• 한국식품과학회지
• /
• 제10권1호
• /
• pp.52-56
• /
• 1978

쌀의 취반에 대한 기작을 아끼바레(도정도,50%,70% 및 90%)를 이용하여 연구하였다. 취반(취반온도 $90^{\circ}-120^{\circ}C$)후 밥알의 hardness는 Texturometer로 측정하였다. 취반속도는 1차 반응의 식으로 표시될 수 있었으며, 취반온도 $90^{\circ}-120^{\circ}C$사이의 온도 계수는 2 이었다. 취반의 활성화 에너지는 $100^{\circ}C$이하에서는 약 17,000cal/mole, $100^{\circ}C$ 이상에서는 약 9,000cal/mole이었다. 쌀의 도정도 및 쌀의 취반전 침지시간은 활성화 에너지에 영향을 주지 않았으나, 반응속도 상수는 도정도가 높아질수록 증가하였고 취반시간은 반대로 감소하였다. 쌀의 취반과정은 다음의 두 기작으로 설명할 수 있었다. 즉 취반온도는 $100^{\circ}C$이하에서는 쌀의 성분 및 물에 의한 화학반응이, 취반온도 $100^{\circ}C$이상에서는 취반된 부분으로부터 취반되지 않은 부분(즉 반응이 진행되고 있는 부분)으로의 물의 확산속도가 취반속도를 제한하였다.

• 한국세라믹학회지
• /
• 제19권1호
• /
• pp.44-50
• /
• 1982

Drawing optical fibers in a graphite furnace is one of the most convenient and economical means of producing optical fiber. Since the flaw formation on optical fiber is mainly due to dust contaminations during drawing and surface corrosion by water vapor penetration through coating layer, the tensile strength of optical fiber drawn in a graphite furnace is greatly inflenced by the drawing conditions. The important factors found in this investigation were preform treatment (fire polishing), furnace interior environment (dust contamination, inert gas flows), primary coating condition (resin curing temperature, coating materials, method, thickness) and fiber pulling condition (furnace temperature, drawing speed, pulling tension). The tensile strength at optimum drawing conditions turned out to be 5 ~ 6 GPa.

• Transactions on Electrical and Electronic Materials
• /
• 제8권1호
• /
• pp.11-14
• /
• 2007

Consumables used in Chemical Mechanical Polishing (CMP) have been played important role to improve quality and productivity. Since the properties of consumables constantly change with various reasons, such as shelf time, manufactured time, lot to lot variation from supplier and so on, CMP results are not constant during the process. Also, CMP process results are affected by multiple sources from wafer, conditioner, pad and slurry. Therefore, multiple sensing systems are required to monitor CMP process variation. In this paper, the authors focus on development of monitoring system for CMP process which consist of force, temperature and displacement sensor to measure the signal from CMP process. With monitoring systems mentioned above, complex CMP phenomena can be investigated more clearly.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
• /
• pp.70-71
• /
• 2005

The material that is both conductive in electricity and transparent to the visible ray is called transparent conducting thin film. It is investigated the performance of ITO-CMP process using commercial silica slurry with the various conditioning temperatures by control of de-ionized water (DIW). Removal rate of ITO thin film was improved after CMP process after pad conditioning at the high temperature by improved exclusion of slurry residues in polishing pad..

• 한국정밀공학회지
• /
• 제21권11호
• /
• pp.46-52
• /
• 2004

CMP (Chemical-Mechanical Polishing) is a process in which both chemical and mechanical mechanisms act simultaneously to produce the planarized wafer. CMP process is an extensive usage and continuing high growth rates in the semiconductor industry. The understanding of the process, however, is much slower. The nature of material removal from the wafer is still undefined and ambiguous. Material removal rate according to the slurry flow rate is also undefined and ambiguous. Thus, in this study, the basic mechanism of material removal rate as slurry flow rate is defined in terms of energy supply and energy loss.

• 한국재료학회지
• /
• 제27권6호
• /
• pp.318-324
• /
• 2017

In this study, two Fe-30Mn-0.2C-(1.5Al) high-manganese steels with different surface conditions were hydrogen-charged under high temperature and pressure; then, tensile testing was performed at room temperature in air. The yield strength of the 30Mn-0.2C specimen increased with decreasing surface roughness(achieved via polishing), but that of the 30Mn-0.2C-1.5Al specimen was hardly affected by the surface conditions. On the other hand, the tendency of hydrogen embrittlement of the two high-manganese steels was not sensitive to hydrogen charging or surface conditions from the standpoints of elongation and fracture behavior. Based on the EBSD analysis results, the small decrease in elongation of the charged specimens for the Fe-30Mn-0.2C-(1.5Al) high-manganese steels was attributed to the enhanced dislocation pile-up around grain boundaries, caused by hydrogen.

• 열처리공학회지
• /
• 제37권2호
• /
• pp.66-72
• /
• 2024

To investigate the effect of deformation condition on microstructure and texture formation behaviors of AZ91 magnesium alloy with three kinds of initial texure during high-temperature deformation, plane strain compression tests were carried out at high-temperature deformation conditions - temperature of 673 K~723 K, strain rate of 5 × 10^-3s^-1, up to a strain of -1.0. To clarify the texture formation behavior and crystal orientaion distribution, X-ray diffraction and EBSD measurement were conducted on mid-plane section of the specimens after electroltytic polishing. As a result of this study, it is found that the main component and the accumulation of pole density vary depending on initial texture and deformation caondition, and the formation and development basal texture components ({0001} <$10\bar{1}0$>) were observed regardless of the initial texure in all case of specimens.

• 한국정밀공학회지
• /
• 제19권10호
• /
• pp.156-162
• /
• 2002

There are many factors affecting the results of CMP (Chemical Mechanical Polishing). Among them, the temperature is related to the removal rate and WIWNU (Within Wafer Non-Uniformity). In other words, the removal rate is proportional to the temperature and the variation of temperature distribution on a pad affects the non-uniformity within a wafer. In the former case, the active chemistry improves the rate of chemical reaction and the removal rate becomes better. But, there are not many advanced studies. In the latter case, a kinematical analysis between work-piece and pad can be obtained. And such result analysed from the mechanical aspect can be directly related to the temperature distribution on a pad affecting WIWNU. Meanwhile, the temperature change affects the quantities of both slurry and pad. The change of a pH value of the slurry chemistry due to a temperature variation affects the surface state of an abrasive particle and hence the agglomeration of abrasives happens above the certain temperature. And the pH alteration also affects the zeta potential of a pad surface and therefore the electrical force between pad and abrasive changes. Such results could affect the removal rate and etc. Moreover, the temperature changes the 1st and 2nd elastic moduli of a pad which are closely related to the removal rate and the WIWNU.

• 대한치과기공학회지
• /
• 제36권1호
• /
• pp.9-15
• /
• 2014

Purpose: Generally dental technicians clinically decide the sintering temperature of zirconia artificial teeth to match the color of the teeth. However, the sintering temperature influence the microstructure and mechanical strength of ceramic body. In this study, to evaluate the free choice of sintering temperature which leads to color the problems in zirconia false teeth, the variation of microstructure, mechanical strength, and colortone of zirconia ceramics according to the change of sintering temperature was investigated. Methods: Bar type specimens were prepared from commercial zirconia blocks by cutting and polishing into $0.8cm(L){\times}1.0cm(W){\times}4.8cm(H)$. Specimens were fired from 1,400 to $1,700^{\circ}C$ at $50^{\circ}C$ intervals and held for 1hour at highest temperature. Apparent porosity, water absorption, firing shrinkage, bulk density, bend strength, whiteness were tested. Microstructures were observed by SEM. Results: When fired above $1450^{\circ}C$, all specimens showed 0% apparent porosity and water absorption, 20% firing shrinkage, and $6.1g/cm^3$ bulk density regardless of firing temperatures. SEM photomicrographs showed grain growth of zirconia occurred above $1,600^{\circ}C$. Whiteness was also largely changed above this temperature. Maximum bend strength of 1,05MPa was obtained at $1,550^{\circ}C$. Bend strength lowered slightly above this temperature and showed $950{\ss}\acute{A}$ at $1,700^{\circ}C$. Conclusion: In order to fit the colortone of zirconia artificial teeth, arbitrary choice of firing temperature higher than $1,500^{\circ}C$, up to $1,700^{\circ}C$ did not influence the mechanical strength.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2002년도 춘계학술대회 논문집
• /
• pp.972-975
• /
• 2002

An understanding of tribological behavior in CMP(Chemical Mechanical Polishing) is one of the most important things to reveal the mechanism of material removal. In CMP, the contact type is thought to be semi-direct, elastohydrodynamic contact type from the Stribeck diagram, which is a combination of solid-solid direct contact and hydrodynamic lubrication with thin liquid film. This study is focused on the decay of friction force during CMP from two points of view, one of which is change of the real contact area and the other is the decrease of the elastic modulus of the pad caused by the increase of the temperature during CMP Experiments are implemented with elastic modulus measuring system and tool dynamometer. Results show that the decay of friction force during CMP results from the decrease of the real contact pressure working on an abrasive, which is induced by the decrease of elastic modulus of pad caused by the increase of temperature. And, the phenomenon is thought to be happen specially in the case that the weight concentration of abrasive in slurry is small enough.