• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.90-93
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• 2000

In this study, the rise throughput and the stability in fabrication of device can be obtained by applying of CMP process to STI structure in 0.18um semiconductor device. To employ in STI CMP, the reverse moat process has been added thus the process became complex and the defects were seriously increased. Removal rates of each thin films in STI CMP was not equal hence the devices must to be effected, that is, the damage was occured in the device dimension in the case of excessive CMP process and the nitride film was remained on the device dimension in the case of insufficient CMP process than these defects affect the device characteristics. To resolve these problems, the development of slurry for CMP with high removal rate and high selectivity between each thin films was studied then it can be prevent the reasons of many defects by reasons of many defects by simplification of process that directly apply CMP process to STI structure without the reverse moat pattern process.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2001년도 제33회 춘계학술대회 개최
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• pp.64-71
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• 2001

In this paper the ball-on-disk type sliding tests with boundary lubricated steels were carried out to verify the relation between surface profiles and wear as well as scuffing. Three kinds of surface roughness and asperity radius were produced on AISI 1045 steels using the different processes of grinding and polishing. Frictional forces and time to scuffing were measured. Also, the shape and amount of wear particles were analyzed to compare with original profiles. From the tests, it was confirmed that the size of wear particles are very related to original surface profile. The time to failures and wear amounts were sensitive to the surface spacing. The large surface spacing shows much longer sliding life and smaller wear amount than the others. Time to scuffing was increased with increasing surface profile spacing. The size of wear particles was increased and the amount was decreased with increasing surface profile spacing. Wear volume and wear rate K were decreased with increasing surface profile spacing. And after sliding tests, surface cracks of inner parts of the wear track occurred scuffing were observed and compared the differences about each specimen having the different surface profile spacing.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2000년도 제32회 추계학술대회 정기총회
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• pp.406-413
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• 2000

The friction and wear behaviors of Magnetron Sputtered MoS$_2$films were investigated by using a pin on disk type tester which was designed and manufactured for this experiment. The experiment was conducted by using silicon nitride (Si$_3$N$_4$) as a pin material and Magnetron Sputtered MoS$_2$on bearing steel (STB2) as a disk material, under operating conditions that include different surface roughness (Polishing specimen, Grinding specimen)(2types), linear sliding velocities in the range of 22, 44, 66mm/sec (3types), normal loads vary from 9.8N, 19.6N, 29.4N(3types), corresponding to contact pressures of 1.9∼2.7GPa and atmospheric conditions of high vacuum( 1.3${\times}$10$\^$-4/Pa), medium vacuum( 1.3${\times}$10$\^$-l/Pa), ambient air(10$\^$5/Pa)(3types). We investigated fracture mechanism in magnetron sputtered MoS$_2$films with Magnetron Sputtering method in each experiment.

• 한국주조공학회지
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• 제43권5호
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• pp.223-229
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• 2023

In this study, STS316L produced by a double-melting process involving vacuum induction melting (VIM) and vacuum arc remelting (VAR) was subjected to extrusion and drawing to form a tube and was subsequently electrolytic polished (EP). The grain size of the obtained STS316L without EP was approximately 55 ㎛, with no difference found after EP. The thickness of the EP layer was measured by AES and TEM, showing values of approximately 10 nm and 15 nm, respectively. After EP, the Cr/Fe and CrO/FeO ratios of the passive layer increased from 1.48 to 1.62 and from 2.15 to 2.26, respectively, while the surface roughness decreased significantly from 0.255 to 0.024 ㎛. Consequently, the corrosion rate decreased in both NaCl and HCl solutions after the EP process. Additionally, the amounts of eluted Cr and Fe ions were reduced from 1.2 to 0.8 ppb and 10.3 to 0.8 ppb, respectively. Furthermore, polarization tests revealed that STS316L treated with EP required a lower current density to reach a passive state, indicating that corrosion behavior was retarded.

• 열처리공학회지
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• 제37권2호
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• pp.66-72
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• 2024

To investigate the effect of deformation condition on microstructure and texture formation behaviors of AZ91 magnesium alloy with three kinds of initial texure during high-temperature deformation, plane strain compression tests were carried out at high-temperature deformation conditions - temperature of 673 K~723 K, strain rate of 5 × 10^-3s^-1, up to a strain of -1.0. To clarify the texture formation behavior and crystal orientaion distribution, X-ray diffraction and EBSD measurement were conducted on mid-plane section of the specimens after electroltytic polishing. As a result of this study, it is found that the main component and the accumulation of pole density vary depending on initial texture and deformation caondition, and the formation and development basal texture components ({0001} <$10\bar{1}0$>) were observed regardless of the initial texure in all case of specimens.

• 마이크로전자및패키징학회지
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• 제19권3호
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• pp.37-41
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• 2012

Cu 본딩을 이용한 웨이퍼 레벨 적층 기술은 고밀도 DRAM 이나 고성능 Logic 소자 적층 또는 이종소자 적층의 핵심 기술로 매우 중요시 되고 있다. Cu 본딩 공정을 최적화하기 위해서는 Cu chemical mechanical polishing(CMP)공정 개발이 필수적이며, 본딩층 평탄화를 위한 중요한 핵심 기술이라 하겠다. 특히 Logic 소자 응용에서는 ultra low-k 유전체와 호환성이 좋은 Ti barrier를 선호하는데, Ti barrier는 전기화학적으로 Cu CMP 슬러리에 영향을 받는 경우가 많다. 본 연구에서는 웨이퍼 레벨 Cu 본딩 기술을 위한 Ti/Cu 배선 구조의 Cu CMP 공정 기술을 연구하였다. 다마싱(damascene) 공정으로 Cu CMP 웨이퍼 시편을 제작하였고, 두 종류의 슬러리를 비교 분석 하였다. Cu 연마율(removal rate)과 슬러리에 대한 $SiO_2$와 Ti barrier의 선택비(selectivity)를 측정하였으며, 라인 폭과 금속 패턴 밀도에 대한 Cu dishing과 oxide erosion을 평가하였다.

• The Journal of Advanced Prosthodontics
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• 제10권1호
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• pp.18-24
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• 2018

PURPOSE. In literature, many studies compare survival rates of different types of FPDs. Most of them compared restorations, which originated from one university, but from different clinicians. Data about restoration survival rates by only one experienced dentist are very rare. The aim of this study was to evaluate the survival rate of all-ceramic FPDs without the blurring effects of different clinicians. MATERIALS AND METHODS. 153 veneered-zirconia FPDs were observed for follow-up. 22 patients received 131 single crowns and 22 bridges. Because of the different bridge lengths, one unit was defined as a restored or replaced tooth. In total, 201 units were included. Only the restorations performed by the same clinician and produced in the same dental laboratory from 2011 to 2016 were included. Considered factors were defined as "type of unit", "type of abutment", "intraoral region", and "vitality". Modified UHPHS criteria were used for evaluation. Statistical analysis was performed using cox-regression. RESULTS. 189 units (94.0%) showed no kind of failure. 5 chippings (2.4%) could be corrected by intraoral polishing. 4 units (1.9%) exhibited spontaneous decementation. These polishable and recementable restorations are still in clinical use. Chippings or decementations, which lead to total failure, did not occur. One unit was completely fractured (0.5 %). Biological failures (caries, periodontitis or periimplantitis) did not occur. The statistical analysis of the factors did not reveal any significant differences. CONCLUSION. Modern all-ceramic FPDs seem to be an appropriate therapy not only for single restorations but for complex occlusal rehabilitations.

• Tribology and Lubricants
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• 제32권2호
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• pp.44-49
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• 2016

Diamond mechanical polishing (DMP) is a crucial process in a sapphire wafering process to improve flatness and achieve the target thickness by using free abrasives. In a DMP process, material removal rate (MRR) is a key factor to reduce process time and cost. Controlling mechanical parameters, such as velocity and pressure, can increase the MRR in a DMP process. However, there are limitations of using high velocities and pressures for achieving a high MRR owing to their side effects. In this paper, we present the lapping characteristics and improvement of MRR by using a fixed abrasive plate through an experimental study. The change in MRR as a function of velocity and pressure follows Preston's equation. The surface roughness of a wafer decreases as the plate velocity and pressure increases. We observe a sharp decrease in MRR over the lapping time at a high velocity and pressure in the velocity and pressure test. An analysis of surface roughness (Rq and Rpk) indicates that wear of abrasives decreases the MRR sharply. In order to investigate the effect of abrasive wear on the MRR, we utilize a cutting fluid and a rough wafer. The cutting fluid delays the wear of abrasives resulting in improvement of MRR drop. The rough wafer maintains the MRR at a stable rate by self-dressing.

• 한국농공학회지
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• 제45권6호
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• pp.194-206
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• 2003

A pilot study was performed to examine the feasibility of the pond system for further polishing of treatment wetland effluent to agricultural reuse of reclaimed water. The constructed wetland and pond system was installed in Konkuk University and the effluent from septic tank of school building was used as an influent to the wetland system. The effluent of the wetland was used as an influent to pond systems. The influent concentrations of total coliform(TC), fecal coliform (FC), and E. coli were about $10^5$MPN/100 ml, and they were reduced to less than 10,000 MPN/100 ml on average after wetland treatments, showing over 95 % removal. And they were further reduced to less than 1,000 MPN/100 ml in average, showing over 85∼93 % removal after pond treatment. Turbidity and SS were improved effectively on average and their pond effluent concentration was about 4.5 NTU and 9.8 mg/L in average, respectively Average $BOD^5$ concentrations were also reduced substantially to 9.3 mg/L with about 83 % removal rate after wetland and pond treatment systems. Nutrients removal was relatively low and removal rate for T-N and T-P was less than 43 and 44%, respectively after wetland and pond treatment. Considering stable performance and effective removal of bacterial indicators as well as other water quality parameters, low maintenance, and cost-effectiveness, pond system was thought to be an effective and feasible alternative for agricultural reuse of reclaimed water. This paper describes a preliminary result Iron pilot study and further investigations are recommended on the optimum design parameters before full scale application.

• 한국재료학회지
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• 제27권3호
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• pp.137-143
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• 2017

Boron-doped diamond (BDD) electrode has an extremely wide potential window in aqueous and non-aqueous electrolytes, very low and stable background current and high resistance to surface fouling due to weak adsorption. These features endow the BDD electrode with potentially wide electrochemical applications, in such areas as wastewater treatment, electrosynthesis and electrochemical sensors. In this study, the characteristics of the BDD electrode were examined by scanning electron microscopy (SEM) and evaluated by accelerated life test. The effects of manufacturing conditions on the BDD electrode were determined and remedies for negative effects were noted in order to improve the electrode lifetime in wastewater treatment. The lifetime of the BDD electrode was influenced by manufacturing conditions, such as surface roughness, seeding method and rate of introduction of gases into the reaction chamber. The results of this study showed that BDD electrodes manufactured using sanding media of different sizes resulted in the most effective electrode lifetime when the particle size of alumina used was from $75{\sim}106{\mu}m$ (#150). Ultrasonic treatment was found to be more effective than polishing treatment in the test of seeding processes. In addition to this, BDD electrodes manufactured by introducing gases at different rates resulted in the most effective electrode lifetime when the introduced gas had a composition of hydrogen gas 94.5 vol.% carbon source gas 1.6 vol.% and boron source gas 3.9 vol.%.