• Title/Summary/Keyword: Pre-engineers

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Effect of Process Parameters on Residual NCO and Viscosity of Pre-Polymers (Pre-Polymer의 제조에서 공정변수가 잔류 NCO 및 점도에 미치는 영향)

  • Kim, Sang-Oh;You, Man-Hee;Ha, Man-Kyung;Kwak, Jae-Seob
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.7 no.3
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    • pp.61-66
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    • 2008
  • For the production of urethane prepolymer, the effect of process parameters such as diisocyanate MDI and polyol TDI was tested. In this paper, design of experiments has been adopted for studying the effect of the process parameters on the improvement of NCO and viscosity of pre-polymer. As a result of comparison of different parameters, the effect of polyol was stronger than that of isocyanate in comparison of reactivity according to the amounts of isocyanate and polyol. Especially, NCO and viscosity of pre-polymer affected a product safety.

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A Study on Si-wafer direct bonding for high pre-bonding strength (큰 초기접합력을 갖는 Si기판 직접접합에 관한 연구)

  • 정연식;김재민;류지구;정귀상
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.447-450
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    • 2001
  • Abstract-Si direct bonding(SDB) technology is very attractive for both Si-on-insulator(SOI) electric devices and MEMS applications because of its stress free structure and stability. This paper presents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration, and applied pressure. The bonding strength was evaluated by tensile strength method. The bonded interface and the void were analyzed by using SEM and IR camera, respectively. Components existed in the interlayer were analysed by using FT-lR. The bond strength depends on the HF pre-treatment condition before pre-bonding (Min : 2.4kgf/cm$^2$∼Max : 14.9kgf/cm$^2$).

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Pre-Flashover of Alumina in Vacuum (진공중에서 알루미나의 플래쉬오버 현상)

  • Jung, You-Ra;Choi, Yong-Sung;Lee, Kyung-Sup
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.266-267
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    • 2008
  • The flashover of insulators in vacuum is the main factor to limit the performance of insulation in vacuum insulation system. It is believed that the pre-flashover phenomena would play a very important role in the procedure of the flashover in the interface between the insulators and vacuum. This paper is mainly concerned on the pre-flashover phenomena of Alumina insulators in vacuum. There are 24 different types of alumina insulators were tested with a 0.7/4 ${\mu}s$ pulsed voltage under a $1\times10^{-4}Pa$ vacuum. The observed pre-flashover phenomena were classified and the pre-flashover characteristics were concluded. It is useful to study further on the flashover mechanism in vacuum.

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The Effects of Sputtering conditions in Pre Sputtering on the Formation Behavior of Nitride Layer in the Ion Nitriding of Stainless Steel (초기 스퍼터링조건이 스테인리스강의 이온질화시 지로하층 형성거동에 미치는 영향)

  • 최상진
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1999.10a
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    • pp.197-203
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    • 1999
  • Stainless steels in general has passive film having strong corrosion resistance on surface. Therefore it must be necessarily removed by etching in mixing solution of sulfuric and chloric acid before Nitriding treatment. But in the ion nitriding, nitride layer was easily formed because passive film was removed without difficult by sputtering effect. The removal extent of these passive films was greatly effected by gas mixing ratios and pressure and holding times of pre sputtering factors in pre sputtering stage. As a results of experiment it has been known that pre sputtering pressure and holding time was not nearly effective on the formation behavior of nitride layer. But when A/H2 gas mixing ratios was 1/2 (vol%) was the most effective of the all pre sputtering conditions. It was resulted from the combination of mechanical reaction byArgon bombardment and chemical reaction by reduction of hydrogen on the passive film.

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The Design of 128 Channels Cardiac-Activation Pre-Amplifier (128 채널 심장전기도 전치 증폭기의 설계)

  • Yoo, Sun-Kook;Chang, Byung-Chul;Jung, Dong-Il;Han, Young-Oh
    • The Transactions of the Korean Institute of Electrical Engineers D
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    • v.50 no.11
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    • pp.550-556
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    • 2001
  • The computerized cardiac analysis system, which acquires and analyzes the electrical activation signal propagating along the surface of the heart, is indispensible equipment for the open heart surgery and electrical cardiac study. In this paper, the design requirement and the electrical circuit analysis are performed to construct the multi-channel cardiac activation pre-amplifier necessary for a signal conditioning circuit. The general 64 channel configuration is expanded into 128 channels to enhance the spatial resolution on the mapped surface of the heart. The 128 channels pre-amplifier consists of input circuit, differential amplifier, right leg driven circuit and isolation part. It has distinct features; high voltage protection, leakage current limitation, isolation and the maximization of common mode rejection ratio with respect to the half-cell potential difference due to different electrode materials. The final pre-amplifier circuit is assembled with 8 boards, each of which composing of 16 channels.

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Effects of the Pre-strain on Mechanical Properties of the Solid-Phase Formed Thermoplastic Composite (고상성형된 열가소성 복합재료의 성형 변형률이 기계적 특성에 미치는 영향)

  • Lee, Jung-Hui;Jo, Hyeon-Cheol;Lee, Gyeong-Yeop
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.25 no.8
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    • pp.1220-1226
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    • 2001
  • This study investigates the effects of the pre-strain level on mechanical properties of the solid-phase formed thermoplastic composite. A uniaxial solid-phase forming was performed at the temperature of 125$\^{C}$ and at the constant cross-head speed of 3mm/sec. The composite sheet was formed to various pre-strain levels of 10%, 20%, and 30%. Tension, flexural, and impact tests were carried out to characterize the material properties of a solid-phase formed part. Tensile and flexural strengths decreased with increasing the pre-strain level, while impact strength increased. Various microstructures of the formed part explained the above material behavior.

Effects of Pre-formed Space Charges by Negative DC Voltages on PD Characteristics in XLPE (부극성 직류전압에 의해 사전 형성된 공간전하가 XLPE의 부분방전특성에 미치는 영향)

  • 황보승;이준호
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.52 no.7
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    • pp.310-313
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    • 2003
  • The purpose of this paper is to evaluate the effects of pre-formed space charges by DC stress on partial discharge(PD) characteristics in XLPE. We have suggested a modified pulsed electro-acoustic(PEA) method and successfully measured both space charge distribution and current simultaneously. It has been demonstrated that the PD patterns are strongly influenced by the pre-formed space charge distributions, which are hardly disappeared up to AC 8㎸ in electrode configuration including air gap between XLPE layer and electrode. From the results, it could be said that the pre-formed space charges by DC stress can play harmful and dangerous roles in insulating system under AC operating voltages because of the field distortion and localization due to the pre-formed space charge.

Fabrication of High Precision Pre-amplifier for EEG Signal Measurement and Development of Auto Classification System (뇌파신호 측정을 위한 고성능 전치증폭기 제작 및 자동 신호분류 시스템 개발)

  • 도영수;장긍덕;남효덕;장호경
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.11a
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    • pp.409-412
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    • 2000
  • A high performance EEG signal measurement system is fabricated. It consists of high precision pre-amplifier and auto identification bandwidth unit. High precision pre-amplifier is composed of signal generator, signal amplifier with a impedance converter, body driver and isolation amplifier. The pre-amplifier is designed for low noise characteristics, high CMRR, high input impedance, high IMRR and safety, Auto identification bandwidth unit is composed of AD-converter and PIC micro-controller for real time processing EEG signal. The performance of EEG signal measurement system has been shown the classified bandwidth through the clinical demonstrations.

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Design of Echo Classifier Based on Neuro-Fuzzy Algorithm Using Meteorological Radar Data (기상레이더를 이용한 뉴로-퍼지 알고리즘 기반 에코 분류기 설계)

  • Oh, Sung-Kwun;Ko, Jun-Hyun
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.63 no.5
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    • pp.676-682
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    • 2014
  • In this paper, precipitation echo(PRE) and non-precipitaion echo(N-PRE)(including ground echo and clear echo) through weather radar data are identified with the aid of neuro-fuzzy algorithm. The accuracy of the radar information is lowered because meteorological radar data is mixed with the PRE and N-PRE. So this problem is resolved by using RBFNN and judgement module. Structure expression of weather radar data are analyzed in order to classify PRE and N-PRE. Input variables such as Standard deviation of reflectivity(SDZ), Vertical gradient of reflectivity(VGZ), Spin change(SPN), Frequency(FR), cumulation reflectivity during 1 hour(1hDZ), and cumulation reflectivity during 2 hour(2hDZ) are made by using weather radar data and then each characteristic of input variable is analyzed. Input data is built up from the selected input variables among these input variables, which have a critical effect on the classification between PRE and N-PRE. Echo judgment module is developed to do echo classification between PRE and N-PRE by using testing dataset. Polynomial-based radial basis function neural networks(RBFNNs) are used as neuro-fuzzy algorithm, and the proposed neuro-fuzzy echo pattern classifier is designed by combining RBFNN with echo judgement module. Finally, the results of the proposed classifier are compared with both CZ and DZ, as well as QC data, and analyzed from the view point of output performance.

IEEE 1500 Wrapper Design Technique for Pre/Post Bond Testing of TSV based 3D IC (TSV 기반 3D IC Pre/Post Bond 테스트를 위한 IEEE 1500 래퍼 설계기술)

  • Oh, Jungsub;Jung, Jihun;Park, Sungju
    • Journal of the Institute of Electronics and Information Engineers
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    • v.50 no.1
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    • pp.131-136
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    • 2013
  • TSV based 3D ICs have been widely developed with new problems at die and IC levels. It is imperative to test at post-bond as well as pre-bond to achieve high reliability and yield. This paper introduces a new testable design technique which not only test microscopic defects at TSV input/output contact at a die but also test interconnect defects at a stacked IC. IEEE 1500 wrapper cells are augmented and through at-speed tests for pre-bond die and post-bond IC, known-good-die and defect free 3D IC can be massively manufactured+.