• 제목/요약/키워드: Polisher

검색결과 57건 처리시간 0.024초

중.소형 연미기의 성능평가 및 성능개선에 관한 연구(I)-소형 연미기에 대하여- (Performance Evaluation and Improvement of Medium and Small Scale Rice Polishers(I)-small scale rice polishers-)

  • 정종훈;최영수;권홍관
    • 한국농업기계학회:학술대회논문집
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    • 한국농업기계학회 1998년도 하계 학술대회 논문집
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    • pp.206-216
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    • 1998
  • The structural characteristics of small scale rice polisher was analyzed to improve its performance. Spraying characteristic of nozzles used for rice polishing was also analyzed by a machine vision system. The internal pressure of the polishing chamber was measured according to outlet resistance, water spraying , and roller shaft speed. In addition , the performance of the rice polisher was evaluated to improve it in the basis of internal pressure in polishing chamber, whiteness , and broken rice ratio of clean rice according to the operating conditions. Actual nozzle discharge rate and drop size were 125cc/min and 86.97㎛, respectively. In the case of water spraying on rices, the internal pressure showed 4.9-9.8N/㎠ increase, broken rice ration decreased , and there was no difference in whiteness . The internal pressure increased up to two time with the increase of the outlet resistance. Also, the pressure at the upper part of screen was one and half times as high as the pressure at the lower part. In the case of water spraying rate of 150 cc/min, the roller shaft speed of 850 rpm resulted in no difference in whiteness and decrease of 0.3%in broken rice ratio, comparing to the roller shaft speed of 950 rpm.

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질화물 반도체의 미세구조 분석을 위한 최적의 TEM 시편 준비법 (Optimization of TEM Sample Preparation for the Microstructural Analysis of Nitride Semiconductors)

  • 조형균;김동찬
    • 한국재료학회지
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    • 제13권9호
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    • pp.598-605
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    • 2003
  • The optimized conditions for the cross-sectional TEM sample preparation using tripod polisher and ion-beam miller was confirmed by AFM and TEM. For the TEM observation of interfaces including InGaN layers like InGaN/GaN MQW structures, the sample preparation by the only tripod polishing was useful due to the reduction of artifacts. On the other hand, in case of the thick nitride films like ELO, PE, and superlattice, both tripod polishing and controlled ion-beam milling were required to improve the reproducibility. As a result, the ion-beam milling with the $60^{\circ}$modulation showed the minimum height difference between film and sapphire interface and the ion-beam milling of the $80^{\circ}$modulation showed the broad observable width.

임도정공정 미곡 도정실태 ("Milling Recovery of Rice at Local Milling Plants")

  • 김용환;서상용;김성태;나우정;민영봉
    • Journal of Biosystems Engineering
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    • 제4권2호
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    • pp.1-8
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    • 1979
  • This study was carried out to investigated the actual state of rice milling at local milling plants and to find out sources for elevating their milling recoveries in both quantity and quality. At 36 local milling plants located in Gyeongnam and Jeonnam , milling recoveries and head rice recoveries were measured with respect to their different milling systems and rice varieties. Then, the same samples of rice were milled by experimental milling equipments at laboratory, and the two experimental results were compared in order to determine the amount of milling recovery possibly to be increased. The results of this study are as follows ; 1. Milling recoveries of rice at local milling plants were proved to have no relationship with milling systems, and were 68.1% per ent and 72.6percent on an average with new variety and native variety, respectively. 2. The milling recoveries above stated can be elevated 4.5 percent and 2.9percent with new variety and native variety, respectively, by developing and extending technologies of manufacturing and handling rice milling machinery. 3. The head rice recovery of new variety at local milling plants has insignificant differences among milling systems, and was 54.8 percent on the average. With native variety, the recovery by friction type rice polisher was 0.9percent higher than that of friction-abrasive type polisher, and was 64.9 percent on the average. 4. The head rice recoveries of new variety and native can be elevated 5.1percent and 3.9percent, respectively, by the same stimulation above mentioned.

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전방향 자기추진 바닥닦기 로봇의 운동해석 (Motion Analysis of Omni-directional Self-propulsive Polishing Robot)

  • 신동헌;김호중
    • 한국정밀공학회지
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    • 제16권5호통권98호
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    • pp.151-159
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    • 1999
  • A self-propulsive polishing robot is proposed as a method which automates a floor polisher. The proposed robot with two rotary brushes does not require any mechanism such as wheels to obtain driving forces. When the robot polishes a floor with its two brushes rotating, friction forces occur between the two brushes and the floor. These friction forces are used to move the robot. Thus, the robot can move in any direction by controlling the two rotary brushes properly. In this paper, firstly a dynamics model of a brush is presented. It computes the friction force between the brush and the floor. Secondly, the dynamics of the proposed robot is presented by using the bush dynamics. Finally, the inverse dynamics is solved for the basic motions, such as the forward, backward, leftward, rightward motions and the pure rotaion. This paper will contribute to realize a self-propulsive polishing robot as proposed above, In addition, this paper will give basic ideas to automate the concrete floor finishing trowel, because its basic idea for motion is similar to that of the proposed robot.

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금합금 연마재 종류에 따른 금합금 소실량과 연마 정도 (THE AMOUT OF LOSS AND THE DEGREE OF SURFACE SMOOTHNESS OF GOLD ALLOY BY GOLD ALLOY POLISHING RUBBER POINT MATERIALS)

  • 김명화;임순호;정문규
    • 대한치과보철학회지
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    • 제35권2호
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    • pp.277-295
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    • 1997
  • After clinical adjustment of dental casting restoration, re-polishing procedure is recommanded because the smooth gold sureface is lost. But there is the possibility to get more loose contact than that intended by loss of gold alloy according to the kinds of polishing materials and polishing time. Therefore in this study I polished type II gold alloy with 390gm force, 20,000rpm speed, and 8 kinds of gold alloy polishing materials, fabricated by 4 companies and then measured the amount of loss of gold alloy with Surfcorder SEF-30D and observed alloy surfaces polished by 3 brown rubber points with SEM. The amount of loss of gold alloys polished with 8 kinds of polishing materials and the degree of smoothness of gold alloys according to polishing time and polishing materials were compared. The following results were obtained : 1. When the amount of loss of gold alloys polished with 3 kinds of brown rubber point was compared, Alphalex brown point had the most amount of alloy loss, followed in decreasing order by Shofu brown point and Eveflex brown point. There was statistically significant difference in the amount of alloy loss according to polishing materials. 2. When the amount of loss of gold alloys polished with 5 kinds of green rubber point was compared, Shofu green point had the most amount of alloy loss, followed in decreasing order by Alphaflex green point, Dedeco green clasp polisher, and Eveflex green point. There was statistically significant difference in the amount of alloy loss according to polishing materials except Alphaflex green point and Dedeco green clasp polisher. 3. When the amount of loss of gold alloys polished with all kinds of rubber point was compared, there was no significant difference in Eveflex brown point, Alphaflex green point, and Dedeco green clasp polisher. 4. When average amount of alloy loss per 1 revolution by polishing materials was compared, Alphalex brown point had the greatest value as $0.329{\mu}m$ and Shofu supergreen point had the lowest value as $0.022{\mu}m$. 5. When the degree of sureface smoothness of gold alloy polished with 3 kinds of brown rubber point was compared, In Alphalex brown point surface roughness was completely lost after 20 seconds polishing time, in Shofu brown point 30 seconds, in Eveflex brown point 40 seconds. But in every gold alloys fine scratch formed by rubber points was observed. Based on the results of this study, as rubber polishing materials used in polishing of dental casting restoration after clinical adjustment influenced on the tightness of occlusal or proximal contact, we should make dental casting restoration with minimum error through careful laboratory procedure and form very smooth surface of restoration with tripoli and rouge after use of silicone polishing materials.

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Effects of different primers on indirect orthodontic bonding: Shear bond strength, color change, and enamel roughness

  • Tavares, Mirella Lemos Queiroz;Elias, Carlos Nelson;Nojima, Lincoln Issamu
    • 대한치과교정학회지
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    • 제48권4호
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    • pp.245-252
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    • 2018
  • Objective: We aimed to perform in-vitro evaluation to compare 1) shear bond strength (SBS), adhesive remnant index (ARI), and color change between self-etched and acid-etched primers; 2) the SBS, ARI and color change between direct and indirect bonding; and 3) the enamel roughness (ER) between 12-blade bur and aluminum oxide polisher debonding methods. Methods: Seventy bovine incisors were distributed in seven groups: control (no bonding), direct (DTBX), and 5 indirect bonding (ITBX, IZ350, ISONDHI, ISEP, and ITBXp). Transbond XT Primer was used in the DTBX, ITBX, and ITBXp groups, flow resin Z350 in the IZ350 group, Sondhi in the ISONDHI group, and SEP primer in the ISEP group. SBS, ARI, and ER were evaluated. The adhesive remnant was removed using a low-speed tungsten bur in all groups except the ITBXp, in which an aluminum oxide polisher was used. After coffee staining, color evaluations were performed using a spectrophotometer immediately after staining and prior to bonding. Results: ISONDHI and ISEP showed significantly lower SBS (p < 0.01). DTBX had a greater number of teeth with all the adhesive on the enamel (70%), compared with the indirect bonding groups (0-30%). The ER in the ITBX and ITBXp groups was found to be greater because of both clean-up techniques used. Conclusions: Direct and indirect bonding have similar results and all the primers used show satisfactory adhesion strength. Use of burs and polishers increases the ER, but polishers ensure greater integrity of the initial roughness. Resin tags do not change the color of the teeth.

Tripod Polishing을 이용한 불균질 재료의 TEM 시편준비 방법과 미세조직 관찰 (TEM Sample Preparation of Heterogeneous Materials by Tripod Polishing and Their Microstructures)

  • 김연욱;조명주
    • Applied Microscopy
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    • 제34권2호
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    • pp.95-102
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    • 2004
  • 본 실험에서는 tripod polishing 방법을 이용하여 Pd/GaN/Sapphire 박막, PZT/MgO/Si 박막, 304 stainless steel 분말, $Mo_5Si_3/Mo_2B$ diffusion couple의 매우 다양한 물성이 포함된 불균질 재료의 TEM 시편을 제작하고 분석하였다. Tripod polishing을 사용하여 시편을 준비하면 시편의 종류에 관계없이 시편의 선단부에 매우 광범위한 전자빔 투과 영역을 지닌 TEM 시편을 얻을 수 있었으며, Pd/GaN/Sapphire 박막, PZT/MgO/Si 박막과 같이 기판이 경한 반도체 재료의 경우에는 연마 정도가 균일하며 연마과정 동안 오염이 심하지 않기 때문에 ion milling으로 cleaning 없이 TEM 관찰이 가능하다. 한편 304 stainless steel 분말과 같은 금속재료의 경우 짧은 시간의 ion milling 은 시편의 오염 제거에 도움된다. $Mo_5Si_3/Mo_2B$ diffusion couple에 형성된 실리사이드는 큰 취성 때문에 polishing 동안 시편이 깨지는 현상으로 전자가 투과할 수 있을 정도의 연마가 불가능하여 1시간 정도 ion milling 연마가 필요하다. Tripod polishing으로 TEM 시편을 준비하면 분석하고자 하는 지역을 정확하고도 넓게 연마할 수 있다. 또한 비교적 짧은 시간 내에 ion milling 없이 TEM 시편을 제작할 수 있기 때문에 ion milling에서 유발되는 여러 가지 문제점들을 해결할 수 있는 장점이 있었다. 그러나 tripod polishing은 전부 수작업으로 시편을 준비하기 때문에 시편을 제작하는 과정 동안 매우 세심한 주의가 요구되며 제작자의 숙련도와 경험을 필요로 하는 단점이 있다.

Tripod polishing을 이용한 IBAD/RABiTS 기판의 TEM 분석 (TEM analysis of IBAD/RABiTS substrates prepared by Tripod polishing)

  • 최순미;정준기;유상임;박찬;오상수;김철진
    • 한국초전도ㆍ저온공학회논문지
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    • 제8권1호
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    • pp.9-14
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    • 2006
  • Sample preparation plays a critical role in microstructure analysis using TEM. Although TEM specimen has been usually prepared by jet-polishing or Ar-ion beam milling technique. these methods could not be applied to YBCO CC which is composed of IBAD or RABiTS substrates, several buffet layers, and YBCO superconducting layer because of big difference in mechanical strengths between the metallic phase and oxide phases. To obtain useful cross-sectional information such as interface between the phases or second phases in YBCO CC, it is prerequisite to secure the large area of thin section in the cross-sectional direction. The superconducting layer or the buffer layers are relatively weak and fragile compared to the metallic substrate such as Ni-5wt%W RABiTS of Hastelloy-based IBAD, and preferential removal of weak ceramic phases during polishing steps makes specimen preparation almost impossible. Tripod polisher and small jig were home-made and employed to sample preparation. The polishing angle was maintained <$1^{\circ}$ throughout the polishing steps using 2 micrometers attached to the tripod plate. TEM specimens with large and thin area could be secured and used for RABiTS/IBAD substrate analyses. In some cases, additional Ar-beam ion milling with low beam current and impinging angle was used for less than 30 sec. to remove debris or polishing media attacked to the specimens.