• Title/Summary/Keyword: Plating rate

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Wear Behaviors of Ceramics TIN, TIC and TICN with Arc Ion Plating

  • Oh, Seong-Mo;Rhee, Bong-Goo;Jeong, Bong-Soo
    • Journal of Mechanical Science and Technology
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    • v.17 no.12
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    • pp.1904-1911
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    • 2003
  • In order to determine the wear properties of AIP (Arc Ion Plating) deposition, wear process was evaluated by using a Falex test machine. Also, in order to determine the effects of coating material on the wear process, TiC, TiN, and TiCN coatings of thickness about 5 $\mu\textrm{m}$∼6 $\mu\textrm{m}$ coated by Arc ion plating deposition method were tested. The wear property was determined under a dry sliding condition as a function of the applied load, sliding distance, sliding velocity and temperature. The results show that when wear of the coating-layer occurred, specific wear amount increased with the wear rate. At initial state, the wear rate rapidly increased, but it gradually reduced as the velocity increased. Also, when raising the temperature, the wear rate increased in the order of TiCN, TiN and TiC due to the frictional heat.

Electroless Ni Plating of Monodisperse Polymer Particles (단분산 가교 고분자 미립자의 무전해 니켈도금 연구)

  • Kim, Dong-Ok;Shon, Won-Il;Jin, Jeong-Hee;Oh, Seok-Heon
    • Polymer(Korea)
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    • v.31 no.3
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    • pp.184-188
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    • 2007
  • Monodisperse PMMA/HDDA polymer particles were coated via electroless Ni plating using sodium hypophosphite as a reducing agent in an acidic environment. In this study, the effects of 1) the pretreatment conditions, 2) the plating temperature, 3) the plating pH, and 4) the initial pH, control of plating bath on the variation of plating rate, surface state of plated particles and plating reproducibility were investigated. It was observed that every pretreatment steps, especially conditioning and acceleration step, were very important for obtaining uniform Ni plating and the plating rate was increased with the increase of plating temperature and pH. Moreover, the initial pH control of plating bath was critical for the plating reproducibility.

A Study on Reusing of Electroless Co-Cu-P Waste Solution (무전해 Co-Cu-P 폐 도금액의 재사용에 관한 연구)

  • Bai Young-Han;Oh Lee-Sik
    • Resources Recycling
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    • v.14 no.4 s.66
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    • pp.34-40
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    • 2005
  • Reusing of electroless Co-Cu-P waste solution was investigated in the respect of plating time, plating rate, solution composition and deposit. Plating time of cobalt-catalytic surface took longer than that of zincated-catalytic surface. It was possible to reuse the waste solution by mixing $50\%$ fresh solution at batch type. Plating time of initial solution at continuous type took longer 7.5 times over than that of batch type. Plating time of $50\%$ waste solution additive at continuous type took longer 2.5 times over than that of batch type. Component change of cobalt-topper for electroless deposition was greatly affected by deposit inferiority and rapid decrease in plating rate.

Electroplating on the Lead Frames Fabricated from Domestic Copper Plate (국산동판을 사용한 리드프레임 도금기술에 관한 연구)

  • Jang, Hyeon-Gu;Lee, Dae-Seung
    • Journal of Surface Science and Engineering
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    • v.19 no.3
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    • pp.92-108
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    • 1986
  • An electroplating on the lead frame fabricated from domestic copper plate was studied experimentally. In this study, nickel was plated on the thin copper lead frame and silver layer was coated on the nickel film in the cyanide electrolyte. The effect of process variables such as current density, plating time, coating thickness and flow rate of electrolytic solution on the properties of coating was investigated. Some samples on each step were fabricated during electroplating. The results obtained from polarization measurement, observation of SEM photograph, adhesion test of coating and microhardness test are as follows. On silver plating, polarization resistance of potentiostatic cathodic polarization curve is reduced as the flow rate of Ag electrolytic solution increases. And above resistance is also reduced when the minor chemicals of sodium cyanide and sodium carbonate are added in potassium silver cyanide bath. The reduced polarization resistance makes silver deposition on the cathode easy. An increase in the current density and the coating thickness causes the particle size of deposit to coarsen, and consequently the Knoop microhardness of the coating decreases. On selective plating an increase in the flow rate of plating solution lead to do high speed plating with high current density. In this case, the surface morphology of deposit is of fine microstructure with high Knoop hardness. An increasing trend of the adhesion of coating was shown with increasing the current density and flow rate of electrolytic solution.

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Electroless Nickel Plating on Fibers for the Highly Porous Electrode

  • Cheon, So-Young;Park, So-Yeon;Rhym, Young-Mok;Kim, Doo-Hyun;Koo, Yeon-Soo;Lee, Jae-Ho
    • Journal of Electrochemical Science and Technology
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    • v.1 no.2
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    • pp.117-120
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    • 2010
  • Materials used as fuel cell electrode should be light, high conductive, high surface area for reaction, catalytic surface and uniformity of porous structure. Nickel is widely used in electrode materials because it itself has catalytic properties. When used as electrode materials, nickel of only a few im on the surface may be sufficient to conduct the catalytic role. To manufacture the nickel with porous structure, Electroless nickel plating on carbon fiber be conducted. Because electroless nickel plating is possible to do uniform coating on the surface of substrate with complex shape. Acidic bath and alkaline bathe were used in electroless nickel plating bath, and pH and temperature of bath were controlled. The rate of electroless plating in alkaline bath was faster than that in acidic bath. As increasing pH and temperature, the rate of electrolee plating was increased. The content of phosphorous in nickel deposit was higher in acidic bath than that in alkaline bath. As a result, the uniform nickel deposit on porous carbon fiber was conducted.

Factors Influencing Edge Dendritic Plating of Steel Sheet in the Electro-Galvanizing Line

  • Du-Hwan Jo;Moonjae Kwon;Doojin Paik;Myungsoo Kim
    • Corrosion Science and Technology
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    • v.23 no.3
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    • pp.215-220
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    • 2024
  • Recently, the demand for Zn-Ni electrogalvanized steel sheets for home appliances and automobiles is increasing. Products should have a thick plating (30 to 40 g/m2) on both side with a thin thickness (≤ 0.8 mm) and the highest surface quality. By a high current density operation, current is concentrated in the edge part of the steel sheet, resulting in large surface dent defects due to dendritic plating. This can lead to a low productivity due to low line speed operation. To solve this problem, this study aimed to identify factors influencing dendritic plating. A cylindrical electroplating device was manufactured. Effects of cut edge shape and thickness of steel plate, current density, temperature, flow rate, electrolyte concentration, and pH on dendrite generation of Zn-Ni electroplating were examined. To investigate effect of edge shape of the steel sheet, the steel sheet was manufactured using three processing methods: shearing, polishing after shearing, and laser. Relative effects thickness and cut edge processing methods of the steel plate, current density, temperature, flow rate, electrolyte concentration, and pH of plating solution on dendrite plating were investigated. To prevent dendrite plating, an edge mask was manufactured and its application effect was investigated.

Electroless Ni-P layer Characteristics in accordance with the plating process conditions (무전해 Ni-P 도금의 공정조건에 따른 도금피막 특성변화)

  • Lee Hong-Kee;Jeon Jun-Mi;Park Hae-Duck
    • Journal of Surface Science and Engineering
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    • v.36 no.3
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    • pp.263-271
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    • 2003
  • Optimal conditions of electroless nickel plating in acid baths has been studied for industrial applications of a developed EN solution. The phosphorus content in the deposition ranges from 8 to $12\;wt.\%$. The investigated EN plating parameters are ion concentrations of nickel and hypophosphite, concentration of reducing and complexing agent, temperature, and pH. The average plating rate of Ni-P deposition was ca. $14{\mu}m/h$. The EN solution used shows a deposition rate of $10{\mu}m/h$ up to seven metal turnovers.

Effect of Additives on Deposition Rate and Stability of Electroless Black Ni-Zn-P Plating (무전해 Ni-Zn-P 도금의 속도 및 안정성에 미치는 첨가제의 영향)

  • 오영주;황경진;정원용;이만승
    • Journal of Surface Science and Engineering
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    • v.36 no.4
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    • pp.317-323
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    • 2003
  • The effect of additives such as complexing agents, stabilzers and boric acid on the bath stability and the deposition rate of electroless black Ni-Zn plating has been examined. The deposits obtained became black and showed an amorphous structure. The significant increasing in the deposition rate was not found when only glycine and citric acid were used as complexing agents. The deposition rate increased up to 3 and 4 times by adding malic acid and glycolic acid as an additional complexing agent, respectively. The stabilizers and the boric acid, however, had little influence on the deposition rate.

Preparation of Composite Particles via Electroless Nickel Plating on Polystyrene Microspheres and Effect of Plating Conditions (무전해 니켈 도금된 폴리스티렌 복합 입자 제조 및 도금 조건의 영향)

  • Kim, Byung-Chul;Park, Jin-Hong;Lee, Seong-Jae
    • Polymer(Korea)
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    • v.34 no.1
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    • pp.25-31
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    • 2010
  • Polymer core and metal shell composite particles have been prepared by the electroless nickel plating on the surface of monodisperse polystyrene microspheres. Various sizes of polystyrene particles with highly monodisperse state could be synthesized by controlling the dispersion medium in dispersion polymerization. Electroless nickel plating was performed on the polystyrene particle with diameter of $3.4\;{\mu}m$. The morphology of polystyrene/nickel composite particles was investigated to see the effect of the plating conditions, such as the $PdCl_2$ and glycine concentrations and the dropping rate of nickel plating solution, on nickel deposition. With $PdCl_2$ and glycine concentrations at more than 0.4 g/L and 1 M, respectively, more uniform nickel layer and less precipitated nickel aggregates were formed. At the given plating time of 2 h, the same amount of plating solution was introduced by varying the dropping rate. Though the effect of dropping rate on particle morphology was not noticeable, the dropping rate of 0.15 mL/min for 60 min showed rather uniform plating.

Study on the deposition rate and vapor distribution of Al films prepared by vacuum evaporation and arc-induced ion plating (증착방법에 따른 Al 피막의 증착율 및 증기분포에 관한 연구)

  • 정재인;정우철;손영호;이득진;박성렬
    • Journal of the Korean Vacuum Society
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    • v.9 no.3
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    • pp.207-215
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    • 2000
  • Al films on cold-rolled steel sheet have been prepared by vacuum evaporation and arc-induced ion plating, respectively, and the evaporation rate and vapor distribution (thickness distribution over the substrate) have been investigated according to deposition conditions. The arc-induced ion plating (AIIP) method have been employed, which makes use of arc-like discharge current induced by ionization electrode located near the evaporation source. The AIIP takes advantage of high ionization rate compared with conventional ion plating, and can be carried out at low pressure of less than $10^{-4}$ torr. Very high evaporation rate of more than 2.0 mu\textrm{m}$/min could be achieved for Al evaporation using alumina liner by electron beam evaporation. The geometry factor n for the $cos^{n/\phi}$ vapor distribution, which affects the thickness distribution of films at the substrate turned out to be around 1 for vacuum evaporation, while it features around 2 or higher for ion plating. For the ion plated films, it has been found that the ionization condition and substrate bias are the main parameters to affect the thickness distribution of the films.

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