• Tribology and Lubricants
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• 제17권5호
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• pp.399-405
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• 2001

In this paper the ball-on-disk type sliding tests with boundary lubricated steels were carried out to verify the relation between surface profiles and wear as well as scuffing. Three kinds of surface roughness and asperity radius were produced on AISI 1045 steels using the different processes of grinding and polishing. Frictional forces and time to scuffing were measured. Also, the shape and amount of wear particles were analyzed to compare with original profiles. From the tests, it was confirmed that the size of wear particles are very related to original surface profile. The time to failures and wear amounts were sensitive to the surface spacing. The large surface spacing shows much longer sliding life and smaller wear amount than the others. Time to scuffing was increased with increasing surface profile spacing. The sire of wear particles was increased and the amount was decreased with increasing surface profile spacing. Wear volume and wear rate K were decreased with increasing surface profile spacing. And after sliding tests, surface cracks of inner parts of the wear track occurred scuffing were observed and compared the differences about each specimen having the different surface profile spacing.

• 한국기계가공학회지
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• 제2권1호
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• pp.57-62
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• 2003

Machining technique for optical crystals with single point diamond turning tool is reported in tills paper. The main factors influencing the machined surface quality are discovered and regularities of machining process are drawn. Optical crystals have found more and more important applications in the field of modern optics. Optical crystals are mostly brittle materials of poor machinability The traditional machining method is polishing which has many shortcomings such as low production efficiency, poor ability to be automatically controlled and edge effect of the workpiece. SPDT has been widely used in manufacturing optical reflectors of non-ferrous metals such as aluminum and copper which are easy to be machined for their proper ductility. But optical crystals being discussed here are characterized by their high brittleness which makes it difficult to obtain high quality optical surfaces on them. The purpose of our research is to find the optimum machining conditions for ductile cutting of optical crystals and apply the SPDT technique to the manufacturing of ultra precision optical components of brittle materials. As a result, the cutting force is steady, the cutting force range is 0.05-0.08N. The surface roughness is good when spindle is above 1400rpm, and feed rate is small. The influence of depth of cut is very small.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.1117-1120
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• 2001

Chemical mechanical planarization(CMP) has emerged as the planarization technique of choice in both front-end and back-end integrated circuit manufacturing. Conventional CMP process utilize a polyurethane polishing pad and liquid chemical slurry containing abrasive particles. There have been serious problems in CMP in terms of repeatability and defects in patterned wafers. Since IBM's official announcement on Copper Dual Damascene(Cu2D) technology, the semiconductor world has been engaged in a Cu2D race. Today, even after~3years of extensive R&D work, the End-of-Line(EOL) yields are still too low to allow the transition of technology to manufacturing. One of the reasons behind this is the myriad of defects associated with Cu technology. Especially, dishing and erosion defects increase the resistance because they decrease the interconnection section area, and ultimately reduce the lifetime of the semiconductor. Methods to reduce dishing & erosion have recently been interface hardness of the pad, optimization of the pattern structure as dummy patterns. Dishing & erosion are initially generated an uneven pressure distribution in the materials. These defects are accelerated by free abrasive and chemical etching. Therefore, it is known that dishing & erosion can be reduced by minimizing the abrasive concentration. Minimizing the abrasive concentration by using Ce$O_2$ is the best solution for reducing dishing & erosion and for removal rate. This paper introduce dishing & erosion generating mechanism and a method for developing a semi-rigid abrasive pad to minimize dishing & erosion during CMP.

• 한국기계가공학회지
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• 제4권2호
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• pp.31-36
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• 2005

Machining technique for optical crystals with single point diamond turning tool is reported in this paper. The main factors influencing the machined surface quality are studied and regularities of machining process are drawn. Optical crystals have been known to more and more important applications in the field of modern optics. Ge is more brittle material of poor machinability. The traditional machining method is polishing which has many shortcomings such as low production efficiency, poor ability to be automatically controlled and edge effect of the workpiece. The purpose of our research is to find the optimum machining conditions for ductile cutting of Ge and apply the SPDTM technique to the manufacturing of ultra precision optical components of Ge. As a result, the surface roughness is the best when cutting speed is 180m/min, feed rate is 2mm/min, depth of cut is $0.5{\mu}m$ and nose radius of tool is 0.8mm.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 춘계학술대회 논문집
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• pp.775-778
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• 2000

Single point diamond turning technique fur optical crystals is reported in this paper. The main factors influencing the machined surface quality are discovered and regularities of machining process are drawn. Optical crystals have found more and more important applications in the field of modern optics. Optical crystals are mostly brittle materials of poor machinability. The traditional machining method is polishing which has many shortcomings such as low production efficiency, poor ability to be automatically controlled and edge effect of the workpiece. SPDT has been widely used in manufacturing optical reflectors of non-ferrous metals such as aluminum and copper which are easy to be machined for their proper ductility. But optical crystals being discussed here are characterized by their high brittleness which makes it difficult to obtain high quality optical surfaces on them. The purpose of cur research is to find the optimum machining conditions for ductile cutting of optical crystals and apply the SPDT technique to the manufacturing of ultra precision optical components of brittle materials. As a result, the cutting force is steady, the cutting force range is 0.05-0.08N. The surface roughness is good when spindle is above 1400rpm. and feed rate is small. The influence of depth of cut is very small.

• 한국안전학회지
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• 제24권2호
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• pp.7-12
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• 2009

The machining process of ceramics can be characterized by cracking and brittle fracture. In the machining of ceramics, edge chipping and crack propagation are the principal reasons to cause surface integrity deterioration. Such phenomenon can cause not only poor dimensional and geometric accuracy, but also possible failure of the ceramic parts. Thus, traditional ceramics are very difficult-to-cut materials. Generally, ceramics are machined using conventional method such as grinding and polishing. However these processes are generally costly and have low MRR(material removal rate). To overcome such problems, in this paper, h-BN powder, which gives good cutting property, is added for the fabrication of machinable ceramics by volume of 10 and 15%. The purpose of this study is an analysis of endmill's rake angle for appropriate tools design and manufacturing for the machinable ceramics. In this study, Experimental works are executed to measure cutting force, surface roughness, tool fracture, on different axial rake angle of endmills. Cutting parameters, namely, feed, cutting speed and depth of cut are used to accomplish purpose of this paper. Required experiments are performed, and the results are investigated.

• Tribology and Lubricants
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• 제27권1호
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• pp.7-12
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• 2011

Interest in advanced machining process such as AJM(abrasive jet machining) and CMP(chemical-mechanical polishing) using micro/nano-sized abrasives has been on the increasing demand due to wide use of super alloys, composites, semiconductor and ceramics, which are difficult to or cannot be processed by traditional machining methods. In this paper, the effects of pressure, wafer moving velocity and fluid viscosity were investigated by 2-dimensional finite element analysis method considering slurry fluid flow. From the investigation, it could be found that the simulation results quite corresponded well to the Preston's equation that describes pressure/velocity dependency on material removal. The result also revealed that the stress and corresponding material removal induced by the collision of particle may decrease under relatively high wafer moving speed due to the slurry flow resistance. In addition, the increase in slurry fluid viscosity causes the reduction of material removal rate. It should be noted that the viscosity effect can vary with the shape of abrasive particle.

• 한국정밀공학회지
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• 제22권7호
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• pp.122-129
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• 2005

Shoe with leather upper such as safety and golf shoe requires a roughing process where the upper is roughed fur helping outsole to be cemented well. It is an important and basic process for production of leather shoe but is not automated yet. Thus, there are problems that the defect rate is high and the quality of roughed surface is not uniform. In order to solve such problems, the interest in automation of roughing process is being increased and this paper introduces CAM system for 5-axis automatic roughing machine as one part of automation of roughing process. The CAM system developed interpolates a B-spline curve using points measured from the Roughing Path Measurement System. The B-spline curve is used to generate the tool path and orientation data fer a roughing tool which has not only stiffness but also flexibility to rough the inclined surface efficiently. For productivity, the upper of shoe is machined by side of the roughing tool and tool offset is applied to the roughing tool for machining of inclined surface. The generated NC code was applied to 5-axis polishing machine for the test. The upper of shoe was roughed well along the roughing path data from CAM and the roughed surface was proper fur cementing of the outsole.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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• pp.1450-1451
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• 2006

In this paper, we first applied the chemical mechanical polishing (CMP) process to the planarization of ferroelectric film in order to obtain a good planarity of electrode/ferroelectric film interface. $Bi_{3.25}La_{0.75}Ti_{3}O_{12}$ (BLT) ferroelectric fan was fabricated by the sol-gel method. Removal rate and non-uniformity (WIWNU%) were examined by change of silica slurries pH(10.3, 11.3, 12.3). Surface roughness of BLT thin films before and after CMP process was inquired into by atomic force microscopy (AFM). Effects of silica slurries pH(10.3, 11.3, 12.3) were investigated on the CMP performance of BLT film by the surface analysis of X-ray photoelectron spectroscopy(XPS).

• 한국안전학회지
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• 제24권1호
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• pp.1-6
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• 2009

In machining of ceramic materials, they are very difficult-to cut materials because of there high strength and hardness. Machining of ceramics are characterized by cracking and brittle fracture. Generally, ceramics are machined using conventional method such as grinding and polishing. However these processes are generally costly and have low MRR(material removal rate). This paper focuses on machinability evaluation of machinable ceramics for products with CNC machining center. Thus, in this paper, experiment applying cutting parameters is performed based on experimental design method. A design and analysis of experiments is conducted to study the effects of these parameters on the surface roughness by using the S/N ratio, analysis of ANOVA, and F-test. And multiple linear regression analysis is applied to compare experimental with predicted data in consideration of surface roughness. Cutting parameters, namely, feed, cutting speed and depth of cut are used to accomplish purpose of this paper. Required experiments are performed, and the results are investigated.