• Journal of the Korean Applied Science and Technology
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• v.15 no.3
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• pp.47-53
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• 1998

The polyimide film surface was modified with KOH aqueous solutions or sulfuric acid. The film thickness was increased by about 10% through the modification of film surface. Hydrolysis of amide bonds and hydration of water induced the increase. The polarity of the film surface increased and identified by contact angle measurement. The depth and roughness of modified was increased. After treatment of surface with water, alkyl and 4-pentyloxyaniline were introduced on the film surface by complex formation between anionic species formed on the imide surface and ammonium ion. The newly introduced alkyl group was identified by FT-IR spectroscopy. Surface polarity reduced dramatically and the roughness was increased after introduction of ammonium salt.

• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.816-818
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• 1998

In this paper Polyimide(PI) thin film are fabricated by vapor deposition polymerization(VDP) of dry process which are easy to control the film's thickness and hard to pollute due to volatile solvent. The FT-IR spectrum show that PAA thin films fabricated by VDP are changed to PI thin film by thermal curing. From AFM(Atomic Force Microscopy) experimental as the higher curing temperature. the thin film thickness decreases and roughness decresse.

• Journal of Adhesion and Interface
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• v.8 no.1
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• pp.15-27
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• 2007

Polyimide (PI) surface modification was carried out by ion-beam treatment and silane-imidazole coupling agent to improve the adhesion between polyimide film and copper. Silane-imidazole coupling agent contains imidazole functional groups for the formation of a complex with copper metal through a coordination bonding and methoxy silane groups for the formation of siloxane polymers. The PI film surface was first treated by argon (Ar)/oxygen ($O_2$) ion-beam, followed by dipping it into a modified silane-imidazole coupling agent solution. The results of X-ray photoelectron spectroscopy (XPS) spectra revealed that the $Ar/O_2$ plasma treatment formed oxygen functional groups such as hydroxyl and carbonyl groups on the polyimide film surface and confirmed that the PI surface was modified by a coupling reaction with imidazole-silane coupling agent. Adhesion between copper and the treated PI film by ion-beam and coupling agent was superior to that with untreated PI film. In addition, adhesion of PI film treated by an $Ar/O_2$ plasma to copper was better than that of PI film treated by a coupling agent. The peeled-off layers from the copper-PI film joint were completely different in chemical composition each other. The layer of PI film side showed similar C1s, N1s, O1s spectra to the original Upilex-S and no Si and Cu atoms appeared. On the other hand the layer of copper side showed different C1s and N1s spectra from the original PI film and many Si and Cu atoms appeared. This indicates that the failure occurs at an interface between the imidazole-silane and PI film layers rather than within the PI layers.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.05a
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• pp.230-233
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• 1995

Using Polyimide Langmuir-Blodgett(LB) films as a tunneling barrier, Current -Voltage(I-V) characteristics and inelastic electron tunneling spectroscoupy(IETS) of the junctions incorporating 1-layer orgainc monolayer were invesgated. Several peaks originating in vibrational modes of constituted molecules of 1-layer monolayers were clearly observed in the IET spectra.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.261-264
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• 2007

We developed a non self-aligned poly-silicon TFTs fabrication process at two different temperatures on spin-coated polyimide layer above Si-wafer. After TFTs fabrication, the polyimide layer was mechanically released from the Si-wafer and the devices characteristics were compared. In addition self-heating and hot-carrier induced instabilities were analysed.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.1
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• pp.139-141
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• 2007

Thin films of polyimide (Pl) were fabricated by a vapor deposition polymerization method (VDPM) and studied for the photosensitive characteristic. Polyamic acid (PAA) thin films fabricated by vapor deposition polymerization (VDP) from 6FDA and 4-4' DDE were converted to PI thin films by thermal curing. From AFM and Ellipsometer experimental, the films thickness was decreased and the reflectance was increased as the curing temperature was increased. Those results implies that thin film is uniform. From UV-Vis spectra, PI thin films showed high absorbance in 225 $\sim$ 260 [nm] region.

• KIEE International Transactions on Electrophysics and Applications
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• v.5C no.2
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• pp.76-80
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• 2005

In this paper, a miniaturized ring hybrid circuit is characterized based on a thin film microstrip (TFMS) on low-resistivity silicon. In order to obtain low-loss characteristics, a polyimide layer with 50 $\mu$m thickness is spin-coated onto the silicon to be used for the substrate. First, propagation characteristics of TFMS lines consisting of the ring hybrid circuit are presented. Then, a ring hybrid circuit based on TFMS is featured by employing the triple concentric circle approach for miniaturization. Triple concentric circle lines with $\lambda$$_{g}$/4 or 3$\lambda$$_{g}$/4 line lengths are implemented on the surface of the polyimide by circularly meandering to reduce the circuit size of the designed ring hybrid. Good agreement between measured and simulated results is obtained.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1007-1009
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• 2004

We investigated the electro-optical(EO) performances of the super twisted nematic liquid crystal display(STN-LCD) on the polyimide(PI) surface with polymer film using rubbing and photoalignment method. Monodomain alignment of the plastic STN-LCD can be observed. A faster response time for the photoaligned plastic STN-LCD on the polyimide(PI) surfaces can be achieved than rubbingaligned plastic STN-LCD.

• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1233-1235
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• 1994

In this work, polyimide thin films fabricated by the electrophoretic deposition are investigated as a humidity sensing material. Capacitance and impedance are measured with increasing relative humidity to find the nature of the film. From the results, the polyimide humidity sensor is not classified impedance change type but capacitance change type and appear more sensitive in the region of higher humidity than that of lower humidity.

• Polymer(Korea)
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• v.38 no.4
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• pp.544-549
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• 2014

Double layered film consisting of polyimide/polysiloxane and interface with nano domain structure was fabricated through stepwise layer formation and subsequent aging steps. During aging of film, nano phase separation occurred between the top layer polysiloxane and the upper layer of polyimide, which was observed by transmission electron microscope (TEM). A stable and uniform polysiloxane layer was obtained, showing the reproducible pressure-sensitive adhesion (PSA) property with the peel strength of 8-13 g/inch at even $300^{\circ}C$. In addition, the resulting polymide/polysiloxane film was thermo-stable up to $435^{\circ}C$, providing the promising properties suitable for application in microelectronics processing.