• 한국원자력학회:학술대회논문집
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• 한국원자력학회 1996년도 춘계학술발표회논문집(3)
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• pp.290-295
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• 1996

The purpose of this study is to establish the pressure/temperature curves of Reactor Coolant System for brittle fracture prevention. The pressure/temperature curve is the basis to select RC Pump and limits to operate the plant. Based on the plant operation experience, this curve should be re-generated periodically in order to ensure the structural integrity using data from the test of reactor vessel surveilance materials to compensate for the irradiation effects. This study provides the procedure of pressure/temperature curve generation in term of brittle fracture prevention of reactor vessel. Using the UCN 3&4 data, the sample pressure/temperature curve was generated, and it was compared with those of YGN 3&4 based on the stress and $RT_{NDT}$value.

• Nuclear Engineering and Technology
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• 제30권4호
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• pp.364-376
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• 1998

The statistical analysis method was applied to the evaluation of fracture toughness in the ductile-brittle transition temperature region. Because cleavage fracture in steel is of a statistical nature, fracture toughness data or values show a similar statistical trend. Using the three-parameter Weibull distribution, a fracture toughness vs. temperature curve (K-curve) was directly generated from a set of fracture toughness data at a selected temperature. Charpy V-notch impact energy was also used to obtain the K-curve by a $K_{IC}$ -CVN (Charpy V-notch energy) correlation. Furthermore, this method was applied to evaluate the neutron irradiation embrittlement of reactor pressure vessel (RPV) steel. Most of the fracture toughness data were within the 95% confidence limits. The prediction of a transition temperature shift by statistical analysis was compared with that from the experimental data.

• 한국압력기기공학회 논문집
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• 제15권1호
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• pp.71-76
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• 2019

Actual stress distributions in the nozzle of a pressure vessel may not be in plane strain condition, implying that the crack-tip constraint condition may be relaxed in the nozzle. In this paper, a methodology for evaluating the fracture toughness of the ASME Code is presented considering the relaxation of the constraint effect in the nozzle of the reactor pressure vessel. The crack-tip constraint effect is quantified by the T-stress. The equation, which represent the relation between the fracture toughness in the lower constraint condition and the plane strain fracture toughness, is derived using the T-stress. This equation is similar to the method for evaluating the fracture toughness of the Master Curve for low constraint conditions. As a result of evaluating the fracture toughness considering the constraint effect in the reactor inlet, outlet and direct injection nozzles using the proposed equation, it was confirmed that the fracture toughness in the nozzles is higher than the plane strain fracture toughness. Applying the proposed evaluation methodology, it is possible to reflect the relaxation of the constraint effect in the nozzles of the reactor pressure vessel, therefore, the safe operation area on the pressure-temperature limit curve can be prevented from being excessively limited.

• 수산해양기술연구
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• 제17권2호
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• pp.93-103
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• 1981

Si-Cr계 내열강 SUH3와 Cr-Ni계 stainless강 SUS 303 및 이들이 마찰용접재 SUH3-SUS303을 $1,060^{\circ}C$에서 용체화처리하고 다시 $700^{\circ}C$에서 10, 100시간 시효열처리한 각 시험편의 고온 피로강도에 대한 시효열처리의 효과를 알기 위하여 $700^{\circ}C$에서 고온 회전굽힘 피로시험을 하고 파약거동을 미시적으로 관찰하여 다음과 같은 결과를 얻었다. 1) SUH3재와 SUS303재의 최적마찰용접조건은 회전수 2420rpm, 마찰가압력 $8kg/mm^2$, 전 upset량 7mm(마찰가압시간 3sec, upset시간 2sec)이었다. 2) $700^{\circ}C$ 고온에서 장시간 이루어지는 고온피로시험에 있어, 용체화처리재의 S-N 곡선 경사부의 기울기가 가장 급하게 나타났다. 3) SUH3-SUS303 마찰용접재는 $1,060^{\circ}C$에서 1시간용체화 처리하고, $700^{\circ}C$에서 시효처리하는 경우 최적시효시간은 10시간이었다. 4) 10시간 시료재의 고온피로한도는 모재보다 SUH3은 75.4%, SUS303은 28.5% 높았으며, 용접재 SUH3-SUS303은 44.2% 정도 높았다. 100시간 시효재는 모재보다 SUH3은 64.91% SUS303은 30.4% 높았으며, SUH3-SUS303은 30.4% 높았으며, SUH3-SUS303은 36.6% 높았다. 5) 마찰용접재의 상온 및 고온의 피로파단은 모두 SUS303의 모재측에 발생하였으며, 용접면에서의 파단은 전혀 없었다. 6) SUS303재와 마찰용접재 SUH3-SUS303재의 크랙은 입내파양형이었으나 SUH3은 입계크랙의 전파로 파양한다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2000년도 추계학술발표회 초록집
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• pp.1-2
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• 2000

In chip plating, several parameters must be taken into consideration. Current density, solution concentration, pH, solution temperature, components volume, chip and media ratio, barrel geometrical shape were most likely found to have an effect to the process yields. The 3 types of barrels utilized in chip plating industry are the onventional rotating barrel, vibrational barrel(vibarrel), and the centrifugal type. Conventional rotating barrel is a close type and is commonly used. The components inside the barrel are circulated by the barrel's rotation at a horizontal axis. Process yield has known to have higher thickness deviation. The vibrational barrel is an open type which offers a wide exposure to electrolyte resulting to a stable thickness deviation. It rotates in a vertical axis coupled with multi-vibration action to facilitate mixed up and easy transportation of components. The centrifugal barrel has its plated work centrifugally compacted against the cathode ring for superior electrical contact with simultaneous rotary motion. This experiment has determined the effect of barrel vibration intensity to the plating thickness distribution. The procedures carried out in the experiment involved the overall plating process., cleaning, rinse, Nickel plating, Tin-Lead plating. Plating time was adjusted to meet the required specification. All other parameters were maintained constant. Two trials were performed to confirm the consistency of the result. The thickness data of the experiment conducted showed thatbthe average mean value obtained from higher vibrational intensity is nearer to the standard mean. The distribution curve shown has a narrower specification limits and it has a reduced variation around the target value. Generally, intensity control in vi-barrel facilitates mixed up and easy transportation of components. However, it is desirable to maintain an optimum vibration intensity to prevent solution intrusion into the chips' internal electrode. A cathodic reaction can occur in the interface of the external and internal electrode. 2H20 + e $\rightarrow$M/TEX> 20H + H2.. Hydrogen can penetrate into the body and create pressure which can cause cracks. At high intensity, the chip's motion becomes stronger, its contact between each other is delayed and so plating action is being controlled. However, the strong impact created by its collision can damage the external electrode's structure there by resulting to bad plating condition.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 1999년도 추계학술발표회 초록집
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• pp.15-15
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• 1999

In chip plating, several parameters must be taken into consideration. Current density, solution concentration, pH, solution temperature, components volume, chip and media ratio, barrel geometrical shape were most likely found to have an effect to the process yields. The 3 types of barrels utilized in chip plating industry are the conventional rotating barrel. vibrational barrel (vibarrel), and the centrifugal type. Conventional rotating barrel is a close type and is commonly used. The components inside the barrel are circulated by the barrel's rotation at a horizontal axis. Process yield has known to have higher thickness deviation. The vibrational barrel is an open type which offers a wide exposure to electrolyte resulting to a stable thickness deviation. It rotates in a vertical axis coupled with multi-vibration action to facilitate mixed up and easy transportation of components, The centrifugal barrel has its plated work centrifugally compacted against the cathode ring for superior electrical contact with simultaneous rotary motion. This experiment has determined the effect of barrel vibration intensity to the plating thickness distribution. The procedures carried out in the experiment involved the overall plating process., cleaning, rinse, Nickel plating, Tin-Lead plating. Plating time was adjusted to meet the required specification. All other parameters were maintained constant. Two trials were performed to confirm the consistency of the result. The thickness data of the experiment conducted showed that the average mean value obtained from higher vibrational intensity is nearer to the standard mean. The distribution curve shown has a narrower specification limits and it has a reduced variation around the target value, Generally, intensity control in vi-barrel facilitates mixed up and easy transportation of components, However, it is desirable to maintain an optimum vibration intensity to prevent solution intrusion into the chips' internal electrode. A cathodic reaction can occur in the interface of the external and internal electrode. $2HD{\;}+{\;}e{\;}{\rightarrow}20H{\;}+{\;}H_2$ Hydrogen can penetrate into the body and create pressure which can cause cracks. At high intensity, the chip's motion becomes stronger, its contact between each other is delayed and so plating action is being controlled. However, the strong impact created by its collision can damage the external electrode's structure thereby resulting to bad plating condition. 1 lot of chip was divided into two equal partion. Each portion was loaded to the same barrel one after the other. Nickel plating and tin-lead plating was performed in the same station. Portion A maintained the normal barrel vibration intensity and portion B vibration intensity was increased two steps higher. All other parameters, current, solution condition were maintained constant. Generally, plating method find procedures were carried out in a best way to maintained the best plating condition. After plating, samples were taken out from each portion. molded and polished. Plating thickness was investigated for both. To check consistency of results. 2nd trial was done now using different lot of another characteristics.