• Journal of the Korean Society for Precision Engineering
• /
• v.22 no.4
• /
• pp.44-51
• /
• 2005

In this paper, a new polishing head with the variable pressure structure was studied to improve the planarization uniformity of the conventional template-metal head. Metal surface waviness and slurry distribution on the pad have been known to affect the polishing uniformity even in the synchronized quill and platen velocities. A polishing head with silicon rubber sheet was used to get a curved pressure distribution. In the experiment, the vertical deflection behavior on the pad was characterized with back pressure in the air chamber. Quill force increased linearly with backpressure. However, backpressure under a quill force made the upward movements of the quill. In the wafer polishing experiments, polishing rate and polishing thickness distribution were severely changed with backpressure. The best uniformity was observed with the standard deviation off.5％ level of average polishing removal 215nm at backpressure 12.1kPa.

• Journal of the Semiconductor & Display Technology
• /
• v.13 no.1
• /
• pp.13-17
• /
• 2014

Since the semiconductor manufacturing requires the silicon wafers with extraordinary degree of surface flatness, the surface polishing of wafers from ingot cutting is an important process for deciding surface quality of wafers. The present study introduces the development of wafer polishing equipment and, especially, the wafer polishing head that employs the forced self-driving of installed silicon wafer as well as the wax wafer mounting technique. A series of wafer polishing tests have been carried out to investigate the effects of self-driving function in wafer polishing head. The test results for wafer planarization showed that the LLS counts and SBIR of polished wafer surfaces were generally improved by adopting the self-driven polishing head in wafer polishing stations.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.25 no.4
• /
• pp.301-306
• /
• 2016

High speed polishing can kinematically increase the polishing removal rate by using the conventional Preston equation, especially for hard substrates such as sapphire or diamond. However, high speed effects should be clarified beforehand considering the lubrication state and process parameter variations. In this paper, we developed a polishing experimental method and apparatus to determine the lubrication state by measuring the real time friction coefficient using two load cells. Through experiments, we obtained a boundary lubrication state above 0.35 of the friction coefficient by using low table speed and high polishing load, indicating a synchronized stable behavior in polishing head rotation. However, larger Stribeck indexes by a high speed above 200 rpm can generate a hydrodynamic lubrication state below 0.25 of the low friction coefficient. This causes the polishing head rotation to stop. A forced and synchronized head rotation is required for high speed polishing.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.22 no.2
• /
• pp.310-317
• /
• 2013

In this paper, the contact pressure of the wafer and polishing pad for final polishing process for 300 mm-wafer were investigated through numerical analysis using FEM tool, ANSYS. The distribution of the contact pressure is one of main parameters which affects on the flatness and surface roughness of polished wafers. Two types of polishing head, a hard type head with ceramic disk and a soft type head with air bag were considered. The effects of the deformation and initial shape of table on the contact pressure were also examined. Both heads and tables were modeled as 3D finite element model from solid model, and the material properties of polishing pads and rubber plate for the air-bag head were obtained from tensile tests. The contact pressure deviation on wafer surface was smaller with air bag head than hard type head even when the table had form errors such as convex or concave. From this 3D analysis, it could be concluded that the air-bag head has better uniformity of the contact pressure on wafer. Also, the effects of inner diameter of air bag and radial clearance between wafer and retainer were investigated as view point of contact pressure concentration on the edge of wafer.

• Journal of the Korean Society for Precision Engineering
• /
• v.20 no.1
• /
• pp.107-117
• /
• 2003

Polishing a die that has free-form surfaces is a time-consuming and tedious job, and requires a considerable amount of high-precision skill. In order to reduce the polishing time and cope with the shortage of skilled workers, an automatic polishing robot system was developed. The polishing robot system is composed of two subsystems, a three-axis machining center and a two-axis polishing head. The machining center is controlled by a FANUC controller, and the polishing head by DSP controller. The system has five degrees of freedom and is able to keep the polishing tool normal to the die surface during operation. To easily operate the developed polishing robot system, this study developed an integrated operating program in the Windows environment. The program consists of five modules: a polishing data generation module, a code separation module, a polishing module, a graphic simulator module, and a teaching module. And, the automatic teaching system was developed to easily obtain teaching data and it consists of a three dimensional joystick and a proximity sensor. Also, to evaluate the performance of the integrated operating program and the polishing robot system, polishing experiments of a die of shadow mask were carried out.

• International Journal of Precision Engineering and Manufacturing
• /
• v.5 no.3
• /
• pp.69-76
• /
• 2004

Polishing a die that has free-form surfaces is a time-consuming and tedious job, and requires a considerable amount of high-precision skill. In order to reduce the polishing time and cope with the shortage of skilled workers, an automatic polishing robot system was developed. The polishing robot system is composed of two subsystems, a three-axis machining center and a two-axis polishing head. The machining center is controlled by a FANUC controller, and the polishing head by DSP controller. The system has five degrees of freedom and is able to keep the polishing tool normal to the die surface during operation. To easily operate the developed polishing robot system, this study developed an integrated operating program in the Windows environment. The program consists of five modules: a polishing data generation module, a code separation module, a polishing module, a graphic simulator module, and a teaching module. Also, the automatic teaching system was developed to easily obtain teaching data and it consists of a three dimensional joystick and a proximity sensor. Also, to evaluate the performance of the integrated operating program and the polishing robot system, polishing experiments of a die of shadow mask were carried out.

• Tribology and Lubricants
• /
• v.32 no.2
• /
• pp.61-66
• /
• 2016

Total thickness variation (TTV), BOW, and surface roughness are essential characteristics for high quality sapphire substrates. Many researchers have attempted to increase removal rate by controlling the key process parameters like pressure and velocity owing to the high cost of consumables in sapphire chemical mechanical polishing (CMP). In case of the pressure approach, increased pressure owing to higher deviation of pressure over the wafer leads to significant degradation of the TTV. In this study, the authors focused on reducing TTV under the high-pressure conditions. When the production equipment polishes multiple wafers attached on a carrier, higher loads seem to be concentrated around the leading edge of the head; this occurs because of frictional force generated by the combination of table rotation and the height of the gimbal of the polishing head. We believe the skewed pressure distribution during polishing to be the main reason of within-wafer non-uniformity (WIWNU). The insertion of a hub ring between the polishing head and substrate carrier helped reduce the pressure deviation. Adjusting the location of the hub ring enables tuning of the pressure distribution. The results indicated that the position of the hub ring strongly affected the removal profile, which confirmed that the position of the hub ring changes the pressure distribution. Furthermore, we analyzed the deformation of the head via finite element method (FEM) to verify the pressure non-uniformity over the contact area Based on experiment and FEM results, we determined the optimal position of hub ring for achieving uniform polishing of the substrate.

• Proceedings of the Safety Management and Science Conference
• /
• 2004.11a
• /
• pp.165-170
• /
• 2004

It used the flow system of the stone polishing machine head and it developed a multi axis whetstone polishing system. With the result, the defect by line contact polishing does not occur in both ends of the stone, and it came to trim smoothly. As the index of the surface roughness decreased to 3.6 times, the polishing effect improved greatly. It decreased greatly the dust and a noise with the wet polishing, and the factors of the duty evasion at production site were solved with the work environment improvement against the polishing process of the stone industry and work intensive reduction.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.1836-1839
• /
• 2003

This paper describes the surface polishing characteristics of a flat and free surface ferromagnetic substance(SM45C) that magnetic abrasive polishing processed. The effects of the various working factors on the surface roughness are clarified by experiments respectively, such as magnetic flux density. rotation speed of magnetic head. working gap, feed rate of workpiece. diameter of magnetic abrasives. and shape of workpiece. On the basis of these experiments, the polishing mechanism is discussed and the characteristics of the polishing process are described. In addition, it is found experimentally that die ＆ mold surfaces are also polished precisely by this process

• Journal of the Korea Safety Management & Science
• /
• v.6 no.4
• /
• pp.171-181
• /
• 2004

A multi axis whetstone polishing system, which uses the flow system of the stone polishing machine head, has been developed. The test results show that the defect by line contact polishing does not occur in both ends of the stone and that it came to trim smoothly. In terms of the surface roughness, the corresponding index was decreased by 3.6 times, improving the polishing effect greatly. It decreased significantly the dust and noise with the wet polishing. The factors of the duty evasion at production site can thus be solved with the work environment improvement against the polishing process of the stone industry and work intensive reduction.