• Title/Summary/Keyword: Power Spots

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Performance evaluation of METAMIC neutron absorber in spent fuel storage rack

  • Kim, Kiyoung;Chung, Sunghwan;Hong, Junhee
    • Nuclear Engineering and Technology
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    • v.50 no.5
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    • pp.788-793
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    • 2018
  • High-density spent fuel (SF) storage racks have been installed to increase SF pool capacity. In these SF racks, neutron absorber materials were placed between fuel assemblies allowing the storage of fuel assemblies in close proximity to one another. The purpose of the neutron absorber materials is to preclude neutronic coupling between adjacent fuel assemblies and to maintain the fuel in a subcritical storage condition. METAMIC neutron absorber has been used in high-density storage racks. But, neutron absorber materials can be subject to severe conditions including long-term exposure to gamma radiation and neutron radiation. Recently, some of them have experienced degradation, such as white spots on the surface. Under these conditions, the material must continue to serve its intended function of absorbing neutrons. For the first time in Korea, this article uses a neutron attenuation test to examine the performance of METAMIC surveillance coupons. Also, scanning electron microscope analysis was carried out to verify the white spots that were detected on the surface of METAMIC. In the neutron attenuation test, there was no significant sign of boron loss in most of the METAMIC coupons, but the coupon with white spots had relatively less B-10 content than the others. In the scanning electron microscope analysis, corrosion material was detected in all METAMIC coupons. Especially, it was confirmed that the coupon with white spots contains much more corrosion material than the others.

Extraction of GCP from nighttime AVHRR image

  • Tamba, Sumio;Iikura, Yoshikazu
    • Proceedings of the KSRS Conference
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    • 2003.11a
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    • pp.770-772
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    • 2003
  • In this paper, to correct the error, we propose a method to estimate a correction data based on observation data obtained from MUBEX campaign. Many heat spots are correspond to industrial area including steel plant, power plant and so on. Heat spot transmits some kinds of thin cloud because it emits large radiance, so that it is possible to extract GCP from the area under the thin cloud.

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Analysis on Temper Embrittlement and Metastable Phase of Martensitic Stainless Steel (마르텐사이트계 스테인리스강의 템퍼 취성과 준안정상에 관한 분석)

  • Lee, Gil Jae;Choe, Byung Hak;Kim, Jae Hoon
    • Journal of the Korean Society for Heat Treatment
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    • v.34 no.1
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    • pp.1-9
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    • 2021
  • The martensitic stainless steel has excellent corrosion resistance and higher strength by quenching and tempering heat treatment. It has been widely used as blade material due to these properties. The hardness and impact toughness of martensitic stainless steel depended strongly on tempering temperatures. The 12Cr martensite stainless steel (SS 410) tempered about 540℃ showed temper embrittlement. To know cause of temper embrittlement in terms of phase identification, a detailed analysis of electron diffraction patterns during TEM observations has been carried out on the <110>α-Fe and <113>α-Fe zone axes for temper embrittlement specimen. The double electron diffraction spots at 1/3(211) and 2/3(211) positions were observed. The lattice space between individual diffraction spots was about 3.5 Å and this value coincide with three times to α-bcc lattice space (1.17 Å). The area which found double diffraction spots was judged metastable "zone" similar to the omega phase and induced embrittlement of SS410 material.

Hot Spot Detection of Thermal Infrared Image of Photovoltaic Power Station Based on Multi-Task Fusion

  • Xu Han;Xianhao Wang;Chong Chen;Gong Li;Changhao Piao
    • Journal of Information Processing Systems
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    • v.19 no.6
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    • pp.791-802
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    • 2023
  • The manual inspection of photovoltaic (PV) panels to meet the requirements of inspection work for large-scale PV power plants is challenging. We present a hot spot detection and positioning method to detect hot spots in batches and locate their latitudes and longitudes. First, a network based on the YOLOv3 architecture was utilized to identify hot spots. The innovation is to modify the RU_1 unit in the YOLOv3 model for hot spot detection in the far field of view and add a neural network residual unit for fusion. In addition, because of the misidentification problem in the infrared images of the solar PV panels, the DeepLab v3+ model was adopted to segment the PV panels to filter out the misidentification caused by bright spots on the ground. Finally, the latitude and longitude of the hot spot are calculated according to the geometric positioning method utilizing known information such as the drone's yaw angle, shooting height, and lens field-of-view. The experimental results indicate that the hot spot recognition rate accuracy is above 98%. When keeping the drone 25 m off the ground, the hot spot positioning error is at the decimeter level.

Major environmental factors and traits of invasive alien plants determining their spatial distribution

  • Oh, Minwoo;Heo, Yoonjeong;Lee, Eun Ju;Lee, Hyohyemi
    • Journal of Ecology and Environment
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    • v.45 no.4
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    • pp.277-286
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    • 2021
  • Background: As trade increases, the influx of various alien species and their spread to new regions are prevalent and no longer a special problem. Anthropogenic activities and climate changes have made the distribution of alien species out of their native range common. As a result, alien species can be easily found anywhere, and they have nothing but only a few differences in intensity. The prevalent distribution of alien species adversely affects the ecosystem, and a strategic management plan must be established to control them effectively. To this end, hot spots and cold spots were analyzed according to the degree of distribution of invasive alien plants, and major environmental factors related to hot spots were found. We analyzed the 10,287 distribution points of 126 species of alien plants collected through the national survey of alien species by the hierarchical model of species communities (HMSC) framework. Results: The explanatory and fourfold cross-validation predictive power of the model were 0.91 and 0.75 as AUC values, respectively. The hot spots of invasive plants were found in the Seoul metropolitan area, Daegu metropolitan city, Chungcheongbuk-do Province, southwest shore, and Jeju island. Generally, the hot spots were found where the higher maximum temperature of summer, precipitation of winter, and road density are observed, but temperature seasonality, annual temperature range, precipitation of the summer, and distance to river and sea were negatively related to the hot spots. According to the model, the functional traits accounted for 55% of the variance explained by the environmental factors. The species with higher specific leaf areas were more found where temperature seasonality was low. Taller species preferred the bigger annual temperature range. The heavier seed mass was only preferred when the max temperature of summer exceeded 29 ℃. Conclusions: In this study, hot spots were places where 2.1 times more alien plants were distributed on average than non-hot spots (33.5 vs 15.7 species). The hot spots of invasive plants were expected to appear in less stressful climate conditions, such as low fluctuation of temperature and precipitation. Also, the disturbance by anthropogenic factors or water flow had positive influences on the hot spots. These results were consistent with the previous reports about the ruderal or competitive strategies of invasive plants instead of the stress-tolerant strategy. The functional traits are closely related to the ecological strategies of plants by shaping the response of species to various environmental filters, and our result confirmed this. Therefore, in order to effectively control alien plants, it is judged that the occurrence of disturbed sites in which alien plants can grow in large quantities is minimized, and the river management of waterfronts is required.

Effect of Harmonic Generation and Countermeasures (고조파발생에 따른 영향과 대책 연구)

  • Baek, Dong-Hyun
    • Fire Science and Engineering
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    • v.29 no.6
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    • pp.91-97
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    • 2015
  • Skyscrapers, large business buildings, and IT consumers use many appliances, and the electrical power stems can cause fires by overheating. This can result in damaged capacitors, lost data, rising ground potential, and communication obstacles from linear or nonlinear high frequency. To make sure of that we investigated 7 spots of a building, among which 6-spots were fair but the other one needed high frequency control. Spots 3, 6, and 7 needed diagnostic workup, and spots 2, 3, and 5 considered 5 high frequency currents. A phase is all of good but the high frequency current is greater than the standard level except for spot 1. As a result, a zigzag transformer or active filter needs to be installed, and the efficiency needs to be upgraded by investigating load unbalance factors and power factors.

The Effect of Thermal Concentration in Thermal Chips

  • Choo, Kyo-Sung;Han, Il-Young;Kim, Sung-Jin
    • Proceedings of the KSME Conference
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    • 2007.05b
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    • pp.2449-2452
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    • 2007
  • Hot spots on thin wafers of IC packages are becoming important issues in thermal and electrical engineering fields. To investigate these hot spots, we developed a Diode Temperature Sensor Array (DTSA) that consists of an array of 32 ${\times}$32 diodes (1,024 diodes) in a 8 mm ${\times}$ 8 mm surface area. To know specifically the hot spot temperature which is affected by the chip thickness and a generated power, we made the DTSA chips, which have 21.5 ${\mu}m$, 31 ${\mu}m$, 42 ${\mu}m$, 100 ${\mu}m$, 200 ${\mu}m$, and 400 ${\mu}m$ thickness using the CMP process. And we conducted the experiment using various heater power conditions (0.2 W, 0.3 W, 0.4 W, 0.5 W). In order to validate experimental results, we performed a numerical simulation. Errors between experimental results and numerical data are less than 4%. Finally, we proposed a correlation for the hot spot temperature as a function of the generated power and the wafer thickness based on the results of the experiment. This correlation can give an easy estimate of the hot spot temperature for flip chip packaging when the wafer thickness and the generated power are given.

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Generated heat decrease of resistive superconducting fault current limiter using diodes (Diode를 이용한 저항형 초전도 한류기의 열발생 저감방안)

  • Choi, Hyo-Sang;Hyun, Ok-Bae;Kim, Hye-Rim;Hwang, Si-Dole;Kim, Sang-Joon
    • Proceedings of the KIEE Conference
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    • 2000.07b
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    • pp.925-927
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    • 2000
  • We fabricated a resistive superconducting fault current limiter of meander type based on a YBCO film. In order to disperse the heat generated at hot spots in the YBCO film the film was coated with a gold shunt layer. When diodes were inserted in the parallel circuit to restrict the temperature increase in the SFCL element by reducing power supply cycles, the voltage could be increased to $\sqrt{2}$ times with the same quench resistance at a half and full cycles.

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Thermal Performance Analysis for Cu Block and Dense Via-cluster Design of Organic Substrate in Package-On-Package

  • Lim, HoJeong;Jung, GyuIk;Kim, JiHyun;Fuentes, Ruben
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.4
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    • pp.91-95
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    • 2017
  • Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

Combined Microwave-Convective Drying of Wood Veneer 1 : Drying Characteristics of Radiata Pine Veneer Grown in New Zealand (목재단판의 마이크로파-열풍 병용 건조 1: 뉴질랜드산 라디아타 소나무 단판의 건조특성)

  • Lee, Hyoung-Woo
    • Journal of the Korean Wood Science and Technology
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    • v.32 no.1
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    • pp.45-51
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    • 2004
  • Combined microwave-convective drying of 2.4mm-thick radiata pine veneer grown in New Zealand was conducted to investigate drying characteristics. The veneers could be dried from 160% to 0% moisture content in 7.5 min by microwave drying combined with hot-air of 100℃. This drying rate is about three times higher than that of conventional convective drying with only hot air of 100℃. However there remained charred spots when too high microwave power was applied. Therefore investigations of the microwave-drying characteristics of veneer of various sizes and species are needed to determine the optimal drying conditions.