MHz with 5 mm between coils, we received powers of 287.3 μW and 480 μW, respectively, which are suitable for an NMR coil or RF-EH system.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.34 no.2
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• pp.90-98
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• 2021

Piezoelectric ceramic fiber composite (PCFC) was fabricated using a planar electrode printed piezoelectric ceramic fiber driven in transverse mode for small-scale wind energy harvester applications. The PCFC consisted of an epoxy matrix material and piezoelectric ceramic fibers sandwiched by interdigitated electrode (IDE) patterned polyimide films. The PCFC showed an excellent mechanical performance under a continuous stress. For the fabrication of PCB cantilever harvester, five -PCFCs were vertically attached onto a flexible printed circuit board (PCB) substrate, and then PCFCs were serially connected through a printed Cu circuit. The energy harvesting performance was evaluated applying an inverted structure, which imples its free leading edge located at an open end but the trailing edge at a clamped end, to enhance strain energy in a wind tunnel. The output voltage of the PCB cantilever harvester was increased as the wind speed increased. The maximum output power was 17.2 ㎼ at a resistance load of 200 ㏀ and wind speed of 9 m/s. It is considered that the PCB cantilever energy harvester reveals a potential use for wind energy harvester applications.

• Ceramist
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• v.21 no.2
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• pp.83-88
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• 2018

There is close relation between the heat generation and the performance of electronic device. The durability and efficiency of the device are degraded due to heat generation. It is necessary to release the generated heat from an electronic device. Based on demands of the printed circuit board (PCB) manufacturing, the robust and reliable plating technique of PCB is necessary. In this study, we review various methods for improving the heat sink property. These methods were considered to enhance the adhesion between ceramic substrate as heat sink and metal layer as electrode.

• Proceedings of the IEEK Conference
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• 2004.06a
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• pp.269-272
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• 2004

Printed circuit boards (PCB) replaced conventional wiring in most electronic equipment I, reducing the size and weight of electronic equipment while improving reliability, uniformity, precision and performance. PCB is used in all kinds of electronic products because they can be mass-produced with very high circuit density and also enable easier trouble-shooting. This paper presents the analyses of the patent information of Build-up PCB which is seen as the most promising solution, as its substrate supports multi-level packaging, thinner board profiles and smaller pitches.

• Journal of Welding and Joining
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• v.18 no.2
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• pp.222-222
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB baking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB baking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate. (Received November 19, 1999)