• Title/Summary/Keyword: Power electronic

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A Highly Power-Efficient Single-Inductor Multiple-Outputs (SIMO) DC-DC Converter with Gate Charge Sharing Method

  • Nam, Ki-Soo;Seo, Whan-Seok;Ahn, Hyun-A;Jung, Young-Ho;Hong, Seong-Kwan;Kwon, Oh-Kyong
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.14 no.5
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    • pp.549-556
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    • 2014
  • This paper proposes a highly power-efficient single-inductor multiple-outputs (SIMO) DC-DC converter with a gate charge sharing method in which gate charges of output switches are shared to improve the power efficiency and to reduce the switching power loss. The proposed converter was fabricated by using a $0.18{\mu}m$ CMOS process technology with high voltage devices of 5 V. The input voltage range of the converter is from 2.8 V to 4.2 V, which is based on a single cell lithium-ion battery, and the output voltages are 1.0 V, 1.2 V, 1.8 V, 2.5 V, and 3.3 V. Using the proposed gate charge sharing method, the maximum power efficiency is measured to be 87.2% at the total output current of 450 mA. The measured power efficiency improved by 2.1% compared with that of the SIMO DC-DC converter without the proposed gate charge sharing method.

Electronic Circuit Design for Portable Infrared Night Vision Scope (휴대용 적외선 야시경을 위한 전자회로설계)

  • Eom Ki-Hwan;Kim Doo-Hwan
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.43 no.2 s.308
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    • pp.33-39
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    • 2006
  • This paper designed the electronic circuit part of Potable Infrared Night Vision Scope for a small size, light weight, and low power. Designed electronic circuit part is composed of an Auto Voltage Selecting Module, and a Power Supply Module. An Auto Voltage Selecting Modulo is composed of a switch, a battery, a step up voltage part, and a selecting voltage part. A Power Supply Module is composed of a high luminous sensing part, a battery voltage sensing part, a infrared illumination part, a connection sensing part, and a power control part. And this module controls the power of Image Intensifier Tube. To verify the performance of the designed electronic circuit part, we experimented the consumption power and continuous using time. Experimental results show that the designed electronic circuit part improves considerably on the performance of the AN/PVS-14. performance.

Power Amplifiers and Transmitters for Next Generation Mobile Handsets

  • Choi, Jin-Sung;Kang, Dae-Hyun;Kim, Dong-Su;Park, Jung-Min;Jin, Bo-Shi;Kim, Bum-Man
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.9 no.4
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    • pp.249-256
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    • 2009
  • As a wireless handset deals with multiple application standards concurrently, RF transmitters and power amplifiers are required to be more power efficient and reconfigurable. In this paper, we review the recent advances in the design of the power amplifiers and transmitters. Then, the systematic design approaches to improve the performance with the digital baseband signal processing are introduced for the next generation mobile handset.

A Study of Analysis of Fault Data in AC Electrical Railway Power System Based on COMTRADE Using PSCAD/EMTDC (PSCAD/EMTDC를 활용한 COMTRADE 기반의 교류철도 급전계통 사고 데이터 분석에 관한 연구)

  • Lee, Ji-Hye;Min, Myung-Hwan;An, Tae-Pung;Lee, Byeong-Gon
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.67 no.11
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    • pp.1542-1548
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    • 2018
  • When any faults occurred in electrical railway system, operators need to analysis it quickly and accurately. Existing COMTRADE based analysis tools are not enough to analysis faults occurred in electrical railway system. In this paper, it presents some functions to fault analysis for electrical railway system based on fault data formatted COMTRADE. These functions are implemented in PSCAD/EMTDC and it can be shown that analyzed results against actual electrical fault cases which were occurred in the electrical railway power system.

Power Electronics Converter Education Program using LabVIEW (LabVIEW를 이용한 전력전자 컨버터 교육 프로그램)

  • Kim, Ju-Eun;Choi, Nam-Sup;Han, Byung-Moon
    • The Transactions of the Korean Institute of Power Electronics
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    • v.17 no.1
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    • pp.48-56
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    • 2012
  • This paper deals with power electronic converter education program using LabVIEW. LabVIEW is a graphic based programming language with easy debugging, which is suitable for education program that can be used to study and figure out the operation of power electronic converters. When LabVIEW is employed as a simulation program of the operation of power electronic converters, the resulting program has the advantage such that the effects of the change of control variables and circuit parameters on the various variables such as the output voltage and the inductor current etc can be directly displayed without any separate compiling procedure. This paper shows the design procedure and the characteristics of the power electronics education program implemented by LabVIEW focusing on DC-DC converter among power electronic converters.

Design of High Efficiency CMOS Class E Power Amplifier for Bluetooth Applications

  • Chae Seung Hwan;Choi Young Shig;Choi Hyuk Hwan;Kim Sung Woo;Kwon Tae Ha
    • Proceedings of the IEEK Conference
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    • 2004.08c
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    • pp.499-502
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    • 2004
  • A two-stage Class E power amplifier operated at 2.44GHz is designed in 0.25-$\mu$m CMOS process for Class-l Bluetooth application. The power amplifier employs c1ass-E topology to exploit its soft-switching property for high efficiency. A preamplifter with common-mode configuration is used to drive the output-stage of Class-E type. The amplifier delivers 20-dBm output power with 70$\%$ PAE (power -added-efficiency) at 2-V supply voltage.

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Large Area Wafer-Level High-Power Electronic Package Using Temporary Bonding and Debonding with Double-Sided Thermal Release Tape (양면 열박리 테이프 기반 임시 접합 공정을 이용한 대면적 웨이퍼 레벨 고출력 전자패키지)

  • Hwang, Yong-Sik;Kang, Il-Suk;Lee, Ga-Won
    • Journal of Sensor Science and Technology
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    • v.31 no.1
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    • pp.36-40
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    • 2022
  • High-power devices, such as LEDs and radars, inevitably generate a large amount of heat, which is the main cause of shortening lifespan, deterioration in performance, and failure of electronic devices. The embedded IC process can be a solution; however, when applied to large-area substrates (larger than 8 in), there is a limit owing to the difficulty in the process after wafer thinning. In this study, an 8-in wafer-level high-power electronic package based on the embedded IC process was implemented with temporary bonding and debonding technology using double-sided thermal release tape. Good heat-dissipation characteristics were demonstrated both theoretically and experimentally. These findings will advance the commercialization of high-power electronic packaging.

A Thermal Model for Electrothermal Simulation of Power Modules

  • Meng, Jinlei;Wen, Xuhui;Zhong, Yulin;Qiu, Zhijie
    • Journal of international Conference on Electrical Machines and Systems
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    • v.2 no.4
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    • pp.441-446
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    • 2013
  • A thermal model of power modules based on the physical dimension and thermal properties is proposed in this paper. The heat path in the power module is considered as a one-dimensional heat transfer in the model. The method of the parameters extraction for the model is given in the paper. With high speed and accuracy, the thermal model is suit for electrothermal simulation. The proposed model is verified by experimental results.

Switching Transient Shaping by Application of a Magnetically Coupled PCB Damping Layer

  • Hartmann, Michael;Musing, Andreas;Kolar, Johann W.
    • Journal of Power Electronics
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    • v.9 no.2
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    • pp.308-319
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    • 2009
  • An increasing number of power electronic applications require high power density. Therefore, the switching frequency and switching speed have to be raised considerably. However, the very fast switching transients induce a strong voltage and current ringing. In this work, a novel damping concept is introduced where the parasitic wiring inductances are advantageously magnetically coupled with a damping layer for attenuating these unwanted oscillations. The proposed damping layer can be implemented using standard materials and printed circuit board manufacturing processes. The system behavior is analyzed in detail and design guidelines for a damping layer with optimized RC termination network are given. The effectiveness of the introduced layer is determined by layout parasitics which are calculated by application of the Partial Element Equivalent Circuit (PEEC) simulation method. Finally, simulations and measurements on a laboratory prototype demonstrate the good performance of the proposed damping approach.