Delamination Prediction of Semiconductor Packages through Finite Element Analysis Reflecting Moisture Absorption and Desorption according to the Temperature and Relative Humidity (유한요소 해석을 통해 온도와 상대습도에 따른 수분 흡습 및 탈습을 반영한 반도체 패키지 구조의 박리 예측)
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- Journal of the Microelectronics and Packaging Society
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- v.29 no.3
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- pp.37-42
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- 2022