• Title/Summary/Keyword: Polishing machine

Search Result 219, Processing Time 0.03 seconds

A Study on Magnetic Abrasive (자기 연마재에 관한 연구)

  • Kim, Hee-Nam
    • Design & Manufacturing
    • /
    • v.2 no.4
    • /
    • pp.44-47
    • /
    • 2008
  • The magnetic polishing is the useful method to finish some machinery fabrications by using magnetic power. This method is one of the precision techniques and has an aim for clean technology in the transportation of the pure gas in the clean pipes. The magnetic abrasive polishing method is not so common in the field of machine that it is not known to widely. There are rarely researcher in this field because of non-effectiveness of magnetic abrasive. Therefore, in this paper we deals with the development of the magnetic abrasive with the use of Sr-Ferrite. In this development, abrasive grain A has been made by using the resin bond fabricated at low temperature. And magnetic abrasive powder was fabricated from the Sr-Ferrite which was crushed into 200 mesh. The XRD analysis result shows that only A abrasive and Sr-Ferrite crystal peaks were detected, explaining that resin bond was not any more to contribute chemical reaction. From SEM analysis, we found that A abrasive and Sr-Ferrite were strongly bonding with each other.

  • PDF

A Study on the Nano Grinding of Sapphire by Ultra-Precision Grinder (초정밀 연삭기에 의한 사파이어의 나노가공)

  • 김우순;김동현;난바의치
    • Transactions of the Korean Society of Machine Tool Engineers
    • /
    • v.12 no.5
    • /
    • pp.40-45
    • /
    • 2003
  • Optical and electronic industries are using lapping and polishing processing as a final finish rather than grinding, because they need more accurate parts of brittles non-metallic materials such as single crystals. Sapphire has been ground by the ultra-precision surface grinder having a glass -ceramic spindle of extremely-low thermal expansion with various cup-type resinoid-bonded diamond wheels of #400-#3000 in grain size. Sapphire can be ground in the ductile mode. And also, the surface roughness and grinding conditions has been clarified. The smooth surface of Sapphire less than 1nm RMS, 1nm Ra can be obtained by the ultra-precision grinding without any polishing process.

Development of The Magnetic Abrasive Using Barium Ferrite (Ba-Ferrite를 이용한 자기 연마재 개발)

  • 김희남;송승기;정윤중;윤여권;김희원;조상원;심재환
    • Journal of the Korean Society of Safety
    • /
    • v.18 no.2
    • /
    • pp.46-49
    • /
    • 2003
  • The magnetic polishing is the useful method to finish some machinery fabrications by using magnetic power. This method is one of the precision techniques and has m aim for clean technology in the transportation of the pure gas in the clean pipes. The magnetic abrasive polishing method is not so common in the field of machine that it is not known to widely. There are rarely researcher in this field because of non-effectiveness of magnetic abrasive. Therefore, in this paper we deals with the development of the magnetic abrasive with the use of Ba-Ferrite. In this development, abrasive grain WA has been made by using the min bond fabricated at low temperature. And magnetic abrasive powder was fabricated from the Ba-Ferrite which was crushed into 200 mesh. The XRD analysis result shows that only WA abrasive and Ba-Ferrite crystal peaks were detected, explaining that resin bond was not any more to contribute chemical reaction. From SEM analysis, we found that WA abrasive and Ba-Ferrite were strongly bonding with each other.

A Global Planarization of Interlayer Dielectric Using Chemical Mechanical Polishing for ULSI Chip Fabrication (화학기계적폴리싱(CMP)에 의한 층간절연막의 광역평탄화에 관한 연구)

  • Jeong, Hea-do
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.13 no.11
    • /
    • pp.46-56
    • /
    • 1996
  • Planarization technique is rapidly recognized as a critical step in chip fabrication due to the increase in wiring density and the trend towards a three dimensional structure. Global planarity requires the preferential removal of the projecting features. Also, the several materials i.e. Si semiconductor, oxide dielectric and sluminum interconnect on the chip, should be removed simultaneously in order to produce a planar surface. This research has investihgated the development of the chemical mechanical polishing(CMP) machine with uniform pressure and velocity mechanism, and the pad insensitive to pattern topography named hard grooved(HG) pad for global planarization. Finally, a successful result of uniformity less than 5% standard deviation in residual oxide film and planarity less than 15nm in residual step height of 4 inch device wafer, is achieved.

  • PDF

Development of Abrasive Film Polishing System for Cover-Glass Edge using Multi-Body Dynamics Analysis (다물체 동역학 해석을 이용한 커버글라스 Edge 연마용 Abrasive Film Polishing 시스템 개발)

  • Ha, Seok-Jae;Cho, Yong-Gyu;Kim, Byung-Chan;Kang, Dong-Seong;Cho, Myeong-Woo;Lee, Woo-Jung
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.16 no.10
    • /
    • pp.7071-7077
    • /
    • 2015
  • In recently, the demand of cover-glass is increased because smart phone, tablet pc, and electrical device has become widely used. The display of mobile device is enlarged, so it is necessary to have a high strength against the external force such as contact or falling. In fabrication process of cover-glass, a grinding process is very important process to obtain high strength of glass. Conventional grinding process using a grinding wheel is caused such as a scratch, chipping, notch, and micro-crack on a surface. In this paper, polishing system using a abrasive film was developed for a grinding of mobile cover-glass. To evaluate structural stability of the designed system, finite element model of the polishing system is generated, and multi-body dynamic analysis of abrasive film polishing machine is proposed. As a result of the analysis, stress and displacement analysis of abrasive film polishing system are performed, and using laser displacement sensor, structural stability of abrasive film polishing system is confirmed by measuring displacement.

A Study on the Tower type Fizeau Interferometer System with a Fold Minor for Measuring Large Optical Lens Profile (반사경 측정을 위한 타워 방식의 Fold Mirror를 이용한 Fizeau 간섭계 시스템 구성)

  • Lee, Eung-Suk;Lee, Ki-Am;Kim, Ok-Hyun
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.25 no.8
    • /
    • pp.21-28
    • /
    • 2008
  • Fizeau interferometer is used for inspecting the lens surface profile accurately. This study is focused on the design and optical measuring techniques for large optical components, such as a reflection mirror for large area lithography or astronomical purpose. A tower type Fizeau interferometer is designed and set up in horizontally with a 45$^{\circ}$ fold mirror which makes easy to align the optical path of heavy interferometer system. To align the optical path, a five-axes stage for the interferometer is required. This study shows a method of the 45$^{\circ}$ fold mirror alignment by using a three-axis stage instead of adjusting the interferometer itself or measuring object. This system will be installed on the large optics polishing machine during the manufacturing process as an on-machine inspection system.

Study on Fabrication of a Large Concave Mirror Surface Using a Swing-Arm Type Profilometer (스윙암 방식의 형상 측정기를 이용한 대형 반사경의 정밀가공에 관한 연구)

  • Lee, Ki-Am;Kim, Ock-Hyun;Lee, Eung-Suk
    • Journal of the Korean Society of Manufacturing Process Engineers
    • /
    • v.7 no.3
    • /
    • pp.41-46
    • /
    • 2008
  • Generally optical components are fabricated by grinding, lapping and polishing processes. Those processes take long time to obtain optical high surface quality. In the case of large optical components, the on-machine measurement is strongly recommended because the workpiece is fragile and difficult to set up for fabricating and measuring. This paper is concerned about a swing-arm mechanism which can be used for on-machine measurement of a surface profile with a sensing probe end-effect, and also for grinding or lapping the surface with a corresponding tool. The measuring accuracy and uncertainty using a swing arm type profilometer have been studied. The experimental results show that this method is useful specially in lapping process with the accuracy of $5{\mu}m$. Those inspection data are provided for correcting the residual figuring error in next processes.

  • PDF

Development of a Fizeau Interferometer System for Measuring the Profile of Large Optical Lens (대구경 렌즈의 형상 측정을 위한 Fizeau 간섭계 시스템 개발)

  • Bae, Kwang-Hwan;Lee, Eung-Suk;Lee, Ki-Am;Kim, Ok-Hyun
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.30 no.12 s.255
    • /
    • pp.1649-1657
    • /
    • 2006
  • Fizeau interferometer is well known optical instrument for measuring the lens profile accurately. The object of this study is focused on the design and optical measuring techniques for large optical components, such as a reflection mirror for astronomical purpose. Measuring of large optical lens, the object could not be moved as small one but the measuring instrument must be moved for the alignment, because of the geometric conditions and the accuracy of the stage. Therefore, a five axis stage is designed to align the Interferometer instead of the measuring object. This instrument will be used for an on machine measuring system in polishing machine for large optical lens.

Experimental Verification of Characteristics of Magnetic Abrasive Polishing Combined with Ultrasonic Vibration (실험계획법에 의한 초음파가 부가된 자기연마가공의 특성평가)

  • Jin, Dong-Hyun;Kwak, Jae-Seob
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.39 no.9
    • /
    • pp.923-928
    • /
    • 2015
  • In this paper, we propose an ultrasonic magnetic abrasive polishing (US-MAP) technique to effectively machine a high-strength material, and we prove the efficiency of hybrid finishing. We use Taguchi's experimental method to determine the influence of each parameter. Based on the results, US-MAP exhibited a higher polishing efficiency than traditional MAP, and a suitable frequency for hybrid finishing was 28 kHz. When investigating the effect of the parameters on the surface roughness, the ultrasonic amplitude had the greatest effect. However, when machining with $55-{\mu}m$ amplitude, the machining efficiency decreased as the magnetic flux density varied.

Evaluations of Magnetic Abrasive Polishing and Distribution of Magnetic Flux Density on the Curvature of Non-Ferrous Material (곡면 자기연마에서의 자기력 형성과 가공특성에 관한 연구)

  • Kim, Sang-Oh;Kwak, Jae-Seob
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.36 no.3
    • /
    • pp.259-264
    • /
    • 2012
  • Automatic magnetic abrasive polishing (MAP), which can be applied after machining of a mold on a machine tool without unloading, is very effective for finishing a free-form surface such as a complicated injection mold. This study aimed to improve the efficiency of MAP of a non-ferrous mold surface. The magnetic array table and control of the electromagnet polarity were applied in the MAP of a free-form surface. In this study, first, the magnetic flux density on the mold surface was simulated to determine the optimal conditions for the polarity array. Then, the MAP efficiency for polishing a non-ferrous mold surface was estimated in terms of the change in the radius of curvature and the magnetic flux density. The most improved surface roughness was observed not only in the upward tool path but also in the working area of larger magnetic flux density.