• Title/Summary/Keyword: Polyimides

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Synthesis of Polyimides with Layered Structure from Diamines Containing Flexible Side Chains (유연한 곁가지를 가진 디아민으로부터 층상 구조의 폴리이미드 합성)

  • Han Seung San;Yi Mi Hye;Choi Kil-Yeong;Im Seung Soon;Kim Yong Seok
    • Polymer(Korea)
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    • v.30 no.1
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    • pp.56-63
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    • 2006
  • We have synthesized two types of diamine monomers containing various chain length to prepare polyimides with layered structure. By using these diamines, homo-polyimides and co-polyimides having hydrophobic and hydrophilic segment of flexible side chain were synthesized. The segregated layered structures were formed by repulsive force with main chain as the side chains reach a critical length because the rigid main chains are packed into layered structure with the flexible side chains occupying the space between layers. As a result, the gallery space of each homo-polyimide was increased at spacing of $32.7\~48{\AA}\;or\;7\~10.5{\AA}$ as the increased hydrophobic or hydrophilic side chain length through X-ray diffraction. The gallery space of co-polyimides was also showed similar phenomenon by repulsive force of side chains with different properties. We have also confirmed that gallery space and molar volume were significantly depended on length of flexible side chain via molecular modeling.

Synthesis and Characterization of Soluble Co-polyimides for Biogas Purification (바이오가스 정제용 용해성 폴리이미드 공중합체의 합성과 특성분석)

  • Shin, So Ra;Han, Sang Hoon;Kim, Jeong-Hoon
    • Membrane Journal
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    • v.25 no.3
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    • pp.231-238
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    • 2015
  • Co-polyimide membranes were prepared by two-step polymerization using semi-alicyclic 5-(2,5-dioxotetrahydrofuryl)-3-methyl-cyclohexene-1,2-dicarboxylic anhydride (DOCDA) with five diamines such as 2,5-dimethyl-1,4-phenylene diamine (2M), 2,4,6-trimethyl-1,3-phenylene diamine (3M), 1,5-naphthalene diamine (NDA), 4,4-diaminodiphenyl methane (MDA), 4,4'-diaminodiphenyl ether (ODA). Synthesized co-polyimides were characterized by FT-IR, viscosity, solubility, DSC, TGA and gas permeation properties, compared with 6FDA-based co-polyimides. All co-polyimides had the intrinsic viscosity of 0.32~0.58 and excellent solubility in various solvents. DOCDA-based co-polyimides had thermal stability over $400^{\circ}C$ although those were lower than 6FDA-based co-polyimides. Gas permeabilities of the copolyimide membranes were measured for $CO_2$ and $CH_4$ at room temperature and presented the trade-off relationship.

Novel Homeotropic Alignment Materials with Alkylcyclohexylbenzene as Side Chain in Polyimides

  • Lee, H.K.;Kim, Y.B.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2003.07a
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    • pp.600-603
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    • 2003
  • VA-LCDs is widely used for recent LCD productions owing to wide viewing angle characteristics with an unusually high contrast ratio. To apply for VA-LCDs, the novel homeotropic alignment materials were synthesized, which have the liquid crystal molecule as a side chain at aromatic diamine in a polyimide structure. These polyimides generated a high pretilt angle $90^{\circ}C$. In this paper, the synthesis and alignment properties of new homeotropic alignment materials will be discussed..

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Adhesive Property of Novel Polyimides Containing Fluorine and Phosphine Oxide (Phosphine oxide와 불소를 함유하는 폴리이미드의 접착성 연구)

  • Jeong, K.U.;Myung, B.Y.;Cho, Y.J.;Choi, I.J.;Yoon, T.H.
    • Journal of Adhesion and Interface
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    • v.1 no.1
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    • pp.38-46
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    • 2000
  • A novel diamine monomer, containing fluorine and phosphine oxide, bis(3-aminophenyl) 3,5-bis(trifluoromethyl) phenyl phosphine oxide (mDA6FPPO), was prepared via Grignard reaction, and utilized to prepare polyimides with dianhydrides such as PMDA, 6FDA, BTDA or ODPA, by the conventional two-step route; preparation of poly(amic acid), followed by solution imidization. The polyimides were characterized by FT-lR, NMR, DSC and DMA, with intrinsic viscosity, and adhesive properties were also evaluated. A phosphine oxide containing monomer, bis(3-aminophenyl) phenyl phosphine oxide (mDAPPO) a nd a commercial 3,3'-diamino diphenyl sulfone (mDDS) were also used for comparison. The polyimides with mDA6FPPO exhibited high $T_g$, excellent solubility, and good adhesive properties.

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Synthesis of Polyimides Derived from 2,2-Bis[4-(4-aminobenzoyl)phenoxy]hexafluoropropane and Aromatic Dianhydrides (2,2-Bis[4-(4-nitrobenzoyl)phenoxy]hexafluoropropane과 방향족 이무수물을 사용한 폴리이미드의 합성)

  • Park, Jung Hye;Ahn, Byung Hyun
    • Applied Chemistry for Engineering
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    • v.27 no.1
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    • pp.50-55
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    • 2016
  • Aromatic diamines containing hexafluoroisopropylidene and ester moiety were synthesized from 4,4'-hexafluoroisopropylidene diphenol and nitrobenzoyl chloride. The reaction of aromatic diamines with hexafluoroisopropylidene phthalicdianhydride (6FDA) or pyromellitic dianhydride (PMDA) gave four kinds of poly(amic acid)s. Their inherent viscosities ranged from 0.196 to 0.346 dL/g. Poly(amic acid)s were converted to polyimides by thermal imidization. The glass transition temperatures ($T_g$) of polyimides were between 241 and $289^{\circ}C$. The 5% weight loss temperatures were recorded in the range of $430{\sim}492^{\circ}C$. The tensile strength of polyimide films were measured as 29.84~64.38 MPa.

Synthesis and characterization of silicone-containing polyamideimide and its gas separation

  • 이용범;심진기;이영무
    • Proceedings of the Membrane Society of Korea Conference
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    • 1997.10a
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    • pp.83-84
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    • 1997
  • 1. INTRODUCTION : Polyimides containing siloxane moiety(poly(imide siloxane), or polysiloxaneimide) have been synthesized because of their some merits over polyimide itseft. Polyimides have excellent thermal and mechanical properties but their poor solubility and processibility in their fullly imidized form give disadvantages in applications. Incorporation of siloxane units make it possible to increase solubility and processibility, and also impart impact resistance, low moisture uptake, low dielectric constant, thermo-oxidative resistance, good adhesion properties to substrate and etc.. Incorporation methods of siloxane groups into the polyimide was mainly copolymerization or terpolymerization between oligomeric dimethylsiloxane and aromatic dianhydride. A few methods of introducing siloxane units in functional groups of polyimide was reported. In our laboratory poly(amideimide siloxane) and poly(imide siloxane) were prepared and the study about their thermal kinetics was performed. In separation membrane area, polysiloxaneimides was utilized in pervaporation and gas separation. Polyimides in gas separation show high selectivity and very low permeability, and introduction of siloxane segments increase permeability with low decrease in selectivity. We aimed to introduce silicone segments into poly(amic acid) state and synthesize polymer partially imidized, and also show the gas separation characteristics of the synthesized polymer.

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High Performance Polyimides for Applications in Microelectronics and Flat Panel Displays

  • Ree Moonhor
    • Macromolecular Research
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    • v.14 no.1
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    • pp.1-33
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    • 2006
  • Polyimides (PIs) exhibit excellent thermal stability, mechanical, dielectric, and chemical resistance properties due to their heterocyclic imide rings and aromatic rings on the backbone. Due to these advantageous properties, PIs have found diverse applications in industry. Most PIs are insoluble because of the nature of the high chemical resistance. Thus, they are generally used as a soluble precursor polymer, which forms complexes with solvent molecules, and then finally converts to the corresponding polyimides via imidization reaction. This complexation with solvent has caused severe difficulty in the characterization of the precursor polymers. However, significant progress has recently been made on the detailed characterization of PI precursors and their imidization reaction. On the other hand, much research effort has been exerted to reduce the dielectric constant of PIs, as demanded in the microelectronics industry, through chemical modifications, as well as to develop high performance, light-emitting PIs and liquid crystal (LC) alignment layer PIs with both rubbing and rubbing-free processibility, which are desired in the flat-panel display industry. This article reviews this recent research progresses in characterizing PIs and their precursors and in developing low dielectric constant, light-emitting, and LC alignment layer PIs.