• Title/Summary/Keyword: Position Process

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A Study on the Methods for Finding Initial Equilibrium Position of a Lifting Block for the Safe Erection (블록의 탑재 안전성을 위한 초기 평형 자세 탐색 방법 연구)

  • Chun, Do-Hyun;Roh, Myung-Il;Ham, Seung-Ho;Lee, Hye-Won
    • Journal of the Society of Naval Architects of Korea
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    • v.55 no.4
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    • pp.297-305
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    • 2018
  • In a shipyard, block lifting is an important process in the production of ships and offshore structures. Block lifting is a sensitive process because lifting blocks have to be erected with exact positions and orientations. If we use a numerical method for the process, it is important to find tensions of wires and positions of equalizers to maintain the initial equilibrium position of the block. At this time, equations of motion of the block should be solved to calculate the initial equilibrium position of the block. Because the solving technique changes according to the number of equalizers, a suitable equation for the corresponding problem is required. In this study, three types of equations are proposed to find the initial equilibrium position of the block according to the number of equalizers. The Newton-Raphson's method is used to solve nonlinear simultaneous equations and the optimization method is used to determine the appropriate solution to the undetermined problem. To evaluate the applicability of the proposed methods, the dynamic simulations are performed using the tensions calculated from the proposed methods, and the results are discussed. The results show that the proposed methods can be effectively used to determine initial equilibrium position of the block for the block lifting.

TRIZ-based Improvement of Glass Thermal Deformation in OLED Deposition Process (트리즈 기반 OLED 증착 공정의 글래스 열 변형 개선)

  • Lee, Woo-Sung;Choi, Jin Young
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.40 no.1
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    • pp.114-123
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    • 2017
  • The global small and mid-sized display market is changing from thin film transistor-liquid crystal display to organic light emitting diode (OLED). Reflecting these market conditions, the domestic and overseas display panel industry is making great effort to innovate OLED technology and incease productivity. However, current OLED production technology has not been able to satisfy the quality requirement levels by customers, as the market demand for OLED is becoming more and more diversified. In addition, as OLED panel production technology levels to satisfy customers' requirement become higher, product quality problems are persistently generated in OLED deposition process. These problems not only decrease the production yield but also cause a second problem of deteriorating productivity. Based on these observations, in this study, we suggest TRIZ-based improvement of defects caused by glass pixel position deformation, which is one of quality deterioration problems in small and medium OLED deposition process. Specifically, we derive various factors affecting the glass pixel position shift by using cause and effect diagram and identify radical reasons by using XY-matrix. As a result, it is confirmed that glass heat distortion due to the high temperature of the OLED deposition process is the most influential factor in the glass pixel position shift. In order to solve the identified factors, we analyzed the cause and mechanism of glass thermal deformation. We suggest an efficient method to minimize glass thermal deformation by applying the improvement plan of facilities using contradiction matrix in TRIZ. We show that the suggested method can decrease the glass temperature change by about 23% through an experiment.

CFD Analysis on the Fresh Air Distribution in the Catalytic Converter Varying Secondary Air Injector Position (2차 공기 분사 위치에 따른 촉매 내 공급 공기 분포에 대한 전산 유동해석)

  • Yun, Jeong-Eui
    • Transactions of the Korean Society of Automotive Engineers
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    • v.18 no.5
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    • pp.31-36
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    • 2010
  • SAI(Secondary Air Injection) system has been studied widely as one of the promising countermeasure for reducing HC emission at cold start. In this paper, in order to find out the optimal position of SAI, computational thermal fluid analysis on exhaust system adapted SAI system is performed using commercial 3-D CFD code, CFX. The present results showed that SAI position strongly affected the uniformity of air distribution in front of catalyst. And also through the decision process of optimal position of SAI, new index, uniformity of air distribution($U_{\phi}$) is proposed to define it quantitively. Because $U_{\phi}$ is very simple equation and similar with flow uniformity, it is very easy to figure out the physical meaning and to apply it to practices. Finally, we applied the index $U_{\phi}$ to the decision process of the optimal position of SAI, so that we could get the clear comparison results.

Efficient Mobile Robot Localization through Position Tracking Bias Mitigation for the High Accurate Geo-location System (고정밀 위치인식 시스템에서의 위치 추적편이 완화를 통한 이동 로봇의 효율적 위치 추정)

  • Kim, Gon-Woo;Lee, Sang-Moo;Yim, Chung-Hieog
    • Journal of Institute of Control, Robotics and Systems
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    • v.14 no.8
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    • pp.752-759
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    • 2008
  • In this paper, we propose a high accurate geo-location system based on a single base station, where its location is obtained by Time-of-Arrival(ToA) and Direction-of-Arrival(DoA) of the radio signal. For estimating accurate ToA and DoA information, a MUltiple SIgnal Classification(MUSIC) is adopted. However, the estimation of ToA and DoA using MUSIC algorithm is a time-consuming process. The position tracking bias is occurred by the time delay caused by the estimation process. In order to mitigate the bias error, we propose the estimation method of the position tracking bias and compensate the location error produced by the time delay using the position tracking bias mitigation. For accurate self-localization of mobile robot, the Unscented Kalman Filter(UKF) with position tracking bias is applied. The simulation results show the efficiency and accuracy of the proposed geo-location system and the enhanced performance when the Unscented Kalman Filter is adopted for mobile robot application.

Effect Analysis of Carrier Pinhole Position Error on the Load Sharing and Load Distribution of a Planet Gear (캐리어의 핀홀 위치 오차에 따른 유성기어의 하중 분할 및 하중 분포 영향 분석)

  • Kim, Jeong-Gil;Park, Young-Jun;Lee, Geun-Ho;Kim, Young-Joo;Oh, Joo-Young;Kim, Jae-Hoon
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.15 no.5
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    • pp.66-72
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    • 2016
  • Gearboxes are mechanical components that transmit power by adjusting input and output speed and torque. Their design requirements include small size, light weight, and long lifespan. We have investigated the effects of carrier pinhole position error on the load sharing and load distribution characteristics of a planetary gear set with four planet gears. The simulation model for a simple planetary gear set was developed and verified by comparing analytical results with a putative model. Then, we derived the load sharing and load distribution characteristics under various pinhole position error conditions using the prototypical simulation model. The results showed that the mesh load factor and face load factor increased with the pinhole position error, which then influenced the safety factor for tooth bending strength and surface durability.

Automated Visual Inspection System of Double Gear using Inspection System (더블기어 자동 시각 검사 시스템 실계 및 구현)

  • Lee, Young Kyo;Kim, Young Po
    • Journal of Korea Society of Digital Industry and Information Management
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    • v.7 no.4
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    • pp.81-88
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    • 2011
  • Mini Double Gears Frame is critical part of PDP and also produces couple hundred thousand every month. In the process of mass production, product inspection is very important process. Double Gear, one of the part of machine, was inspected by human eyes which caused mistakes and slow progress. To achieve the speed and accuracy the system was compensated by vision system which is inspecting automatically. The focus value is measured based on the fact that high contrast images have much high frequency edge information. High frequency term of the image is extracted using the high-pass filter and the sum of the high frequency term is used as the focus value. We used a Gaussian smoothing filter to reduce the noise and then measures the focus value using the modified Laplacian filter called a Sum modified Laplacian Focus values for the various lens positions are calculated and the position with the maximum focus value is decided as the focused position. The focus values calculated in various lens position showed the Gaussian distribution. We proposed a method to estimate the best focus position using the Gaussian curve fitting. Focus values of the uniform interval lens positions are calculated and the values are used to estimate the Gaussian distribution parameters to find the best focus position.

A Study on RUP based Component Quality Evaluation (RUP기반 컴포넌트 품질 평가에 관한 연구)

  • O, Gi-Seong;Ryu, Seong-Yeol
    • The KIPS Transactions:PartD
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    • v.9D no.1
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    • pp.103-110
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    • 2002
  • In component-Based Software Development, the quality of indivisual component is play an important role in quality decision of the whole software. So we need the practical strategy for component testing. In general, component testing can divide focus into producer position and consumer position. In this paper, because the consumer position uses output of the producer position, testing domain is deployed in the producer position. We propose RUP based five step testing processes for component quality evaluation and implements a case study of EJB environment for appling our testing process. This paper shows that proposed five step processes are applicable to component quality evaluation.

The Failure Mode and Effects Analysis Implementation for Laser Marking Process Improvement: A Case Study

  • Deng, Wei-Jaw;Chiu, Chung-Ching;Tsai, Chih-Hung
    • International Journal of Quality Innovation
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    • v.8 no.1
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    • pp.137-153
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    • 2007
  • Failure mode and effects analysis (FMEA) is a preventive technique in reliability management field. The successful implementation of FMEA technique can avoid or reduce the probability of system failure and achieve good product quality. The FMEA technique had applied in vest scopes which include aerospace, automatic, electronic, mechanic and service industry. The marking process is one of the back ends testing process that is the final process in semiconductor process. The marking process failure can cause bad final product quality and return although is not a primary process. So, how to improve the quality of marking process is one of important production job for semiconductor testing factory. This research firstly implements FMEA technique in laser marking process improvement on semiconductor testing factory and finds out which subsystem has priority failure risk. Secondly, a CCD position solution for priority failure risk subsystem is provided and evaluated. According analysis result, FMEA and CCD position implementation solution for laser marking process improvement can increase yield rate and reduce production cost. Implementation method of this research can provide semiconductor testing factory for reference in laser marking process improvement.

A Study on the Weld Line Position for Hydroforming (Weld line위치에 따른 Hydroforming특성에 관한 연구)

  • 강대철;윤석만;전병희;오수익;전한수
    • Transactions of Materials Processing
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    • v.9 no.5
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    • pp.504-511
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    • 2000
  • Hydroforming is a forming process enabling circular metal tubes to be produced in complex cross sections along curved axial paths. This forming process is widely used to manufacture parts in automotive industry. This paper presents bending and forming results to following angle of weld line positions. These compare to good bending, bad bending and without weld line model case. And then this result of after forming compare to each forming cases. The purpose of this paper is found that adaptive weld line position for bended final shape.

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Dicing of GAN Wafer (GAN 웨이퍼의 다이싱)

  • 최범식;차영엽
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.10a
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    • pp.484-487
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    • 1997
  • The dicing is a process of gaining chip from a wafer. It is done by some mechanism to lengthwise and crosswise. Here, it is focused on measuring a depth of the wafer hefore a process of the dicing. First of all, it checks a precise outer position for the wafer on table to gain the chip. Second, the xafer should he lined after Imowing how much depth, it is in out of the outer position of the wafer. Here suggests that there are a composition of mechanical system, how to measure a depth out of scriber axis, a result from testing.

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