• Title/Summary/Keyword: Polymer viscosity

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Convective Heat Transfer of a Paraffin Slurry in a Drag Reducing Carrier Fluid (유동저항 감소유체를 운반유체로 한 파라핀 슬러리의 대류 열전달에 관한 연구)

  • 정동주;최은수
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.13 no.12
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    • pp.1275-1281
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    • 2001
  • Aqueous polymer solutions are known to have small pressure reduction. Paraffin slurries are known to have high thermal capacity. Paraffin particles are mixed into an aqueous polymer solution to make a new heat transfer fluid having high thermal capacity but low pressure reduction. The heat transfer characteristics of the new slurry was tested in a circular tube having a constant heat transfer boundary condition. The new slurry was found to have high Nusselt numbers as well as high thermal capacity and low pressure reduction in the laminar flow. The trends of the Nusselt numbers along the heating test section were studied for various heating conditions.

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Study on Property Modification with Fire Retardant Content in the Manufacture of Compounds for Cable Sheath (전선피복용 컴파운드의 제조에서 난연제의 첨가량에 따른 물성 변화 연구)

  • Li, Xiangxu;Lee, Sang Bong;Cho, Ur Ryong
    • Journal of the Semiconductor & Display Technology
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    • v.18 no.3
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    • pp.47-51
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    • 2019
  • The three different polymer compounds were manufactured with the three different fire retardant (silane coated magnesium dihydroxide) contents, 180, 200, 220 phr, for making cable sheath for ship industry. In the research, ethylene-vinylacetate, polyethylene as matrix polymers and ethylene-vinylacetate grafted maleic anhydride as coupling agent were selected for compounding with fire retardant, closslinking agent, plasticizer, and other additives. In the evaluation. ΔT, Mooney viscosity, and tensile strength increased with the content of fire retardant. But it was found that too much fire retardant damaged aging resistance and cold resistance of the polymer compound.

Fabrication of polymer thick film resistor and study on resistance variation regarding curing temperature (폴리머 후막 저항체의 제작 및 경화 온도에 따른 저항 값 변화에 대한 연구)

  • Yoo, Myong-Jae;Lee, Sang-Myong;Park, Seong-Dae;Kang, Nam-Kee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.212-213
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    • 2006
  • Polymer thick film resistor paste was fabricated using various materials. Inorganic materials of carbon black and graphite were selected as fillers and epoxy resin was selected as organic material. Solvent with high boiling temperature was applied to adjust viscosity. A designed test coupon pattern was used to evaluate fabricated resistors. Aspect ratio of 1 was selected for evaluating resistor values. Electrical properties of fabricated resistors were measured and their values analyzed in relation to paste composition. PTF fabricated using carbon black as fillers achieved resistor value of $530{\Omega}/sq$.

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Experimental Study on Spin Coated Thin Cover Layer for High Numerical Aperture Optical Disc

  • Dohoon Chang;Myongdo Ro;Duseop Yoon;Park, Insik;Dongho Shin;Kim, Jinhwan
    • Macromolecular Research
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    • v.9 no.6
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    • pp.313-318
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    • 2001
  • The present study relates to a method of manufacturing 100$\mu\textrm{m}$ thick cover layer for the high density digital versatile disc system (HD-DVD), which uses a high numerical aperture of 0.85 at 405 nm wavelength. Spin coating technique was investigated as means for manufacturing the cover layer within sufficient margins of thickness variation and with good mechanical properties including small radial and tangential tilts. The influence of processing variables such as spinning speed, spinning time, and dispensing position was investigated. The effect of viscosity of UV-curable resin was also investigated.

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Relationship between Physical and Chemical Properties of Frying Vegetable Oils (가열산화에 의한 대두유와 면실유의 물리화학적 특성변화와 상관관계)

  • 이근태;박성민;황영길;강옥주
    • Journal of the Korean Society of Food Science and Nutrition
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    • v.23 no.4
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    • pp.654-659
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    • 1994
  • To elucidate the relationship between physical and chemical properties of frying vegetable oils, soybean oil and cottonseed oil were heated in air temperatures from $160^{\circ}C\;to\;220^{\circ}C$ for 60 hours. Acid value, carbonyl value, iodine value, viscosity and content of polymer were remarkably changed as higher heating temperature and/or longer heating time. Correlation coefficient of viscosity to acid value was 0.9843 for soybean oil and 0.9819 for cottonseed oil. In case of viscosity and carbonyl value, viscosity also showed good relationship to carbonyl value as 0.9779 for soybean oil and 0.9797 for cottonseed oil. And correlation coefficient of viscosity to iodine value of soybean oil was 0.9852 and cottonseed oil was 0.9948.

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Synthesis of N-p-Nitrophenyl Poly(m-Phenylene Isophthalamide (N-p-Nitrophenyl Poly(m-Phenylene Isophthalamide)의 합성)

  • Hongbum Kim;Donghyun Kim;Jaewung Lee;Sangyeop Song;Nakjoong Kim
    • Journal of the Korean Chemical Society
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    • v.37 no.2
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    • pp.249-254
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    • 1993
  • N-p-nitrophenyl poly(m-phenylene isophthalamide) was obtained from treatment of poly(m-phenylene isophthalamide) with sodium hydride in dimethyl sulfoxide followed by the addition of 1-fluoro-4-nitrobenzene in 43 wt% yield. Its inherent viscosity was 0.606 g/cm${\cdot}$sec determined from a solution of 0.125 g of the above polymer dissolved in 25 ml of 98% sulfuric acid at $30^{\circ}C.$ In order to synthesize poly(m-phenylene isophthalamide), 1,3-phenylenediamine is allowed to react with isophthaloyl chloride in chloroform in the presence of triethylamine and added triethylamine hydrochloride. The value of inherent viscosity is 0.560 g/cm${\cdot}$sec measured at the same condition. The substitution ratio of N-p-nitrophenyl poly(m-phenylene isophthalamide) was to be 16.7∼47.0% by using the $^1H-NMR$ integration. When the higher inherent viscosity of poly(m-phenylene isophthalamide) was used, lower substitution ratio would be calculated.

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Properties of Bacterial Cellulose Cultured in Different Carbon Sources (탄소원에 따른 Bacterial Cellulose 의 물성)

  • Park, Sang-Min;Yoon, Sang-Jun;Son, Hong-Joo;Lee, Chung-Yeol;Kim, Hong-Sung
    • Polymer(Korea)
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    • v.34 no.6
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    • pp.522-526
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    • 2010
  • Bacterial cellulose is produced by the bacterium Gluconacetobacter xylinus, which forms a nanofibrous pellicle in its culture medium. We studied properties of the bacterial cellulose such as crystallinity, viscosity, morphology, and mechanical properties according to the carbon source. Static cultures of Gluconacetobacter sp. V6 were performed in three kinds of media: standard Hestrin-Schramm medium, and modified medium with either glycerol or molasses as carbon sources. Cell growth and cellulose yield were increased in the glycerol and molasses media. The culture in the glycerol medium improved the physical properties of cellulose such as crystallinity, intrinsic viscosity, and breaking stress. However, the culture in the molasses medium decreased crystallinity, crystallite size, and intrinsic viscosity of cellulose. In summary, the cellulose yield was remarkably improved in the molasses medium, but with inferior structural properties.

Rheological Properties of Poly(lactic acid) Modified by Electron Beam Irradiation (전자선 조사로 개질된 PLA의 유변학적 물성)

  • Shin, Boo-Young;Kim, Bong-Shik
    • Polymer(Korea)
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    • v.34 no.5
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    • pp.485-489
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    • 2010
  • Poly(lactic acid)(PLA) has been modified by electron radiation in the presence of 5 phr glycidyl methacrylate (GMA) to enhance the melt strength of PLA. The modified PLA was prepared by varying the dose of irradiation and was characterized by observing the thermal properties, the melt viscoelastic properties and the gel fraction. The irradiated PLA with 300 kGy in the presence of 5 phr GMA showed drastically improved complex viscosity and storage modulus properties: a complex viscosity of about 210 times higher and a storage modulus of 14500 times higher than those of virgin PLA when measured at a frequency of 0.1 rad/s. Gel fraction study revealed that a branching reaction was more dominant than a crosslinking reaction when the PLA was irradiated with less than 200 kGy.

Effect of Aminosiloxane Modifier on Chemorheological Properties of Ortho-cresol Novolac Epoxy (Ortho-cresol Novolac형 에폭시의 화학레올로지 특성에 미치는 아민 개질제의 영향)

  • 김윤진;안병길;김우년;서광석;김환건;윤초규
    • Polymer(Korea)
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    • v.26 no.1
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    • pp.88-97
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    • 2002
  • The effect of aminosiloxane modifier on the chemorheological properties of ortho-cresol novolac epoxy/phenol novelac/triphnylphosphine resin system was investigated aat different isothermal curing temperatures. By adding the aminosiloxane to the resin system, not only conversion rate and conversion were increased but also glass transition temperature was promoted. Critical conversion and gelation time obtained at the crossover point between storage and loss moduli were reduced and thus the viscosity was increased by the aminosiloxane. $C_1$ and $C_2$ in the WLF equation calculated from the glass transition temperature as a function of conversion and measured viscosity were found to vary with the curing temperature. By applying the change of glass transition temperature with conversion, $C_1$ and $C_2$ to WLF equation, it was possible to predict accurately the viscosity change with isothermal curing reaction.

A Study on the Curing Behaviors of Glass/Epoxy Prepreg by Dielectrometer and the Thermal Properties of Cured Glass/Epoxy Composites (Dielectrometer를 이용한 Glass/Epoxy 프리프레그의 경화거동 및 경화물의 열적 특성연구)

  • 제갈영순;이원철;전영재;윤남균
    • Polymer(Korea)
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    • v.24 no.3
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    • pp.350-357
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    • 2000
  • Curing behaviors of glass/epoxy prepreg for printed circuit boards (PCB) were studied by using dielectrometer and differential scanning calorimeter. This prepreg was showed the lowest ionic viscosity at about 115$^{\circ}C$, and then the ionic viscosity was gradully increased up to 15$0^{\circ}C$. This indicated that the curing reaction of this prepreg started at 115$^{\circ}C$ and the molecular weight was increased by the accelerated thermal cross-linking reaction. The loss factor and tan $\delta$ values were also measured and discussed. The dielectric behaviors of this prepreg system were also measured according to the cure cycle for PCB. This material was found to be thermally stable up to about 30$0^{\circ}C$ and then was showed an abrupt decomposition beyond this temperature.

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