• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1996년도 춘계학술대회 논문집
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• pp.137-142
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• 1996

Magnetic-electrolytic-abrasive polishing system(MEAPS) was developed for machining national standard electrode and its finishing characteristics was analyzed. The paper describes the operational principle of MEAP system by experimental results. The finishing characteristics and optimal finishing condition for national standard electrodes were experimented and analyzed. As a result, MEAPS can improve straightness as well as surface roughness.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 춘계학술대회 논문집
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• pp.483-484
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• 2008

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.947-952
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• 1997

The magnetic polishing is the useful method to finish using magnetic power of a magnet. The time hasn't been that long since the magnetic polishing method was introduced to korea as one of precision polishing techniques. However, the reasons for not being spreaded widely are the magnetic polishing method don't have mediocrity for machine, the efficiency of magnet-abrasive is confined as a bad polishing, and there are not many researchers in this field. The mechanism of this R&D is dealing with the dynamic state of magnet-abrasive. This paper deals with mediocritizing magnetic polishing device into regular lathe and this experiment was conducted in order to get a best surface roughness with low cost. Beside the subsidiary experiment was performed using the mixed magnet-abrasive with general alumina, barium. This paper introduced the main reason for difficulty using this method in industrial field. It needs more continues research on it. This paper contains the result of experiment to acquire the best surface roughness, not using the high-cost polishing material in processing. The average diameters of magnet-abrasive are the particles of 150 $\mu\textrm{m}$, 250 $\mu\textrm{m}$.

• Design & Manufacturing
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• 제11권2호
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• pp.20-24
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• 2017

Recent industrial developments are constantly advancing, and rapid technological development is demanding high technology level in related fields. The need for polishing is increasing even more to improve quality. In order to improve the surface quality, the final finishing process or polishing process is a very important part. Research on super precise polishing method using MR fluid is actively being carried out in domestic and foreign countries. Fine magnetic abrasive grains are aligned in the direction of a magnetic force line formed by a magnetic field and serve as a brush to polish a metal surface. This method has the advantage that the shape of the tool is not fixed and is not affected by the shape of the workpiece or the machining area. We will design the electromagnets for the MR polish polishing system and apply the magnetic field analysis using the magnetic field analysis program (ANSYS). The data obtained through this process suggests an efficient method to increase the magnetic flux density important for polishing. We will investigate the influence of the Al6061-T6 specimen on the surface of the MR polishing machine based on the optimized design.

• 한국가시화정보학회:학술대회논문집
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• 한국가시화정보학회 2004년도 추계학술대회 논문집
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• pp.48-51
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• 2004

Chemical Mechanical Polishing(CMP) is popularly used in production of semiconductor because of large area polishing ability probability of improvement for more integrated circuit. However, present CMP processing causes some non-uniformity errors which can be critical for highly integrated circuit. Previous studies predict that flow-field of slurry during CMP can create non-uniformity, but no quantitative measurement has conducted. In this study, using PIV, slurry velocity flow-field during CMP is measured by changing the ratio of RPM of pad and carrier with tuned PIV system adequate for small room in CMP machine and Cabot's non-groove pad Epad-A100. The result show that velocity of slurry is majorly determined by pad-rpm and the ratio of between carrier and pad rpm make some changes in streamlines.

• 한국분말재료학회지
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• 제8권1호
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• pp.20-25
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• 2001

Most of mold manufacturing procedures have been automated by the introduction of NC machine tool and CAD/CAM system. But the three-dimensional surface curvature of the mold must be done by hand work of well-skilled workers. Magnetic abrasive polishing powders were investigated for surface polishing for 3D curvature. This study aims to investigate homogeneously distributed hard phase in Fe matrix and strong bonding between Fe-matrix and hard phase. The NbC powder, $B_4C$ powder and $Al_2O_3$ powder were mixed in Fe-matrix respectively. Mixed Fe-hard phase powders were compacted by press and then these were melted by plasma melting. According to SEM, XRD and OM observation, Fe-NbC magnetic abrsive powder had the most homogeneous distribution and strong bonding. As a result of magnetic polishing, the surface roughness before magnetic polishing, 1 ${\mu}m$ $R_{max}$, was reduced to 0.2 ${\mu}m$ $R_{max}$ over the entire inner surface of the tube.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.166-169
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• 2005

The magnetic polishing is the useful method to finish using magnetic power of magnet. This method is one of precision polishing techniques and has an aim of the clean. technology using for the pure of gas and inside of the sanitary pipe for transportation. The magnetic abrasive polishing method is not so common for machine that it is not spreaded widely. There are rarely researcher in this field because of non-effectiveness of magnetic abrasive. In this paper. We could have investigated into the changes of the movement of magnetic abrasive grain. In reference to this result, we could have made the experiment which is set under the condition of the magnetic flux density, polishing velocity according to the form of magnetic brush.

• 구강회복응용과학지
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• 제37권1호
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• pp.16-22
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• 2021

목적: 표면연마와 제작방법이 임시 수복용 레진의 굽힘강도에 미치는 영향을 분석하고자 한다. 연구 재료 및 방법: 4가지 제작방법을 이용하여 각각 30개의 임시 수복용 레진 시편을 제작하였고, 기계적 연마로 표면연마를 시행한 그룹과 연마를 시행하지 않은 2개의 그룹으로 나누었다. 시편은 37℃ 항온기에 24시간 보관 후 만능시험기(Universal testing machine)을 이용하여 3점 굽힘강도를 측정하였다. 통계분석은 Two-way ANOVA와 Tukey's HSD test, Paired t-test를 이용하여 분석하였다. 결과: 표면연마 여부와 관계없이 CAD/CAM milling으로 제작한 시편이 가장 높은 굽힘강도를 나타냈고, SLA 3D printing, DLP 3D printing, Conventional method 순으로 높은 굽힘강도를 나타냈다. 결론: 표면연마는 임시 수복용 레진의 굽힘강도에 유의한 영향을 끼치지 못했지만(P > 0.05), 제작방법에 의해서는 굽힘강도의 유의한 차이가 나타났다(P < 0.05).

• 한국정밀공학회지
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• 제13권6호
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• pp.59-65
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• 1996

There are many difficulties in automatic polishing for die & mold surfaces. Even though the process has been studied in the past 15 years, it has not been achieved yet, but by the process of actual hand work of well-skilled workers. A new magentic assisted polishing process, which is one of the potential methods for automation of surface finishing has been studied in the past 10 years by colleagues. The process has many merits, but on the other hand also has demerits, one being low efficiency of grindability by comparision with wheel polish. Therefore, some attempts were tried to improve the grindability by adopting electropolishing, ultra-high speed milling, 5-axis controlled machine etc... most recently by colleagues. This paper also aims to improve the efficiency of polishing by introducing the easily-polished shape surface cutting method equalizing the tool feed per revolution to the pick feed. This cutting method was experimentally confirmed to have sufficient grindability to polish milled surface (with $10{{\mu}m}$Rmax surface roughness) into mirror surface (with $0.4{{\mu}m}$Rmax surface roughness).

• 한국공작기계학회논문집
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• 제17권2호
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• pp.1-6
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• 2008

In recent years, developments in the semiconductor and electronic industries have brought a rapid increase in the use of large size silicon wafer. For further improvement of the ultra precision surface and flatness of Si wafer necessary to high density ULSI, it is known that polishing is very important. However, most of these investigation was experiment less than 300mm diameter. Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study reports the machining variables that has major influence on the characteristic of wafer polishing. It was adapted to polishing pressure, machining speed, and the slurry mix ratio, the optimum condition is selected by ultra precision wafer polishing using load cell and infrared temperature sensor. The optimum machining condition is selected a result data that use a pressure and table speed data. By using optimum condition, it achieves a ultra precision mirror like surface.