• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.8
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• pp.1530-1535
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• 1992

An optical method of phase shifting interferometry is presented for the 3-dimensional profile measurement of mirror surfaces with nanometer resolution. A series of optical interferometric fringes are generated by comparing the surface to be measured with a reference flat. The fringes are captured by a CCD camera and then analyzed to obtain actual surface profile. Detailed principles are described along with necessary image processing algorithms. finally, several measurement examples are discussed which were performed on lapped surfaces, hard discs, and semiconductor wafers.

• Journal of the Optical Society of Korea
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• v.18 no.1
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• pp.37-44
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• 2014

The use of a laser interferometer as a metrological tool in micro-optics measurement is demonstrated. A transmissive interferometer is effective in measuring an optical specimen having a high angle slope. A configuration that consists of an optical resolution of 0.62 micron is adapted to measure a specimen, which is a micro-Fresnel lens-shaped lenticular lens. The measurement result shows a good repeatability at each fraction of facets, however, a reconstruction of the lens shape profile is disturbed by a known problem of $2{\pi}$-ambiguity. To solve this $2{\pi}$-ambiguity problem, we propose a two-step phase unwrapping method. In the first step, an unwrapped phase map is obtained by using a conventional unwrapping method. Then, a proposed unwrapping method based on the shape modeling is applied to correct the wrongly unwrapped phase. A measured height of each facet is compared with a profile result measured by AFM.

• Current Optics and Photonics
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• v.1 no.5
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• pp.505-513
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• 2017

Measuring the thickness of thin films is strongly required in the display industry. In recent years, as the size of a pattern has become smaller, the substrate has become larger. Consequently, measuring the thickness of the thin film over a wide area with low spatial sampling size has become a key technique of manufacturing-yield management. Interferometry is a well-known metrology technique that offers low spatial sampling size and the ability to measure a wide area; however, there are some limitations in measuring the thickness of the thin film. This paper proposes a method to calculate the thickness of the thin film in the following two steps: first, pre-estimation of the thickness with the phase at the peak position of the interferogram at the bottom surface of the thin film, using white-light phase-shift interferometry; second, accurate correction of the measurement by fitting the interferogram with the theoretical pattern through the estimated thickness. Feasibility and accuracy of the method has been verified by comparing measured values of photoresist pattern samples, manufactured with the halftone display process, to those measured by AFM. As a result, an area of $880{\times}640$ pixels could be measured in 3 seconds, with a measurement error of less than 12%.