• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.3 s.357
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• pp.59-64
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• 2007

This paper describes the PLL of TCON(Timing Controller) chip for FPD(Flat Panel Display). We propose a new V-I converter which is insensitive to the power supply variation when it is applied to the TCON. The new V-I converter compensated the output frequency of VCO by appling the current that is inversely proportional to the voltage variation. The proposed idea is implemented with a 1-ploy 3-metal 0.25m TSMC CMOS technology and has the output frequency range from 192MHz to 360MHz at the supply voltage of 2.5V. Measurement result shows the RMS jitter of 100ps in the above output frequency range.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.14 no.4
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• pp.917-922
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• 2010

In this paper, a new temperature-insensitive CMOS dual-mode current reference for low-voltage low-power mixed-mode circuits is proposed. The temperature independent reference current is generated by summing a proportional to absolute temperature(PTAT) current and a complementary to absolute temperature(CTAT) current. The temperature insensitivity was achieved by the mobility and the other which is inversely proportional to mobility. As the results, the temperature dependency of output currents was measured to be $0.38{\mu}A/^{\circ}C$ and $0.39{\mu}A/^{\circ}C$, respectively. And also, the power dissipation is 0.84mW on 2V voltage supply. These results are verified by the $0.18{\mu}m$ n-well CMOS parameter.

• Proceedings of the KSR Conference
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• 2006.11b
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• pp.1240-1246
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• 2006

Generally, there are two types of main factors to affect output power quality of a auxiliary power supply an EMU(electric multiple unit). One is a voltage flicker by amplitude modulation of short time and air compressors. The other is repetitive motion of large capacity motor such as air compressors, HVAC unit etc. in main factors. This paper compared two kinds of fluorescent lamp, 32W (after remodeling interior) and 40W(before remodeling interior) and measured the light output varying input power(AC220V) for a flicker phenomenon related power supply of lamps in EMU. Also, we analyzed a flicker considering EMU operating time and density in order to grasp main factors of a load change to cause a voltage change. As a results of test, a 40W fluorescent lamp was more insensitive with 20.26% degree an eye recognition degree sides about changes of the input power and lower with 19.9% voltage side generating flicker compare with fluorescent lamp 32W. Also, we confirmed the fact which the fluorescent lamp flicker was generated by varying fluorescent lamp output voltage when the commercial EMU was in high driving density and at the busy time. Additionally, we confirmed the frequency band which an EMU passenger could feel sensitively blinking of a fluorescent lamp was visually $8Hz{\sim}15Hz$.

• Journal of Sensor Science and Technology
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• v.27 no.2
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• pp.93-98
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• 2018

In this paper, an energy-efficient 11.49-bit successive approximation register (SAR) capacitance-to-digital converter (CDC) for capacitive sensors with a figure of merit (FoM) of 31.6 pJ/conversion-step is presented. The CDC employs a SAR algorithm to obtain low power consumption and a simplified structure. The proposed circuit uses a capacitive sensing amplifier (CSA) and a dynamic latch comparator to achieve parasitic capacitance-insensitive operation. The CSA adopts a correlated double sampling (CDS) technique to reduce flicker (1/f) noise to achieve low-noise characteristics. The SAR algorithm is implemented in dual operating mode, using an 8-bit coarse programmable capacitor array in the capacitance-domain and an 8-bit R-2R digital-to-analog converter (DAC) in the charge-domain. The proposed CDC achieves a wide input capacitance range of 29.4 pF and a high resolution of 0.449 fF. The CDC is fabricated in a $0.18-{\mu}m$ 1P6M complementary metal-oxide-semiconductor (CMOS) process with an active area of 0.55 mm2. The total power consumption of the CDC is $86.4{\mu}W$ with a 1.8-V supply. The SAR CDC achieves a measured 11.49-bit resolution within a conversion time of 1.025 ms and an energy-efficiency FoM of 31.6 pJ/step.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.4
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• pp.27-35
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• 2008

This work proposes a 14b 150MS/s 0.13um CMOS ADC for SDR systems requiring simultaneously high resolution, low power, and small size at high speed. The proposed ADC employs a calibration-free four-step pipeline architecture optimizing the scaling factor for the input trans-conductance of amplifiers and the sampling capacitance in each stage to minimize thermal noise effects and power consumption at the target resolution and sampling rate. A signal- insensitive 3-D fully symmetric layout achieves a 14b level resolution by reducing a capacitor mismatch of three MDACs. The proposed supply- and temperature- insensitive current and voltage references with on-chip RC filters minimizing the effect of switching noise are implemented with off-chip C filters. The prototype ADC in a 0.13um 1P8M CMOS technology demonstrates a measured DNL and INL within 0.81LSB and 2.83LSB, at 14b, respectively. The ADC shows a maximum SNDR of 64dB and 61dB and a maximum SFDR of 71dB and 70dB at 120MS/s and 150MS/s, respectively. The ADC with an active die area of $2.0mm^2$ consumes 140mW at 150MS/s and 1.2V.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.3
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• pp.77-85
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• 2008

This work proposes a 12b 130MS/s 108mW $1.8mm^2$ 0.18um CMOS ADC for high-quality video systems such as TFT-LCD displays and digital TVs requiring simultaneously high resolution, low power, and small size at high speed. The proposed ADC optimizes power consumption and chip area at the target resolution and sampling rate based on a three-step pipeline architecture. The input SHA with gate-bootstrapped sampling switches and a properly controlled trans-conductance ratio of two amplifier stages achieves a high gain and phase margin for 12b input accuracy at the Nyquist frequency. A signal-insensitive 3D-fully symmetric layout reduces a capacitor and device mismatch of two MDACs. The proposed supply- and temperature- insensitive current and voltage references are implemented on chip with a small number of transistors. The prototype ADC in a 0.18um 1P6M CMOS technology demonstrates a measured DNL and INL within 0.69LSB and 2.12LSB, respectively. The ADC shows a maximum SNDR of 53dB and 51dB and a maximum SFDR of 68dB and 66dB at 120MS/s and 130MS/s, respectively. The ADC with an active die area of $1.8mm^2$ consumes 108mW at 130MS/s and 1.8V.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.10
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• pp.2369-2379
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• 2013

A CMOS x-ray line scan sensor which is used in both medical imaging and non-destructive diagnosis is designed. It has a pixel array of 512 columns ${\times}$ 4 rows and a built-in DC-DC converter. The pixel circuit is newly proposed to have three binning modes such as no binning, $2{\times}2$ binning, and $4{\times}4$ binning in order to select one of pixel sizes of $100{\mu}m$, $200{\mu}m$, and $400{\mu}m$. It is designed to output a fully differential image signal which is insensitive to power supply and input common mode noises. The layout size of the designed line scan sensor with a $0.18{\mu}m$ x-ray CMOS image sensor process is $51,304{\mu}m{\times}5,945{\mu}m$.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.7
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• pp.17-26
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• 2016

This work proposes a 12b 60MS/s 0.18um CMOS Flash-SAR ADC for various systems such as wireless communications and portable video processing systems. The proposed Flash-SAR ADC alleviates the weakness of a conventional SAR ADC that the operation speed proportionally increases with a resolution by deciding upper 4bits first with a high-speed flash ADC before deciding lower 9bits with a low-power SAR ADC. The proposed ADC removes a sampling-time mismatch by using the C-R DAC in the SAR ADC as the combined sampling network instead of a T/H circuit which restricts a high speed operation. An interpolation technique implemented in the flash ADC halves the required number of pre-amplifiers, while a switched-bias power reduction scheme minimizes the power consumption of the flash ADC during the SAR operation. The TSPC based D-flip flop in the SAR logic for high-speed operation reduces the propagation delay by 55% and the required number of transistors by half compared to the conventional static D-flip flop. The prototype ADC in a 0.18um CMOS demonstrates a measured DNL and INL within 1.33LSB and 1.90LSB, with a maximum SNDR and SFDR of 58.27dB and 69.29dB at 60MS/s, respectively. The ADC occupies an active die area of $0.54mm^2$ and consumes 5.4mW at a 1.8V supply.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.11 s.353
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• pp.37-47
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• 2006

This work proposes a 10b 25MS/s $0.8mm^2$ 4.8mW 0.13um CMOS A/D Converter (ADC) for high-performance wireless communication systems such as DVB, DAB and DMB simultaneously requiring low voltage, low power, and small area. A two-stage pipeline architecture minimizes the overall chip area and power dissipation of the proposed ADC at the target resolution and sampling rate while switched-bias power reduction techniques reduce the power consumption of analog amplifiers. A low-power sample-and-hold amplifier maintains 10b resolution for input frequencies up to 60MHz based on a single-stage amplifier and nominal CMOS sampling switches using low threshold-voltage transistors. A signal insensitive 3-D fully symmetric layout reduces the capacitor and device mismatch of a multiplying D/A converter while low-noise reference currents and voltages are implemented on chip with optional off-chip voltage references. The employed down-sampling clock signal selects the sampling rate of 25MS/s or 10MS/s with a reduced power depending on applications. The prototype ADC in a 0.13um 1P8M CMOS technology demonstrates the measured DNL and INL within 0.42LSB and 0.91LSB and shows a maximum SNDR and SFDR of 56dB and 65dB at all sampling frequencies up to 2SMS/s, respectively. The ADC with an active die area if $0.8mm^2$ consumes 4.8mW at 25MS/s and 2.4mW at 10MS/s at a 1.2V supply.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.11 s.353
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• pp.48-57
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• 2006

This work describes a 12b 200KHz 0.52mA $0.47mm^2$ algorithmic ADC for sensor applications such as motor controls, 3-phase power controls, and CMOS image sensors simultaneously requiring ultra-low power and small size. The proposed ADC is based on the conventional algorithmic architecture with recycling techniques to optimize sampling rate, resolution, chip area, and power consumption. The input SHA with eight input channels for high integration employs a folded-cascode architecture to achieve a required DC gain and a sufficient phase margin. A signal insensitive 3-D fully symmetrical layout with critical signal lines shielded reduces the capacitor and device mismatch of the MDAC. The improved switched bias power-reduction techniques reduce the power consumption of analog amplifiers. Current and voltage references are integrated on the chip with optional off-chip voltage references for low glitch noise. The employed down-sampling clock signal selects the sampling rate of 200KS/s or 10KS/s with a reduced power depending on applications. The prototype ADC in a 0.18um n-well 1P6M CMOS technology demonstrates the measured DNL and INL within 0.76LSB and 2.47LSB. The ADC shows a maximum SNDR and SFDR of 55dB and 70dB at all sampling frequencies up to 200KS/s, respectively. The active die area is $0.47mm^2$ and the chip consumes 0.94mW at 200KS/s and 0.63mW at 10KS/s at a 1.8V supply.