• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.25-31
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• 2019

In this study, a new adhesion evaluating equipment and data processing methods were developed to overcome some limitations of existing evaluating equipment. Nano-diamond coated tool is a specimen of experiment. When applying frictional force and shear force on the specimen by a rotating polishing pad, delamination occurs at a moment. During each experiment, the vibration, load, and torque is obtained by accelerometer, loadcell and torque s+ kpensor. Frictional force and coefficient of friction are obtained by calculating torque and load. Based on FFT transformation, acceleration is processed and analyzed. As a result, the moment of delamination and the load at that time can be detected by the new developed equipment and measurement system. Finally, we call this load as an Adhesion force.

• Transactions of Materials Processing
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• v.33 no.4
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• pp.255-260
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• 2024

Utilization of additively manufactured parts in intended applications is limited by surface roughness. Roughness reduction in internal surface area of AM parts is exponentially more challenging. Reported methodologies for roughness reduction, result in material loss and limits the operational life of these parts. Herein, we explored electropolishing to reduce surface roughness of SLM manufactured 316L steel. Furthermore, the mass loss incurred during electropolishing is deduced as a function of polishing time. The change in roughness, wettability and surface passivation were studied and discussed in detail.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator. removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistancy. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfact Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator, removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistency. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfect Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.637-638
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• 2005

AAO templates were fabricated using a two-step anodization process with pretreatment such as electro polishing and annealing. To reduce process time and get well-aligned pore array, rapid thermal processor by an halogen lamp was employed in vacuum state at $500^{\circ}C$ for various time. The pore array of AAO template annealed at $500^{\circ}C$ for 2 h is comparable to a template annealed in conventional furnace at $500^{\circ}C$ for 30 h. The well-fabricated AAO template has the mean pore diameter of 70 nm, the barrierlayer thickness of 25 nm, and the pore depth of $9{\mu}m$. And the pore density can be as high as $2.0\times10^{10}cm^{-2}$.

• Corrosion Science and Technology
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• v.21 no.5
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• pp.360-371
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• 2022

Electropolishing has various parameters because an electrochemical reaction is applied. Accordingly, experiments to determine factors and levels of electropolishing conditions are in progress for various materials. The purpose of this investigation was to optimize conditions for electropolishing using the taguchi method for UNS S31603. Factors such as electrolyte composition ratio, electrolyte temperature, and electropolishing process time were selected. Electropolishing was optimized using analysis of variance (ANOVA), signal-to-noise ratio (the smaller the better characteristics), and surface analysis. Results of ANOVA revealed that only the electrolyte composition ratio among factors was effective for surface roughness. As a result of statistical analysis of the signal-to-noise ratio, the highest signal-to-noise ratio was calculated under electropolishing conditions with sulfuric acid and phosphoric acid ratio of 4:6, an electrolyte temperature of 75 ℃, and electropolishing process time of 7 minutes. In addition, the surface roughness after electropolishing under the above conditions was 0.121 ㎛, which was improved by more than 88% compared to mechanical polishing.

• Corrosion Science and Technology
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• v.22 no.6
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• pp.457-465
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• 2023

Irradiation-assisted stress corrosion cracking (IASCC) is one of the main degradation mechanisms of austenitic stainless steels, which are used as reactor internal materials. Slow strain rate testing (SSRT) has been widely applied to evaluate the IASCC initiation characteristics of proton-irradiated tensile specimens. Tensile specimens require low surface roughness for micro-crack observation, and electropolishing is the most important specimen pre-treatment process used for this. In this study, optimal electropolishing conditions were examined through analyzing results of polarization experiments and surface roughness measurements after electropolishing. Corrosion cell and electropolishing equipment were fabricated for polarization tests and electropolishing experiments using SSRT specimens. The experimental parameters were electropolishing time, current density, electrolyte temperature, and stirring speed. The optimal electropolishing conditions for SSRT tensile specimens made of type 316 stainless steel were evaluated as a polishing time of 180 seconds, a current density of 0.15 A/cm², an electrolyte temperature of 60 ℃, and a stirring speed of 200 RPM.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.6
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• pp.160-166
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• 2018

The worldwide semi-conductor market has been growing for a long time. Manufacturing lines of semi-conductors need to handle several types of toxic gases. In particular, they need to be controlled accurately in real time. This type of toxic gas control system consists of many different kinds of parts, e.g., fittings, valves, tubes, filters, and regulators. These parts obviously need to be manufactured precisely and be corrosion resistant because they have to control high pressure gases for long periods without any leakage. For this, surface machining and hardening technologies of the metal block and metal gasket need to be studied. This type of study depends on various factors, such as geometric shapes, part materials, surface hardening method, and gas pressures. This paper presents strong concerns on a series of simulation processes regarding the differences between the inlet and outlet pressures considering several different fluid velocity, tube diameters, and V-angles. Indeed, this study will very helpful to determine the important design factors as well as precisely manufacture these parts. The EP (Electrolytic Polishing) process was used to obtain cleaner surfaces, and hardness tests were carried out after the EP process.

• Journal of Technologic Dentistry
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• v.43 no.2
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• pp.56-61
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• 2021

Purpose: This study aimed to produce resin prosthetics using a dental automatic barrel finishing. Surface roughness and surface topography of resins were observed according to the grinding time of the dental automatic barrel finishing. Methods: This study was performed with thermopolymer, autopolymer, and photopolymer resins. The dimensions of the specimen were 10×10×2 mm. Each specimen was polymerized according to the manufacturer's instructions. The polymerized resin was honed for 30 minutes at 5-min intervals in a dental automatic barrel finishing. The specimen was observed using a three-dimensional (3D) optical microscope, and the surface roughness was measured. Results: After the polishing with the dental automatic barrel finishing, the heat-cured (HC) specimen showed the highest and lowest values of Ra after 10 and 15 minutes, respectively. The self-cured (SC) specimen showed the highest and lowest values of Ra after 10 and 25 minutes, respectively. Finally, the 3D specimen showed the highest and lowest values of Ra after 5 and 20 minutes, respectively. Conclusion: After measuring the surface roughness of the three types of resins according to the grinding time of the dental automatic barrel finishing, the lowest Ra values for the HC, SC, and 3D specimens were measured after 15, 25, and 20 minutes, respectively. Therefore, we concluded that a limit on the grinding time of the resin using a dental automatic barrel finishing is needed.

• Restorative Dentistry and Endodontics
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• v.24 no.2
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• pp.299-309
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• 1999

The composite resin, due to its esthetic qualities, is considered the material of choice for restoration of anterior teeth. With respect to shade control, the direct-placement resin composites offer some distinct advantages over indirect restorative procedures. Visible-light-cured (VLC) composites allow dentists to match existing tooth shades or to create new shades and to evaluate them immediately at the time of restoration placement. Optimal intraoral color control can be achieved if optical changes occurring during application are minimized. An ideal VLC composite, then, would be one which is optically stable throughout the polymerization process. The shade guides of the resin composites are generally made of plastic, rather than the actual composite material, and do not accurately depict the true shade, translucency, or opacity of the resin composite after polymerization. So the numerous problems associated with these shade guides lead to varied and sometimes unpredictable results. The aim of this study was to assess the color changes of current resin composite restorative materials which occur as a result of the polymerization process and to compare the color differences between the shade guides provided with the products and the actual resin composites before- and after-polymerization. The results obtained from this investigation should provide the clinician with information which may aid in improved color match of esthetic restoration. Five light activated, resin-based materials (${\AE}$litefil, Amelogen Universal, Spectrum TPH VeridonFil-Photo, and Z100) and shade guides were used in this study. Three specimens of each material and shade combination were made. Each material was condensed inside a 1.5mm thick metal mold with 10mm diameter and pressed between glass plates. Each material was measured immediately before polymerization, and polymerized with Curing Light XL 3000 (3M Dental products, USA) visible light-activation unit for 60 seconds at each side. The specimens were then polished sequentially on wet sandpaper. Shade guides were ground with polishing stones and rubber points (Shofu) to a thickness of approximately 1.5mm. Color characteristics were performed with a spectrophotometer (CM-3500d, Minolta Co., LTD). A computer-controlled spectrophotometer was used to determine CIELAB coordinates ($L^*$, $a^*$ and $b^*$) of each specimen and shade guide. The CIELAB measurements made it possible to evaluate the amount of the color difference values (${\Delta}E{^*}ab$) of resin composites before the polymerization process and shade guides using the post-polishing color of the composite as a control, CIE standard D65 was used as the light source. The results were as follows. 1. Each of the resin composites evaluated showed significant color changes during light-curing process. All the resin composites evaluated except all the tested shades of 2100 showed unacceptable level of color changes (${\Delta}E{^*}ab$ greater than 3.3) between pre-polymerization and post-polishing state. 2. Color differences between most of the resin composites tested and their corresponding shade guides were acceptable but those between C2 shade of ${\AE}$litefil and IE shade of Amelogen Universal and their respective shade guides exceeded what is acceptable. 3. Comparison of the mean ${\Delta}E{^*}ab$ values of materials revealed that Z100 showed the least overall color change between pre-polymerization and post-polishing state followed by ${\AE}$litefil, VeridonFil-Photo, Spectrum TPH, and Amelogen Universal in the order of increasing change and Amelogen Universal. Spectrum TPH, 2100, VeridonFil-Photo and ${\AE}$litefil for the color differences between actual resin and shade guide. 4. In the clinical environment, the shade guide is the better choice than the shade of the actual resin before polymerization when matching colors. But, it is recommended that custom shade guides be made from resin material itself for better color matching.