• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.20 no.12
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• pp.1272-1278
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• 2009

The cancellation method of P/G(power/ground) plane resonances which are generated between the power plane and the ground plane in a 4-layer PCB(Printed Circuit Boards) with a via-hole for the improvement of the RE(Radiated Emission) characteristic is presented. The validity of the proposed method was confirmed from simulation and measurement of performances of signal transmission characteristic, intensities of edge-radiation and radiated emission of PCB with a via-hole.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.26 no.4
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• pp.371-377
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• 2017

In this study, the heat dissipation performances of metal printed circuit boards (MPCBs) and flexible printed circuit boards (FPCBs) used in light-emitting diode (LED) lights were compared and analyzed by performing a heat dissipation simulation using a thermal flow analysis program. The results were summarized graphically. The temperature distribution of the MPCB was found to be better than that of the FPCB, indicating the better heat dissipation performance of the MPCB. For the two FPCB structures studied, we confirmed the LED temperature and temperature distribution by thermal flow analysis and found that for better overall heat dissipation performance, PCBs should preferably have an asymmetric structure. We confirmed the possibility of using FPCBs, which are characterized by a flexible structure, for LED lighting.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.2
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• pp.188-193
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• 2010

In this paper, SI(Signal Integrity) characteristic of the 4-layer PCB(Printed Circuit Boards) with a through-hole via was analyzed by impedance mismatching between the through-hole via and the transmission line, and deterioration of clock pulse response characteristic due to the P/G plane resonances which are generated between the power and the ground plane. The minimized impedance mismatching between the through-hole via and the transmission line for the improving of SI characteristic is confirmed by the TDR(Time Domain Reflector) simulation and lumped element modeling of the through-hole via. And the cancellation method of P/G plane resonances for improvement of the SI characteristic is represented by simulation result.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.60-60
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• 2008

We manufactured Liquid Crystal Polymer (LCP) and (1-x)$BaTiO_3-xSrTiO_3$(BST) ceramic composites and investigated dielectric properties to use as embedded capacitor in printed circuit boards and replace LTCC substrates. The dielectric properties of these composites are varied with volume fraction of BST and ratios of BT/ST. Dielectric constants are in the range of 3~28. In addition, we could get low TCC and High Q value that could not achieve in other ceramic-polymer composites. Especially, in composite with x=0.4 and 50vol% BST, the dieletric constant and Q-value are 27 and 300, respectively. And more TCC is -116~145ppm/$^{\circ}C$ in the temperature range of -55~$125^{\circ}C$. We think that this composites can be used high-Q substrate material like LTCC and embedded temperature compensation capacitor in printed circuit boards.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.232-233
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• 2007

We manufactured Liquid Crystal Polymer (LCP) and (1-x)CaTiO3-xLaAlO3 (CT-LA) ceramic composites and investigated dielectric properties to use as embedded capacitor in printed circuit boards and replace LTCC substrate. The dielectric properties of these composites are varied with volume fraction of CT-LA and ratios of CT/LA. Dielectric constants are in the range of 3~15. In addition, we could get low TCC and High Q value that could not achieve in other ceramic-polymer composites. Especially, in composite with x=0.01 and 30 vol% CT-LA, the dieletric constant and Q-value are 10 and 200, respectively. And more TCC is $-28{\sim}300ppm/^{\circ}C$ in the temperature range of $-55{\sim}125^{\circ}C$. We think that this composites can be used high-Q substrate material like LTCC and embedded temperature compensation capacitor in printed circuit boards.

• Journal of Radiation Industry
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• v.9 no.3
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• pp.137-141
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• 2015

A single-shot dual-energy x-ray imaging technique has been developed using a sandwich detector by stacking two detectors, in which the front and rear detectors respectively produce relatively lower and higher x-ray energy images. Each detector layer is composed of a phosphor screen coupled with a photodiode array. The front detector layer employs a thinner phosphor screen, whereas the rear detector layer employs a thicker phosphor screen considering the quantum efficiency for x-ray photons with higher energies. We have applied the proposed method into the inspection of printed circuit boards, and obtained dual-energy images with background clutter suppressed. In addition, the single-shot dual-energy method provides sharper-edge images than the conventional radiography because of the unsharp masking effect resulting from the use of different thickness phosphors between the two detector layers. It is promising to use the single-shot dual-energy x-ray imaging for high-resolution nondestructive testing. For the reliable use of the developed method, however, more quantitative analysis is further required in comparisons with the conventional method for various types of printed circuit boards.

• Korean Chemical Engineering Research
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• v.54 no.1
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• pp.108-113
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• 2016

A miniaturized lab-scale Cu plating cell for the metallization of electronic devices was fabricated and its deposit uniformity and profile were investigated. The plating cell was composed of a polypropylene bath, an electrolyte ejection nozzle which is connected to a circulation pump. In deposit uniformity evaluation, thicker deposit was found on the bottom and sides of substrate, indicating the spatial variation of deposit thickness was governed by the tertiary current distribution which is related to $Cu^{2+}$ transport. The surface morphology of Cu deposit inside photo-resist pattern was controlled by organic additives in the electrolyte as it led to the flatter top surface compared to convex surface which was observed in the deposit grown without organic additives.

• Journal of Institute of Control, Robotics and Systems
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• v.12 no.3
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• pp.241-247
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• 2006

We propose a character recognition system to extract the component reference names from printed circuit boards (PCBs) automatically. The names are written in horizontal, vertical, reverse-horizontal and reverse-vertical directions. Also various symbols and figures are included in PCBs. To recognize the character and orientation effectively, we divide the recognizer into two stages: character classification stage and orientation classification stage. The character classification stage consists of two sub-recognizers and a verifier. The rotaion-invarint features of input pattern are then used to identify the character independent of orientation. Each recognizer is implemented as a neural network, and the weight values of verifier are obtained by genetic algorithm. In the orientation classification stage, the input pattern is compared with reference patterns to identify the orientation. Experimental results are presented to verify the usefulness of the proposed system.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2003.05a
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• pp.741-743
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• 2003

A surface mount machine operation policy to assemble printed circuit boards is being developed in this research. The policy includes how to assign electronic components to slots on a component rack, and how to determine placement sequences on printed circuit board. The suggested heuristic uses information about component types and closeness relationships in each component on the board to assemble. First, the size of components and closeness ratings are used to divide them into two different size groups. Then rack assignment and placement routes are developed using component type and quantity information for a small size group, and followed by a large size group. Simulation models are developed using Visual C++ for performance evaluation of the heuristic. Necessary statistical analyses are provided to show the effectiveness of the suggested heuristic.

• Journal of Korean Society for Quality Management
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• v.25 no.1
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• pp.135-141
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• 1997

The Copper-Clad Laminate (CCL) is a main electronic component of specialtype printed circuit boards (PCBs) such as Silver Through Hole PCB. This CCL should have high reliability under the aging test, and usually the test is done at a higher temperature (110-$150^{\circ}C$) than the normal. Then, this test condition of high temperature may cause such quality problems as hole eccentricity and reduction of distance between part holes. After measuring the CCL shrinkage affected by temperature, the correction factor of a press mold was a, pp.ied to solve these problems. The results showed that the tolerance of hole pitch(${\pm}$$100{\mu}m$) was satisfactory and the internal and external failure costs were reduced by 55%.