• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.209-212
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• 2001

Polyimide(PI) films have been considered as the interlayer dielectric materials due to low dielectric constant, low water absorption, high gap-fill and planarization capability. The PI film was etched with using inductively coupled plasma (ICP). The etching characteristics such as etch rate and selectivity were evaluated to gas mixing ratio. High etch rate was 8300$\AA$/min and vertical profile was approximately acquired 90$^{\circ}$ at CF$_4$/(CF$_4$+O$_2$) of 0.2. The selectivies of polyimide to PR and SiO$_2$ were 1.2, 5.9, respectively. The etching profiles of PI films with an aluminum pattern were measured by a scanning electron microscope (SEM). The chemical states on the PI film surface were investigated by x-ray photoelectron spectroscopy (XPS). Radical densities of oxygen and fluorine in different gas mixing ratio of 07CF4 were investigated by optical emission spectrometer (OES).

• Journal of the Korean institute of surface engineering
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• v.26 no.2
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• pp.71-81
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• 1993

Thed effects of Ar or Oxygen RF plasma treatment on the adhesion behavior of Cr films to polyimide sub-strates have been investigated by using SEM, XRD, AES, and $90^{\circ}$peel test. By applying RF plasma treatment of the polyimide surface prior to metal deposition, the peel adhesion strength of Cu/Cr films sputtered onto the fully cured BPDA-PDA polyimide was highly increased from about 3g/mm to 90 ~ 100g/mm. Improved peel adhesion strength of Cr/polyimide interfaces due to RF plasma treatment was attributed to the contributions from surface cleaning, Cr-polyimide bonding at the interface, and force required for plastic deformation of the film. While the surface topology change of the polyimide caused by RF plasma treatment makes a little contri-bution to the improved adhesion.

• Electrical & Electronic Materials
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• v.10 no.5
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• pp.461-466
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• 1997

In this paper, we developed the new non-rubbing liquid crystal (LC) alignment techniques in the cell with slanted non-polarized ultraviolet (UV) light irradiation on polyimide (PI) film. It is shown that the uniform alignment for nematic (N) LC is obtained by using slanted non-polarized UV light irradiation on PI surface. We successfully obtained that the pretilt angle of NLC is generated about 3.3 degree in the cell with slanted non-polarized UV light irradiation with 70 degree on PI surface, for the first time. It is considered that the pretilt angle generation in NLC is attributed to interaction between the LC molecular and the PI, which is broken the polymer by slanted non-polarized UV irradiation. Therefore, we concluded that the uniform LC alignment is attributed to anisotropic dispersion force due to photo depolymerization with slanted non-polarized UV light irradiation on PI surface.

• 한국정보디스플레이학회:학술대회논문집
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• 2000.01a
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• pp.197-198
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• 2000

A surface-assisted photo-control of the liquid crystal (LC) alignment has been achieved by modifying the topmost surface of the polyimide film with photo-reactive molecules. Recently, photo-alignment technique using a thin film of poly(vinyl cinnamates) have been reported. However their commercial potentiality is limited by their low thermal stability. To enhance thermal stability, we synthesized the chalcone derivatives as the photo-reactive molecules and introduced the materials on the surface-modified polyimide film.. We identified that the photo-chemical reaction of the chalcone derivatives occur in few minutes with irradiation of UV light. The photo-alignment characteristics of the modified polyimide films treated by polarized UV light and their LC cells are investigated as a function of exposure dose.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.475-478
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• 2000

Maxwell displacement current(MDC) was generated when the area per molecule was about 140${\AA}$$^2$and 100${\AA}$$^2$. MDC were investigated in connection with monolayer compression cycles. It was found that the maximum of MDC appeared at the molecular area just before the initial rise of surface pressure in compression cycles. The absorption spectra of polyamic acid containing p-methoxyazobenzene in a mixture of N,N-dimethylacetamide(DMAc) and benzene(1:1 by volume) solution was induced photoisomerization by UV and visible light irradiation. The precursor LB film was heated in a vacuum dry oven at 120$^{\circ}C$ in order to convert it into the LB film of polyimide. The absorption spectra of LB films were also induced photoisomerization by UV and visible light irradiation.

• Proceedings of the Materials Research Society of Korea Conference
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• 1997.10a
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• pp.78-78
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• 1997

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.139.1-139
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• 1998

• Bulletin of the Korean Chemical Society
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• v.23 no.3
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• pp.469-476
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• 2002

Photocrosslinkable soluble polyimide and polymethacrylate compound were synthesized for studying the optically induced anisotropy of the thin films. Chalcone group was introduced into the side chain unit of two polymers. We observed a photodimerization behavior between the double bonds in the chalcone group and an optical anisotropy of these materials by irradiation of a linearly polarized UV light (LPL). Optical anisotropy of the thin film was also investigated by using polarized UV absorption spectroscopy. The dynamic property of optical anisotropy in photoreactive polyimide was compared to that in polymethacrylate containing chalcone group in the side chain.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.885-888
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• 2004

We have prepared and investigated the properties of photoinitiator-free photosensitive polyimide gate insulatos for organic thin-film transistors (OTFTs). The precursor was prepared from a dianhydride, 3,3',4,4'-Benzophenone tetracarboxylic dianhydride (BTDA) and novel aromatic diamine, 7-(3,5-diaminobenzoyloxy) coumarine (DA-CM). Photo-patternability of the polyimide precursor film and surface morphology of the films before and after photo-patterning process were investigated and negative pattern with a resolution of 50 ${\mu}m$ was obtained nicely. In addition, we have fabricated OTFTs with pentacene and photosensitive polyimide as a semiconductor and a gate insulator; respectively. According to the device geometry, the ${\mu}$, current modulation ratio and subthreshold swing of the devices were around 0.2${\sim}$0.4 $cm^2$/Vs, more than $10^5$ and around 3${\sim}$5 V/dec, respectively.

• Journal of Sensor Science and Technology
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• v.13 no.4
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• pp.287-291
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• 2004

A capacitive type humidity sensor has been fabricated using a polyimide film without hydrophobic elements and its characteristics has been evaluated for hermeticity measurement of micro packages. For a highly sensitive humidity sensor, a polyimide film without hydrophobic elements has been synthesized and used instead of using a commercial one in which 7 group elements such as fluorine or chlorine are included. Sensitivity, stability and hysteresis has been performed to characterize the fabricated sensors. The sensitivity defined as normalized percent capacitance change was 0.3751%RH and hysteresis was 0.77% in the range of 10%RH to 90%RH. Maximum deviation from the average capacitance measured for 120 minutes at 50%RH was 0.25%. The proposed humidity sensor can be used for hermeticity measurement of micro packages.