• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.731-734
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. Polishing pads play a key role in CMP, which has been recognized as a critical step to improve the topography of wafers for semiconductor fabrication. It is investigated the performance of $SiO_2-CMP$ process using commercial silica slurry as a pad conditioning temperature increased after CMP process. This study also showed the change of SEM images in the pore geometry on the CMP pad surface after use with a different pad conditioning temperature.

• Corrosion Science and Technology
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• v.22 no.3
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• pp.164-174
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• 2023

Electropolishing technology uses an electrochemical reaction and improves surface roughness, glossiness, and corrosion resistance. In this investigation, electropolishing was performed to improve the corrosion resistance of super austenitic stainless steel. As a result of electropolishing, surface roughness (0.16 ㎛) was improved by about 76.5% compared to mechanical polishing (0.68 ㎛). In addition, the electropolished surface was smooth because the average and variance values of the depth histogram were small. Tafel analysis was performed after a potentiodynamic polarization experiment with seawater temperature, and the microstructure was compared and analyzed. The corrosion current density at 30 ℃, 60 ℃, and 90 ℃ was reduced by 0.083 ㎂/cm², 0.296 ㎂/cm², and 0.341 ㎂/cm², respectively. Pitting occurred in the mechanical polished specimen at 30 ℃, but partial intergranular corrosion was observed in the electropolished specimen, and pitting occurred predominantly at both 60 ℃ and 90 ℃. In addition, the damage depths of the electropolished specimen were shallower than those of mechanical polishing at 30 ℃ and 60 ℃, but the opposite result was seen at 90 ℃.

• Journal of the Korean Society of Safety
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• v.19 no.2
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• pp.6-10
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• 2004

The magnetic polishing is the useful method to finish using magnetic power of magnet. This method is one of precision polishing techniques and has an aim of the clean technology using for the pure of gas and inside of the clean pipe for transportation. The magnetic abrasive polishing method is not so common for machine that it tis not spreaded widely. There are rarely researcher in this field because of non-effectiveness of magnetic abrasive. Therefore, in ths paper deals with development of the magnetic abrasive using sludge. In this development, abrasive grain WA and GC used to resin bond fabricated low temperature. And magnetic material was fabricated from the sludge which were crused into 200 mesh and average diameter ${\o}$1.2mm ball type. The XRD analysis result show that only WA and GC abrasive and sludge crystal peaks detected which explains resin bond was not any more chemical reaction. From SEM analysis it tis found that WA and GC abrasive and sludge were stron bonding with each other by bond.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.5
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• pp.420-425
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• 2008

PMMA light guiding plate with nano-sized pattern was fabricated using anodized aluminum oxide membrane as a template for nano imprint lithography. Nano-sized pore arrays were prepared by the self-organization processes of the anodic oxidation using the aluminum plate with 99.999% purity. Since the aluminum plate has a rough surface, the aluminum plate with thickness of 1mm was anodized after the pre-treatments of chemical polishing, and electrochemical polishing. The surface morphology of the alumina obtained by the first anodization process was controlled by the concentration of electrochemical solution during the first anodization. The surface morphology of the alumina was also changed according to temperature of the solution during chemical polishing performed after first anodization. The pore widening process was employed for obtaining the one-channel with flat surface and height of the channel because the pores of the alumina membrane prepared by the fixed voltage method shows the structure of two-channel with rough surface. It is shown from SPM results that the nano-sized pattern on PMMA light guiding plate fabricated by nano imprint lithography method was well transferred from that of anodized aluminum oxide template.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.123-124
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• 2012

• Journal of the Korean institute of surface engineering
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• v.45 no.6
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• pp.248-256
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• 2012

A Pd-based hydrogen membranes for hydrogen purification and separation need high hydrogen perm-selectivity. The surface roughness of the support is important to coat the pinholes free and thin-film membrane over it. Also, The pinholes drastically decreased the hydrogen perm-selectivity of the Pd-based composite membrane. In order to remove the pinholes, we introduced various surface pre-treatment such as alumina powder packing, nickel electro-plating and micro-polishing pre-treatment. Especially, the micro-polishing pretreatment was very effective in roughness leveling off the surface of the porous nickel support, and it almost completely plugged the pores. Fine Ni particles filled surface pinholes with could form open structure at the interface of Pd alloy coating and Ni support by their diffusion to the membrane and resintering. In this study, a $4{\mu}m$ surface pore-free Pd-Cu-Ni ternary alloy membrane on a porous nickel substrate was successfully prepared by micro-polishing, high temperature sputtering and Cu-reflow process. And $H_2$ permeation and $N_2$ leak tests showed that the Pd-Cu-Ni ternary alloy hydrogen membrane achieved both high permeability of $13.2ml{\cdot}cm^{-2}{\cdot}min^{-1}{\cdot}atm^{-1}$ permation flux and infinite selectivity.

• Applied Biological Chemistry
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• v.26 no.1
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• pp.47-52
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• 1983

The size distribution and changes of volume and grain hardness of ‘Sedohadaka', waked barley of various polishing yields during hydration process at various temperatures were investigated, and were analyzed kinetically, Both major and minor diameter of barley grain decreased linearly during polishing, and the decreasing rate of major diameter was greater than that of minor diameter. The volume change of barley grain could be expressed as a power of hydration time, and a break point was found in case of non-polished barley. The changing rate of grain hardness followed the equation of a first-order reaction, and the reaction rate constant increased with decreasing polishing yields and at higher temperature in the range of $20{\sim}60^{\circ}C$. The activation energy of hardness change reaction of polished barley during hydration were ranged $5.1{\sim}7.8Kcal/mole$, and 13.3Kcal/mole of non-polished barley.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.354-361
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• 2005

In high speed cutting process, due to the friction between the tool and workpiece, a temperature rise of contacting part is serious. It need to develop cutting tool for overcoming such a poor condition. So now, some studies, the optimization of tool shapes, the fine grains of tool material, multi-layer coating of tools are processing. If mirror finishing on the tool is processed, there is advantage of relation between chip and tool, because of less friction, and also tool's lift would be increased. As a result mirror like finishing is expected efficient enhancement of tool. Generally, it is too difficult to process by a general way for tools of complex shapes, it is required a new method to process such complex shape tools. The magnetic fluid polishing technique can polish the workpiece of complex shape, because the polishing method which polishes as compress the workpiece by the magnetism abrasives to arrange to the linear according to the line of magnetic force. In this paper, We polished the surface of the high speed cutting tool using the magnetic fluid polishing technique, to enhance the performance of the high speed cutting tool.

• Journal of Oral Medicine and Pain
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• v.19 no.2
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• pp.137-151
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• 1994

In order to evaluate objectively the anxiety level in dental treatment, the author used Biotrainer(BF-120R), one of the skin temperature biofeedback apparatus, to examine 68 dental outpatients on their digital skin temperature change due to routine consecutive dental procedures(oral examination, anesthetic injection, cavity preparation, fissure sealing, polishing). The subjective anxiety level change was also evaluated by visual analog scale. The obtained results were as follows : 1. The skin temperature decreased through consecutive procedures and the temperature in each procedure decreased until 60sec, and then increased on 120sec. 2. The temperature changes in Preparation and Injection were greater than those in other procedures. 3. Generally, male exhibited more change of skin temperature in all procedures than female. 4. Type II, continuously decreasing after procedure, occupied the most in all patients and yhad the lowest beseline temperature. 5. The anxiety level of before-procedure was higher than that of after-procedure and the levels in Injection and Preparation were higher than in other procedures.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2002.11a
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• pp.207-211
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• 2002

Anodizing film was prepared by anodic oxidation of pure aluminum(purity > 99.50) using DC power supply for constant current mode in an electrolytic solution of surface of sulfuric acid. Effects of pre-treatment process such as chemical polishing, acid cleaning, alkali etching before anodic oxidation, were studied to microstructures and surface morphologies. A roughness on surface of anodizing film had to be decreased for amorphous phase by anodic oxidation. A roughness on surface of anodizing film decrease as annealing temperature increased in chemical polishing.