• 대한치과재료학회지
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• 제44권1호
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• pp.61-68
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• 2017

본 연구는 MDP 적용 후 타액으로 오염된 지르코니아 수복물을 다양한 방법으로 세척한 후 전단결합강도를 비교하여 세척방법이 결합강도에 미치는 영향을 알아보고자 한다. 80개의 지르코니아 시편을 8개의 군으로 나누었다. 모든 시편에 MDP를 적용한 후 한 개의 군(음성대조군)을 제외하고 나머지 군에 타액을 적용하여 오염시켰다. 그 중 한 개의 군(양성대조군)은 타액 오염 후 세척하지 않고 즉시 레진 시멘트를 이용하여 접착하였다. 나머지 6개의 군의 시편을 물을 이용하여 세척하고 MDP를 적용하거나(물+MDP) 적용하지 않은 군(물), Ivoclean으로 세척하고 MDP를 적용하거나(IVOCLEAN+MDP) 적용하지 않은 군(IVOCLEAN), 차아염소산나트륨을 이용하여 세척하고 MDP를 적용하거나(NaOCl+MDP) 적용하지 않은 군(NaOCl)으로 분류하였다. 모드 시편은 $37^{\circ}C$ 증류수에 24시간 저장한 후 전단강도를 측정하였고, ANOVA, Tukey's post hoc test를 이용하여 전단강도를 분석하였고, MDP의 재적용 여부가 미치는 영향에 대해서는 student t-test를 이용하여 통계분석하여 다음의 결과를 얻었다. 양성대조군이 가장 낮은 전단강도 값을 나타냈으며, 물군과 NaOCl군이 낮은 전단강도 값을 나타내며 양성대조군과 유의한 차이가 없었다. IVOCLEAN군은 물군과 NaOCl군보다 유의하게 높은 전단강도 값을 나타내며 음성대조군과 유의한 차이가 없었다. MDP를 재적용한 것은 물과 차아염소산나트륨을 이용한 경우 MDP를 재적용하지 않은 경우와 유의한 차이를 나타내면서 음성대조군과 유의한 차이가 없었다. Ivoclean을 사용한 경우 MDP 재적용 여부와는 관계없이 음성대조군과 유의한 차이가 없었다. 결론적으로, 세척방법에 따라 전단강도는 영향을 받으며, MDP 재적용 여부와는 관계없이 Ivoclean이 효과적이며, 물과 차아염소산나트륨 사용시에는 MDP를 다시 적용해주는 것이 결합강도를 향상시킬 수 있는 방법으로 사료된다.

• 한국식품저장유통학회지
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• 제17권3호
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• pp.405-409
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• 2010

현재 대부분의 수삼은 흙이 묻은 상태로 유통되고 있는데 소비자의 편이성을 고려하여 수삼을 세척한 후 포장한 상태로 유통시키기 위한 연구의 일환으로 수삼의 세척처리 방법에 따른 표면세척효과 및 미생물 감균 효과를 조사하였다. 수확 직후 수삼의 부위별 생균수는 5.85~6.63 log CFU/ea범위로 뇌두 부위가 가장 많았고 다음으로는 지근과 주근 순이었다. 부위별 곰팡이 수는 3.67~5.12 log CFU/ea범위로 뇌두 부위가 많았으며 주근과 지근은 거의 유사한 수준이었다. 수삼표면을 상압살수, 고압살수 및 솔질 처리를 하였던 바 고압살수처리에 의해 세척도가 증가하고, 표면 미생물을 감소시킬 수 있었으나 그 효과는 솔질처리의 경우보다는 낮았다. 세척한 수삼의 표면 미생물 수를 더 낮추기 위해 부가적으로 에탄올용액, 차아염소산나트륨 용액, 과산화수소용액, 전해산화수, 오존수 및 중온수를 각각 처리하였던 바 전해산화수 처리 시 생균수와 곰팡이 수가 세척한 수삼에 비해 각각 0.79 CFU/ea, 0.51 log CFU/ea 정도 감소하여 다른 처리구에 비하여서는 우수하였으나 처리구간의 통계적인 유의성은 인정되지 않았다.

• Korean Chemical Engineering Research
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• 제54권4호
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• pp.548-554
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• 2016

Damascene 구조를 갖는 반도체소자의 구리금속배선 식각공정에서 배선재료에 의해서 발생되는 구리 식각잔류물을 제거하기 위해 oxalic acid (OA), lactic acid (LA) 및 citric acid (CA)의 카르복시산 함유된 반수계 혼합세정액을 제조하고 특성을 분석하였다. 카르복시산은 pH에 따라 카르복실기와 구리이온들과의 다양한 복합체를 형성하며 세정특성의 변화를 준다. 카르복시산들이 함유된 각각의 세정액의 세정특성평가결과 10 wt% CA를 함유한 반수계 세정액의 식각잔류물 세정특성은 pH 2에서 7까지의 영역에서 가장 낮은 구리 식각률을 보였으며 pH 2에서 4까지 구리에 대한 구리산화물의 가장 높은 식각 선택도를 나타내었으나 pH 5에서 7 범위에서는 10 wt% LA가 함유된 세정액이 더 높은 선택도를 보였다. 따라서 표면세정효과는 pH에 따라 변화하며 적절한 카르복시산을 사용함이 요구된다. CA가 함유된 세정액의 경우에 CA 농도와 구리에 대한 구리산화물의 식각 선택도의 증가특성을 보이며 CA가 5 wt%이상 함유된 경우에는 세정 후 구리배선의 표면이 88 %이상의 금속구리로 분석되어 구리산화물로 구성된 식각 잔류물의 제거에 효과적임을 알 수 있었다.

• 한국염색가공학회지
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• 제22권3호
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• pp.194-206
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• 2010

This study was carried out to identify the optimum dyeing conditions for maximum dye uptake of Prunus yedoensis Matsumura flower extract on silk fabric and to investigate hue/tone characteristics and fastness properties of the dyed fabrics. As results, the flower extract was found to contain flavonoids by FT-IR and to show yellowish shade by UV-vis spectrum. Silk fabric was optimized for maximum dye uptake to five repetitions of dyeing at $80^{\circ}C$ for 60 min with an extract concentration of 600% owf in terms of both K/S and color differences. Pre-mordanting was more effective to dye uptake than post-mordanting for all of the mordants used. Un-mordanted and pre-mordanted fabric showed YR(Yellow Red) while most of post-mordanted ones did Y(Yellow). Main tones of dyed fabrics were sf(soft) and lt(light) in the case of unmordanting or Al-mordanting whereas they were d(dull) and g(grayish) by post-mordanting with Cu, Cr, and Fe, respectively. The fastness grades to rub and dry cleaning were reasonably good for most dyeing conditions while those to light were poor. Finally dyeing condition for each hue/tone of the dyed silk with the flower extract was optimized considering fastness properties.

• 한국재료학회지
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• 제18권4호
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• pp.204-210
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• 2008

$1.5\;{\mu}m$-thick copper films deposited on silicon wafers were successfully bonded at $415^{\circ}C$/25 kN for 40 minutes in a thermo-compression bonding method that did not involve a pre-cleaning or pre-annealing process. The original copper bonding interface disappeared and showed a homogeneous microstructure with few voids at the original bonding interface. Quantitative interfacial adhesion energies were greater than $10.4\;J/m^2$ as measured via a four-point bending test. Post-bonding annealing at a temperature that was less than $300^{\circ}C$ had only a slight effect on the bonding energy, whereas an oxygen environment significantly deteriorated the bonding energy over $400^{\circ}C$. This was most likely due to the fast growth of brittle interfacial oxides. Therefore, the annealing environment and temperature conditions greatly affect the interfacial bonding energy and reliability in Cu-Cu bonded wafer stacks.

• The Journal of Advanced Prosthodontics
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• 제14권1호
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• pp.45-55
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• 2022

PURPOSE. This in vitro study investigates the effect of different post-rinsing times and methods on the trueness and precision of denture base resin manufactured through stereolithography. MATERIALS AND METHODS. Ninety clear photopolymer resin specimens were fabricated and divided into nine groups (n = 10) based on rinsing times and methods. All specimens were rinsed with 99% isopropanol alcohol for 5, 10, and 15 min using three methods-automated, ultrasonic cleaning, and hand washing. The specimens were polymerized for 30 min at 40℃. For trueness, the scanned intaglio surface of each SLA denture base was superimposed on the original standard tessellation language (STL) file using best-fit alignment (n = 10). For precision, the scanned intaglio surface of the STL file in each specimen group was superimposed across each specimen (n = 45). The root mean square error (RMSE) was measured, and the data were analyzed statistically through one-way ANOVA and Tukey test (α < .05). RESULTS. The 10-min automated group exhibited the lowest RMSE. For trueness, this was significantly different from specimens in the 5-min hand-washed group (P < .05). For precision, this was significantly different from those of other groups (P < .05), except for the 15-min automated and 15-min ultrasonic groups. The color map results indicated that the 10-min automated method exhibited the most uniform distribution of the intaglio surface adaptation. CONCLUSION. The optimal postprocessing rinsing times and methods for achieving clear photopolymer resin were found to be the automated method with rinsing times of 10 and 15 min, and the ultrasonic method with a rinsing time of 15 min.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 하계학술대회 논문집 C
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• pp.1600-1604
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis of used slurry.

• 한국환경과학회지
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• 제7권1호
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• pp.74-80
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• 1998

Because permeate flux was very low as It has the suspension soled of higher concentration In the trafiltration membrane separation treatment of dyestuff wastewater, pre-treatment of Ponton reaction was carried out. In the case of pH 3, COD removal rate was the hi각erst of 58%. When PAC was added into the pre-treatment supernatant, the COD removal rate was found to be 53% , and when COD was 153mg/L, the removal rate was 92.3% in the trafiltration separation. In addition, the effect of the addition of PAC on the permeate flux was also investigated. The decrease of permeate flux In the presence of PAC was higher than In the abscence of PAC, but the recovery of permeability by cleaning was better In the case of PAC system.

• Journal of Information Display
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• 제7권1호
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• pp.1-6
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• 2006

A 10" carbon nanotube field emission display device was fabricated with a novel structure with a hopping electron spacer (HES) by screen printing technique. HES plays a role of preventing the broadening of electron beams emitted from carbon nanotubes without electrical discharge during operation. The structure of the novel tetrode is composed of carbon nanotube emitters on a cathode electrode, a gate electrode, an extracting electrode coated on the top side of a HES, and an anode. HES contains funnel-shaped holes of which the inner surfaces are coated with MgO. Electrons extracted through the gate are collected inside the funnel-shaped holes. They hop along the hole surface to the top extracting electrode. In this study the effects of the addition of HES on emission characteristics of field emission display were investigated. An active ozone treatment for the complete removal of residues of organic binders in the emitter devices was applied to the field emission display panel as a post-treatment.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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• pp.93-96
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis of used slurry.