• 한국산학기술학회논문지
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• 제12권9호
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• pp.4015-4021
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• 2011

시아나이드 화합물과 같은 환경에 유해한 도금첨가제를 사용하지 않는 친환경적인 무전해 구리도금용 도금용액조성을 개발하기 위하여, potassium ferrocyanide, aminoacetic acid (=glycine), 2,2'-dipyridyl과 같은 첨가제를 이용하여 첨가제의 투입량 또는 조성비가 도금특성에 미치는 영향을 조사하였다. 무전해도금으로 적층된 구리도금층의 도금속도는 potassium ferrocyanide와 aminoacetic acid의 조성비가 20 mg/L과 0.01 mol/L 이었을 때, $9.5mg{\cdot}cm^{-2}{\cdot}hr^{-1}$으로 나타났으며, 도금경도의 변화도 도금속도와 연동하여 비례적으로 변화하였다. 하지만 potassium ferrocyanide를 첨가하지 않은 도금용액의 조성에서도 $9.1mmg{\cdot}cm^{-2}{\cdot}hr^{-1}$의 도금속도를 나타내었다.

• 한국의류학회지
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• 제29권1호
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• pp.149-156
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• 2005

The purpose of this study was to produce the high quality of electromagnetic wave shielding fabrics. In this study, we have produced polyester fabrics by electroless Ag plating. The untreated polyester was etched with $4\%$ NaOH solution added accelerant(Benzyl Dimethyl Dodecyl Ammonium Chloride) then it was catalyzed by $SnCl_2$ solution and activated by $PdCl_2$ solution. Electroless Ag plating was carried out by changing conditions such as temperature. time, weight loss rate of polyester and kind of reducing agents. The electromagnetic wave shielding effectiveness of polyester fabric by electroless Ag plating was measured by RF Impedance Analyzer and element of electromagnetic wave shielding substance was measured using Electron probe micro analyzer. The results were as follows; The plating bath using potassium sodium tartrate by reducing agent was excellent electromagnetic wave shielding effectiveness. Element of electromagnetic wave shielding substance was silver. Electromagnetic wave shielding effectiveness was shown over 64dB at the temperature of $40^{\circ}C$, treating time 30min., weight loss rate $20\%$.

• Transactions on Electrical and Electronic Materials
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• 제8권6호
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• pp.246-249
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• 2007

A triple-band antenna was developed and fabricated by LDS(Laser Direct Structuring) process. The effects of the plating rate and heat treatment condition were investigated and the gains of fabricated antennas were measured at various frequencies. The laser irradiated surface shows clearly that there are prominence and depression. It shows anchoring effect between a plating material and ablation surface. The plating rate was decreased when the plating material is exhausted in the solution. This solution needs to refreshed by the new aid solution. The copper plating thickness is decreased with the increase of heat treatment temperature in the same time but it does not change other condition. The gain of LDS antenna showed higher than the generally processed antenna. This result was related with practical use of the dimension and effective dielectric constant.

• 한국표면공학회지
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• 제29권2호
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• pp.140-145
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• 1996

Silver deposits formed on copper substrates by replacement reactions show poor adhesion, and a silver film plated on such a deposit does not adhere. Silver ion makes a highly stable complex with cyanide ion, so that in a silver cyanide solution, the activity of silver ion is very small. This is one of the reasons for the universal use of cyanide baths in the industrial silver plating. However, the consideration of the difference between the values of the stability constants for bath the silver-iodide complex and the copper-iodide complex suggest that the rate of replacement deposition of silver on the copper substrate in si]ver-potassium iodide solution, could be comparatively low. To confirm this, the rate of replacement deposition of silver in both a silver-potassium iodide solution ($AgNO_3$0.10 mol/L, KI 2.00 mol/L ) and a strike silver plating bath (AgCN 0.028 mol/L, KCN 1.15 mol/L ) was estimated from the current density corresponding to the point of intersection of the anodic and the cathodic polarization curves. These estimated values were almost the same, and it is suggested that the silver-potassium iodide solution is not only a cyanide free silver plating bath capable of employing a copper substrate but a silver plating bath which requires no strike plating.

• Corrosion Science and Technology
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• 제18권5호
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• pp.190-195
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• 2019

SA508 low-alloy steel for a reactor vessel was exposed to primary water in a pressurized water reactor (PWR) plant because the cladding layer of type 309 stainless steel for the RPV was removed, due to an accident in which the detachment of the thermal sleeve occurred. The major advantage of the electrochemical deposition (ECD) Ni plating technique is that the reactor pressure vessel can be repaired without significant thermal effects, and Ni has solid corrosion resistance that can withstand boric acid. The corrosion rate assessment of the damaged part was performed, and its trend was analyzed. Essential variables of the Ni plating for repair of the damaged part were derived. These conditions are applicable variables for the repair plating device, and have been carefully adjusted using the repair plating device. The process for establishing ASME technical standards called Code Case N-840 is described. The process of developing Ni-plating devices, and the electroplating procedure specification (EPS) are described.

• 공업화학
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• 제19권2호
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• pp.228-235
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• 2008

니켈 표면처리 공정에서 전류밀도에 따라 니켈의 전착두께가 증가되었으며, 증가폭은 $6{\sim}10A/dm^2$에서 저전류보다 높게 나타났다. 전류밀도를 측정하기 위해 Hull-cell 분석을 수행 하였다. 최적 공정온도는 $60^{\circ}C$, pH는 3.5~4.0이었고, 전해용액 중 니켈이온의 농도는 300 g/L 이상에서 농도에 따라 전착두께가 증가되었다. 전류밀도에 따라 용액 중 니켈이온 감소 속도가 증가되었는데, 이는 음극표면에서 니켈 전착 량에 따른 전착두께의 증가를 나타낸다. 그러나 전착속도가 빠를 경우 니켈 전착 층의 치밀성은 저하되며, 표면의 상태는 불규칙하게 변화된다. 니켈이온의 전착과정이 불규칙하게 일어나 조직의 pin hole 등을 야기해 표면특성을 저하시키는 것으로 확인되었다. 광택니켈 전착 후 25 h 내식을 유지한 결과, 낮은 전류밀도를 유지하는 것이 내식특성이 우수한 것으로 나타났다. 프로그램모사 결과, 전류밀도가 높아질수록 확산 층의 두께는 증가하며, 음극표면의 농도는 낮아진다. 농도분포는 낮은 전류밀도에서 고른 분포를 나타내었으며 이는 일정한 전착두께를 예측할 수 있다. 생산성 저하를 예방하기 위해 공정시간은 크게 변화시키지 않았으며, 전류밀도와 전착두께를 변화시키면서 공정변수를 조절하였다. 본 연구의 표면분석 결과 조직특성이나 내식성 등의 표면 물성이 낮은 전류밀도를 사용할 경우에 더욱 우수한 것으로 나타났다.

• Corrosion Science and Technology
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• 제13권3호
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• pp.107-111
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• 2014

Electroless plated Ni-Co-P films have been used to suppress the electromagnetic waves from magnetic recording media, and the suppression is known to be achieved with films made with optimized plating composition and plating condition. Effects of complexing agents on the deposition rate and bath stability of Ni-Co-P film were studied using sodium citrate, sodium tartrate and multi-complex agents containing both of them. Deposition of electroless Ni-Co-P platings was dependent upon the complexing agents. Deposition rate was twice when using sodium tartrate compared to that using sodium citrate. And it was slightly slower with multi-complex agents than with sodium tartrate, bath stability being declined in the former. Deposition rate increased with increasing pH until pH 11. Excellent bath stability and good deposition rate were obtained using multi-complex agent as sodium citrate 0.10 mol/L and sodium tartrate 0.15 mol/L in the electroless Ni-Co-P plating films.

• 한국표면공학회지
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• 제55권2호
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• pp.102-119
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• 2022

Gold plating is used as a coating of connecter in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. As increasing the demand for miniaturization of printed circuit boards and downsizing of electronic devices, several types of electroless gold plating solutions have been developed. Most of these conventional gold plating solutions contain cyanide compounds as a complexing agent. The gold film obtained from such baths usually satisfies the requirements for electronic parts mentioned above. However, cyanide bath is highly toxic and it always has some possibility to cause serious problems in working environment or other administrative aspects. The object of this investigation was to develop a cyanide-free electroless gold plating process that assures the high stability of the solution and gives the excellent solderability of the deposited film. The investigation reported herein is intended to establish plating bath composition and plating conditions for electroless gold plating, with thiomalic acid as a complexing agent. At the same time, we have investigated the solution stability against nickel ion and pull strength of solder ball. Furthermore, by examining the characteristics of the plated Au plating film, the problems of the newly developed electroless Au plating solution were improved and the applicability to various industrial fields was examined. New type electroless gold-plating bath which containing thiomalic acid as a complexing agent showing so good solution stability and film properties as cyanide bath. And this bath shows the excellent stability even if the dissolved nickel ion was added from under coated nickel film, which can be used at the neutral pH range.

• 마이크로전자및패키징학회지
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• 제18권4호
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• pp.43-48
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• 2011

탄소 기지상에 니켈도금을 하여 다공성 MCFC의 전극으로 사용하기 위하여 탄소 기지위에 산성용액과 염기성용액을 이용하여 무전해 니켈도금을 하였다. 알칼리 용액에서의 도금속도가 산성용액에서의 도금속도보다 빨랐으며 두가지 용액에서 pH가 증가함에 따라 도금속도가 증가하였다. 산성용액에서의 잔류응력은 압축응력을 보였으며 알칼리용액에서는 높은 인장응력을 보였으며 높은 잔류응력으로 인하여 pH 11 이상에서는 표면균열이 발생하였다. Thiourea를 첨가하였을 경우 0.5 ppm까지의 저농도에서 도금속도가 증가하다가 이후 감소하였으며 1.5 ppm 이상에서 두가지 용액에서 모두 도금이 더 이상 진행되지 않았다. Succine 산을 첨가한 경우 5 g/L까지 속도가 증가하다가 감소하여 일정한 값을 유지하였다.

• 마이크로전자및패키징학회지
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• 제24권3호
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• pp.57-62
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• 2017

하이드로퀴논 환원제를 사용하는 무전해 은도금 방법으로 은(Ag)코팅 구리(Cu) 플레이크를 제조하는 공정에서 전처리 용액, 반응온도, pH, Ag 도금액 조성 및 주입속도, 펄프농도 등 여러 변수를 변화시켜가며 우수한 품질의 Ag 코팅이 형성되는 공정조건들을 확보하였다. Cu 플레이크 표면의 산화층을 제거하기 위한 효과적인 전처리 용액이 제시되었고, 낮은 반응온도, 4.34 수준의 pH값, 느린 Ag 도금액 주입속도, Ag 도금액에서 증류수 제거, 높은 펄프농도 조건에서 분리형 미세 Ag 입자들의 생성이 억제되고, Cu 표면 커버리지가 우수한 Ag 코팅층이 형성됨을 확인할 수 있었다.