• 한국전기전자재료학회논문지
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• 제24권4호
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• pp.328-332
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• 2011

The formation of front metal contact silicon solar cells is required for low cost, low contact resistance to silicon surface. One of the front metal contacts is Ni/Cu plating that it is available to simply and inexpensive production to apply mass production. Ni is shown to be a suitable barrier to Cu diffusion into the silicon. The process of Ni electroless plating on front silicon surface is performed using a chemical bath. Additives and buffer agents such as ammonium chloride is added to maintain the stability and pH control of the bath. Ni deposition rate is found to vary with temperature, time, utilization of bath. The experimental result shown that Ni layer by SEM (scanning electron microscopy) and EDX analysis. Finally, plated Ni/Cu contact solar cell result in an efficiency of 17.69% on $2{\times}2\;cm^2$, Cz wafer.

• 한국표면공학회지
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• 제19권3호
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• pp.92-108
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• 1986

An electroplating on the lead frame fabricated from domestic copper plate was studied experimentally. In this study, nickel was plated on the thin copper lead frame and silver layer was coated on the nickel film in the cyanide electrolyte. The effect of process variables such as current density, plating time, coating thickness and flow rate of electrolytic solution on the properties of coating was investigated. Some samples on each step were fabricated during electroplating. The results obtained from polarization measurement, observation of SEM photograph, adhesion test of coating and microhardness test are as follows. On silver plating, polarization resistance of potentiostatic cathodic polarization curve is reduced as the flow rate of Ag electrolytic solution increases. And above resistance is also reduced when the minor chemicals of sodium cyanide and sodium carbonate are added in potassium silver cyanide bath. The reduced polarization resistance makes silver deposition on the cathode easy. An increase in the current density and the coating thickness causes the particle size of deposit to coarsen, and consequently the Knoop microhardness of the coating decreases. On selective plating an increase in the flow rate of plating solution lead to do high speed plating with high current density. In this case, the surface morphology of deposit is of fine microstructure with high Knoop hardness. An increasing trend of the adhesion of coating was shown with increasing the current density and flow rate of electrolytic solution.

• 한국의류학회지
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• 제32권2호
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• pp.319-327
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• 2008

The purpose of this study is to propose the development of high quality electromagnetic wave shielding fabrics. Silver nitrate is used for polyester fabric as an electromagnetic wave shielding material. The effects of activators and electroless silver plating condition on the evenness and adhesion of silver to fabrics, are observed through the SEM micrographs. Surface morphology and wash-ability are measured using SEM. The results are as follows: The optimum weight loss by alkaline hydrolysis of polyester fabrics is about 20%. The optimum concentration of $SnCl_2$ and $PdCl_2$in catalyst reaction using $PdCl_2$ as an activator is 2.5g/L and 0.5g/L, respectively. The optimum concentration of dextrose to improve adhesion between the silver plating and fabrics is 45g/L. The optimum concentration of silver nitrate in the catalyst reaction, using $PdCl_2$ as an activator is 56g/L, respectively. The optimum plating temperature and time are $15^{\circ}C$ and 30minutes, respectively.

• 한국표면공학회지
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• 제43권2호
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• pp.64-72
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• 2010

CuSnZn electroplating was investigated as alternative to Ni plating. Evaluation of electrolyte and plating process was performed to control physical characteristics of the film, and to collect practical data for application. Hull-cell test was conducted for basic comparison of two commercialized products and developed product. Based on hull-cell test results, long term test of three electrolytes was performed. Various analysis on long term tested electrolyte and samples have been done. Reliable and practical data was collected using FE-SEM (FEI, Sirion), EDX (ThermoNoran SIX-200E), ICP Spectrometer (GBC Scientifi c, Integra XL), FIB (FEI, Nova600) for anlysis. Physical analysis and reliability test of the long term tested film were also carried out. Through this investigation plating time, plating speed, electrolyte composition, electrolyte metal consumption, hardness and corrosion resistance has been compared. This set of data is used to predict and control the chemical composition of the film and modify the physical characteristics of the CuSnZn alloy.

• 한국환경과학회지
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• 제30권1호
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• pp.69-76
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• 2021

The purposes of this study were to evaluate the removal characteristics of COD, Ni, and P and to derive appropriate operating conditions for the plating wastewater according to NaOCl reaction time and pH operating conditions in the BPC unit process during the plating wastewater treatment process. As a results of evaluating the removal characteristics for raw wastewater by each BPC unit process, the removal efficiencies of COD, Ni and P in BPC 1-1 unit process were 72.8%, 99.1%, and 100.0%. Therefore, the proper reaction time of NaOCl was derived as 21.1 minutes. In order to maintain the +800 mV ORP and the reaction time of 20 minutes, the temporary injection and continuous injection of NaOCl in the BPC unit process were 13.7 mL and 18.7 mL, respectively. It was found that the temporary injection method of NaOCl reduced the chemical cost by 36.5% compared to the continuous injection method. Also, Ni showed the highest removal efficiency of 97.8% at pH 10.5. On the other hand, P showed a removal efficiency of 57.4% at pH 10.0.

• Journal of Korean Neurosurgical Society
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• 제49권4호
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• pp.212-216
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• 2011

Objective : It is well known that plate-to-disc distance (POD) is closely related to adjacent-level ossification following anterior cervical plate placement. The study was undertaken to compare the outcomes of two different anterior cervical plating methods for degenerative cervical condition. Specifically, the new method involves making holes for plate screws first with an air drill and then choosing a plate size. The other method was standard, that is, decide on the plate size first, locate the plate on the anterior vertebral body, and then drilling the screw holes. Our hypothesis was that the new technical tip may increase POD as compared with the standard anterior cervical plating procedure. Methods : We retrospectively reviewed 49 patients who had a solid fusion after anterior cervical arthrodesis with a plate for the treatment of cervical disc degeneration. Twenty-three patients underwent the new anterior cervical plating technique (Group A) and 26 patients underwent the standard technique (Group B). POD and ratios between POD to anterior body heights (ABH) were measured using postoperative lateral radiographs. In addition, operating times and clinical results were reviewed in all cases. Results : The mean durations of follow-up were $16.42{\pm}5.99$ (Group A) and $19.83{\pm}6.71$ (Group B) months, range 12 to 35 months. Of these parameters mentioned above, cephalad POD (5.43 versus 3.46 mm, p=0.005) and cephalad POD/ABH (0.36 versus 0.23, p=0.004) were significantly greater in the Group A, whereas operation time for two segment arthrodesis (141.9 versus 170.6 minutes, p=0.047) was significantly lower in the Group A. There were no significant difference between the two groups in caudal POD (5.92 versus 5.06 mm), caudal POO/ABH (0.37 versus 0.32) and clinical results. Conclusion : The new anterior cervical plating method represents an improvement over the standard method in terms of cephalad plate-to-disc distance and operating time.

• Progress in Superconductivity
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• 제6권2호
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• pp.133-137
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• 2005

We fabricated the Au/Ni template for YBCO coated conductors and evaluated texture formation and the microstructural evolution. The cube textured Ni substrate was fabricated by rolling and recrystallization annealing, and subsequently Au layer formed on the substrate by electroless-plating method. The texture was evaluated by pole-figure with x-ray goniometer with orientation distribution function (ODF) analysis. The surface roughness and grain boundary morphology of template were characterized by atomic force microscopy (AFM) We observed that Au layer deposited epitaxially on Ni substrate and formed a strong cube texture when plating time was optimized. The full-width at half-maximum (FWHM) was $8.4^{\circ}$ for out-of-plane and $9.98^{\circ}$ for in-plane texture for plating time of 30 min. Microstructural observation showed that the Au layer was homogeneous and dense without formation of crack/microcrack. In addition, we observed that root-mean-square (RMS) and depth of grain boundary were 14.6 nm and 160 $\AA$ for the Au layer, respectively, while those were 27.0 nm and 800 $\AA$ for the Ni substrate, indicating that the electoless-plated Au layer had relatively smooth surface and effectively mollified grain groove.

• 한국표면공학회지
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• 제46권1호
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• pp.9-15
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• 2013

The effect of the additionally applied electrical current on the adhesion strength between electroless Cu and polyimide films was investigated. Peel tests were performed after applying electrical current within the range from 0.1 to 100 mA for the duration from 1 to 30 minutes. Sample with more than 1 mA of additional electrical current for 1 minute showed higher adhesion strength than that without additional electrical current. However, samples with 10 mA of additional electrical current for more than 10 miniutes showed the degradation of adhesion strength. Ra and RMS values of the peeled polyimide surface were proportional to the adhesion strength though there were no significant changes in the morphology of the peeled surfaces with varied amount and time-length of additional electrical current. Applying electrical current could increase the density of chemical bonding, which results in increase of the adhesion strength between copper and polyimide. However, in the case of applying additional electrical current for excessive amount or time, the degradation of the adhesion strength owing to the formation of copper oxide at the interface could occur.

• 대한금속재료학회지
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• 제49권5호
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• pp.411-418
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• 2011

The current study investigates the electroplating characteristics of Sn-Cu eutectic micro-bumps electroplated on a Si chip for flip chip application. Under bump metallization (UBM) layers consisting of Cr, Cu, Ni and Au sequentially from bottom to top with the aim of achieving Sn-Cu bumps $10\times10\times6$ ${\mu}m$ in size, with 20${\mu}m$ pitch. In order to determine optimal plating parameters, the polarization curve, current density and plating time were analyzed. Experimental results showed the equilibrium potential from the Sn-Cu polarization curve is -0.465 V, which is attained when Sn-Cu electro-deposition occurred. The thickness of the electroplated bumps increased with rising current density and plating time up to 20 mA/$cm^2$ and 30 min respectively. The near eutectic composition of the Sn-0.72wt%Cu bump was obtained by plating at 10 mA/$cm^2$ for 20 min, and the bump size at these conditions was $10\times10\times6$ ${\mu}m$. The shear strength of the eutectic Sn-Cu bump was 9.0 gf when the shearing tip height was 50% of the bump height.

• 폴리머
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• 제34권1호
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• pp.25-31
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• 2010

무전해 니켈 도금법을 사용하여 단분산 폴리스티렌 입자 표면에 니켈이 도금된 고분자 코어/금속 쉘의 복합 입자를 제조하였다. 단분산 입자는 분산중합으로 제조하였는데 사용한 분산매질의 종류에 따라 다양한 크기의 단분산 폴리스티렌 입자를 제조할 수 있었다. 그 중 직경 $3.4\;{\mu}m$ 크기의 단분산 폴리스티렌 입자를 선택하여 무전해 니켈 도금을 시도하였다. 니켈 도금에 영향을 미치는 도금 조건을 파악하기 위하여 활성화제인 $PdCl_2$의 농도, 착화제인 glycine의 농도와 니켈 도금액의 투여 시간에 따른 니켈 도금된 폴리스티렌 복합 입자의 모폴로지를 관찰하였다. 본 연구조건하에서는 $PdCl_2$의 농도 0.4 g/L, glycine 농도 1 M 이상인 경우 폴리스티렌 입자 위에 균일한 두께의 니켈층을 형성하였고 석출되는 니켈도 적었다. 도금 시간 2 시간 중에서 동일양의 도금액을 투여 속도를 달리하며 도금한 경우 모폴로지 상의 뚜렷한 차이는 없었으나 0.15 mL/min 속도로 1시간 동안 투여한 경우가 상대적으로 균일한 도금 특성을 보여 주었다.