• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.127-130
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• 2003

Electrolytic polishing is the anodic dissolution process in the transpassive state. It removes non-metallic inclusions and improves mechanical and corrosion resistance of stainless steel. Electrolytic polishing is normally used to remove a very thin layer of material from the surface of a metal object. An electrolyte of phosphoric, sulfuric and distilled water has been used in this study. In the low current density region, there can be found plateau region and material removal process and leveling process occur successively. In this study, an electrochemical polishing process using pulse current is adopted as a new electrochemical polishing process. In electrochemical machining processes, it has been found that pulse electrochemical processes provide an attractive alternative to the electrochemical processes using continuous current. Hence, this study will discuss the electrochemical polishing processes in low current density region and pulse electrochemical polishing.

• Transactions of Materials Processing
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• v.12 no.4
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• pp.388-393
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• 2003

Electrolytic polishing is the anodic dissolution process in the transpassive state. It removes non-metallic inclusions and improves mechanical and corrosion resistance of stainless steel. Electrolytic polishing is normally used to remove a very thin layer of material from the surface of a metal object. An electrolyte of phosphoric acid 50% in vol., sulfuric acid 20% in vol. and distilled water 30% in vol. has been used in this study. In the low current density region, there can be found plateau region and material removal process and leveling process occur successively. In this study, an electrochemical polishing process using pulse current is adopted as a new electrochemical polishing process. In electrochemical machining processes, it has been found that pulse electrochemical processes provide an attractive alternative to the electrochemical processes using continuous current. Hence, this study will discuss the electrochemical polishing processes in low current density region and pulse electrochemical polishing.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.04a
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• pp.417-422
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• 2000

In the process of die manufacturing, according to increasing demand of die and molds, the efficient machining of dies and molds has been increased. However, while the cutting process has been automated by the progress of CNC(computer numerical control) and CAD/CAM, the polishing process still depends on the experienced knowledge of an expert. Also, even when workers are skilled in polishing dies. it takes much time to obtain the required roughness and smoothness on the surface of a die. Moreover, many workers gradually avoid doing polishing work because of the poor working conditions caused by dust and noise. Therefore, to improve productivity and to solve the potential shortage of skilled workers, a user-friendly automatic polishing system was developed in this research. The developed polishing system with five degrees of freedom is able to keep the polishing tool normal to the die surface during operation and is able to maintain a pressure constantly by the developed pneumatic system. Also, to evaluate polishing performance of the developend system and find the polishing conditions, the various polishing experiments were carried out.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.327-331
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• 2001

In the process of optical parts machining, polishing has been applied. Traditional polishing process is suitable for spherical optical parts. But it is very difficult to apply traditional process for aspheric optical parts. Nowadays, as growing needs for aspherical optic parts, many researches have been conducted. In this study, we developed computer controlled polishing system which consists of three major parts of active pressure control for correcting polishing process, mechanical on-machine measurement for rough polishing, and optical on-machine measurement for finish polishing, respectively. In this paper, a systematic stretegy for correcting polishing process, pressure control scheme for polishing tool, and on-machine measurement methods for automated and precise polishing are suggested. The information about developed machine is also included.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.2
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• pp.80-86
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• 2000

Although polishing process take 30-50% of whole process of manufacturing die and mold it has not been fully automat-ed yet. Considering current trend of manufacturing it is necessary to study on polishing automation. To accomplish automation reliable database must be developed. For developing it polishing mechanism should be defined and a general empirical formula that can be applied widely should be created. In this paper it is found that polishing process must be separated into 2 process such as removing cusp and getting fine surface process and the polishing parameter which is com-posed of major machining parameters and normalization of data can be applied efficiently in making reliable database.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.2
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• pp.267-274
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• 2010

Recently, the magnetorheological (MR) polishing process has been examined as a new ultra-precision polishing technology for mirror surface generation in many applications, such as aspheric lenses, biochips, micro parts, etc. This method uses MR fluids which contains micro abrasives as a polishing media, and can. It is possible to obtain nano level surface roughness under suitable process conditions, however, required polishing time is highly dependent on the applied pre-polishing methods due to its very small material removal rate. Thus, in this study, a combined polishing method is presented to reduce total polishing time for SUS304. First, the electropolishing (EP) method was applied to obtain fine surface roughness, and the MR polishing was followed. Surface roughness variations were investigated according to the process conditions. As the results of this study, it was possible to reduce total polishing time for SUS304 using the proposed combined polishing method.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.10
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• pp.839-845
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• 2007

In this paper, a polishing pad has been analyzed in detail, to understand surface phenomena of polishing process. The polishing pad plays a key role in polishing process and is one of the important layer in polishing process, because it is a reaction layer of polishing[1]. Pad surface physical property is also ruled by pad profile. The profile and roughness of pad is controlled by different types of conditioning tool. Conditioning tool add mechanical force to pad, and make some roughness and profile. Formed pad surface will affect on polishing performance such as RR (Removal Rate) and uniformity in CMP Pad surface condition is changed by conditioning tool and dummy run and is stable at final. And this research, we want to reduce break-in and dummy polishing process by analysis of pad surface and artificial machining to make stable pad surface. The surface treatment or machining enables to control the surface of polishing pad. Therefore, this research intends to verify the effect of the buffing process on pad surface through analysis of the removal rate, friction force and temperature. In this research, urethane polishing pad which is named IC pad(Nitta-Haas Inc.) and has micro pore structure, is studied because, this type of pad is most conventional type.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.5
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• pp.385-389
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• 2003

There are four main components of the CMP process: polishing pad, slurry, elastic supporter, and pad conditioner. The polishing pad is an essential component to the reproducibility of polishing uniformity in CMP process. However, the polishing pad in recently using metal CMP raised the several points of high cost caused by the increase of cycle time and the many usage of slurry. It is necessary to develop the novel polishing pad which would lead the cost reduction by the higher pad life-cycle, minimized cycle time and lower slurry usage. The characteristics of polishing pad were studied on the effects of different sets of the Polishing pad, which can be applied to metal chemical mechanical polishing process for global planarization of multilevel interconnection structure. The main purpose of this experiment is cost reduction by the increase of pad life-time, the decrease of cycle time and the lower usage of slurry through the specific hard porous structured pad design. It is confirmed that the novel polishing pad made the slurry usage decrease to 60% as well as the pad life-time increase twice with the 25% improvement of removal rate. The polishing time could be decreased and it also helped the cycle time to diminish. It can be expected that this results will help both the process throughput and the device yield to be improved.

• 제어로봇시스템학회:학술대회논문집
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• 1998.10a
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• pp.346-351
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• 1998

Cutting process has been automated due to progress of CNC and CAD/CAM, but polishing process has been only depended on experiential knowledge of expert. Polishing work for a curved surface die demands simple and repetitive operations but requires much time for its high precision. Therefore it is operated in the handiwork by skilled worker. However the workers intend to avoid gradually polishing work because of the poor environments such as dust and noise. In order to reduce the polishing time and solve the problem of shortage of skilled workers, it has been done some research for an automation of polishing. To automate the polishing process, a 2 axes polishing robot which is attached to a 3 axes machining center has been developed by our previous research. This automatic polishing robot is able to keep the polishing tool normal on the curved surface of die. Therefore its performance of polishing is improved because of always keeping the tool normal on the surface. In this paper, the smaller sized polishing robot is developed to improve polishing performance. And the controller for 2 axes polishing robot is developed. The controller is composed of TMS320C31 with high speed which is 40-ns instruction cycle time, RAM memory with 64K words, digital input with 64 bits, digital output with 32 bits, and D/A converter with 4 channels, which is 12 bits resolution. To evaluate polishing performance of this developed robot, polishing experiment for shadow mask was carried out.

• Design & Manufacturing
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• v.11 no.2
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• pp.51-56
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• 2017

Nitinol, a shape memory alloy (SMA), is manufactured from titanium and nickel and it used in various fields such as electrical applications, micro sensors. It is also recommended as a material in medical for implant because it has excellent organic compatibility. Nitinol is intended to be inserted into the human body, products require a high-quality surface and low residual stress. To overcome this problems, explore electrolyte polishing (EP) is being explored that may be appropriate for use with nitinol. EP is a particularly useful machining method because, as a non contact machining method, it produces neither machining heat nor internal stress in the machined materials. Sandpaper polishing is also useful machining method because, as a contact machining method, it can easily good surface roughness in the machined materials. The electrolyte polishing (EP) process has an effect of improving the surface roughness as well as the film polishing process, but has a characteristic that the residual stress is hardly generated because the work hardened layer is not formed on the processed surface. The sandpaper polishing process has the effect of improving the surface roughness but the residual stress remains in the surface. We experimented with three conditions of polishing process. First condition is the conventional polishing. Second condition is the electrochemical polishing(EP). And Last condition is a mixing process with the conventional polishing and the EP. Surface roughness and residual stress of the nitinol before a polishing process were $0.474{\mu}mRa$, -45.38MPa. Surface roughness and residual stress of the nitinol after mixing process of the conventional polishing and the EP were $1.071{\mu}mRa$, -143.157MPa. Surface roughness and residual stress of the nitinol after conventional polishing were $0.385{\mu}mRa$ and -205.15MPa. Surface roughness and residual stress of sandpaper and EP nitinol were $1.071{\mu}mRa$, -143.157MPa. The result shows that the EP process is a residual stress free process that eliminates the residual stress on the surface while eliminating the deformed layer remaining on the surface through composite surface machining rather than single surface machining. The EP process can be used for biomaterials such as nitinol and be applied to polishing of wafers and various fields.