• 한국재료학회:학술대회논문집
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• 한국재료학회 1992년도 춘계학술발표회
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• pp.26-27
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• 1992

반도체 기억소자 contact hole의 선택적 충진의 최적 조건을 연구하기 위하여 무전해Ni도금방법을 채택하여 실리콘의 활성화와 선택적 도금의 공정조건이 Contact Hole 도금피막의 제반 특성에 미치는 영향을 조사하였다. p형 실리콘 100 소지 표면의 활성화 처리는 RCA처리에 의해 먼저 표면을 세척한 다음 온도, PdCl$_2$농도, 시간. 교반의 영향을 조사하였다 전처리의 최적조건은 7$0^{\circ}C$, 0.5M HF, ImM PdCl$_2$, 2mM EDTA, 90second이었다. 무전해도금은 NiS0$_4$.6$H_2O$를 DMAB를 환원제로 하여 온도, DMAB 농도, pH, 도금시간의 영향을 조사하였다. 무전해 도금 피막은 비교적 우수한 접촉저 항을 나타냈다. 1$\mu$m의 도금막을 얻는 데 본 실험조건에서 DMAB의 농도가 8mM일 때 30 분이 소요되었다. 도금막의 표면은 온도가 낮을수록 pH가 높을수록 평활하였고,특히 온도 6$0^{\circ}C$와 pH6.8에서 가장 우수하였다. 미세경도는 600Hv 정도였으며, 결정립의 크기 가 증가할수록 저항과 미세경도가 감소하였다.

• 한국재료학회지
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• 제24권11호
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• pp.617-624
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• 2014

To elucidate the effects of a pretreatment process on the uniformity of Ag electroless plating on Cu flakes, pretreatment time was mainly considered with a mixed solution of 0.15 M ammonium hydroxide and 0.0375 M ammonium sulphate. Optical inspection of Ag-coated Cu flakes determined that the optimal pretreatment time is 120 s. Repetition of the sequence in which Ag plating was done immediately after the pretreatment of 120 s clearly enhanced the plating uniformity. Scanning electron microscopy revealed that holes were formed irregularly on some Cu flakes during the period from the asdropping of an Ag precursor solution to 5 min. The hole formation was judged to be due to continuous removal of Cu on the local surfaces by the repetitive formation and elimination of $Cu_2O$ or $Cu(OH)_2$ layers. However, the increase of the amount of Ag coating suppressed the hole creation and increasingly enhanced the antioxidant property.

• 한국기계가공학회지
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• 제10권4호
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• pp.96-101
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• 2011

The thin films of TiN have been used extensively as wear-resistant materials, for instance, such as tools of high-speed cutting, metal mold forming etc. In these days, because the thin films capable of being used more severe conditions are needed, the technologies of arc ion plating are tried to improve its characteristics. The purpose of this study is to investigate the characteristics of thin films of (Ti,Cr)N compared with those of TiN. The method of arc ion plating, which is known as showing good tight-adherence and productivity, was used. After manufacturing thin films of ($Ti_{1-x}Cr_{x}$)N (x=0~1) with change of Cr in (Ti,Cr) target, atomic concentration, structure, size of crystallite, residual stress and surface roughness of thin films on substrate were investigated. As the results, it was confirmed that Cr atomic concentrations of thin films were proportionally changed with Cr atomic concentrations of target, and thin films of ($Ti_{1-x}Cr_{x}$)N (x=0~1) showed NaCl type and CrN existed as solid solution to TiN.

• 마이크로전자및패키징학회지
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• 제15권4호
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• pp.71-76
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• 2008

전기도금법에 의한 니켈-철 합금 도금층은 전류인가방식, 전류밀도, 첨가제, 도금 욕에서 철과 니켈에 농도비 등과 같은 공정 변수에 따라 그 조성이 민감하게 변화하고 특히 전류인가방식에 따라 도금 층의 조성과 기계적인 특성이 달라지는 경향을 보이고 있다. 본 연구에서는 전류의 인가방식과 전류밀도 변화에 따른 경도, 내마모성, 인성,표면 거칠기 및 잔류응력 등의 기계적인 물성의 변화를 연구하였다. 전류인가방식을 직류에서 펄스전류로 변환시킴에 따라 인장강도가 15% 증가하였으며, 잔류음력이 10% 감소하였고, 내마모성이 30% 향상되었다.

• 한국표면공학회지
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• 제24권1호
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• pp.24-24
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• 1991

Cr-N films were deposited on low-carbon steel sheets by the reactive arc-induced ion plating (AIIP). The influence of the deposition conditions (nitrogen pressure and substrate bias voltage) on the crystal orientation, morphology and microhardness of the Cr-N films has been investigated using x-ray diffractometer and scanning electron microscope. The impurities and contaminations on the surface and at the interface, and the layer-by-layer compositions of the film have been analyzed using scanning Auger multiprobe (SAM) and glow discharge spectroscope (GDS). The mixed state of Cr and Cr2N turned out to have a fine fibrous structure. The Cr2N films were deposited at a wide range of nitrogen flow rates. The orientations of Cr2N films were mainly (110) and (111), and the intensity of the (111) peak increased as the substrate bias voltage increased. The micorstructure of the Cr2N film was dense and no columnar structure was observed. The films in the mixed state of Cr2N and CrN were also dense without columnar structure. The maximum microhardness of the Cr-N films was 2400 kg/$\textrm{mm}^2$ at 10gf load.

• 한국표면공학회지
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• 제42권1호
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• pp.47-52
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• 2009

Cu-Ag powder having Core-Shell structure was prepared from by electroless plating method using agents such as $AgNO_3$, $NH_{4}OH$, Hydroquinone. Ag coated copper powders were analyzed using scanning electron microscopy(SEM) and energy dispersive X-ray spectrometer(EDX). The silver coating layer of copper powder was affected from various reaction conditions such as molar ratio of $NH_{4}OH$, $AgNO_3$, and pulp density. Free silver was generated below 0.1M or 0.3M and above of $NH_{4}OH$ mole ratio. Silver coating layer thickened as addition of $AgNO_3$. When the pulp density reached 12% with 0.2M $NH_{4}OH$, and 0.15M $AgNO_3$ at $4^{\circ}C$, silver was homogeneously distributed around the copper particles and free silver particles were not generated.

• 한국표면공학회지
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• 제25권1호
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• pp.24-33
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• 1992

Cr-N films were deposited on low-carbon steel sheets by the reactive arc-induced ion plating (AIIP). The influence of the deposition conditions (nitrogen pressure and substrate bias voltage) on the crystal orientation, morphology and microhardness of the Cr-N films has been investigated using x-ray diffractometer and scanning electron microscope. The impurities and contaminations on the surface and at the interface, and the layer-by-layer compositions of the film have been analyzed using scanning Auger multiprobe (SAM) and glow discharge spectroscope (GDS). The mixed state of Cr and Cr₂N turned out to have a fine fibrous structure. The Cr₂N films were deposited at a wide range of nitrogen flow rates. The orientations of Cr₂N films were mainly (110) and (111), and the intensity of the (111) peak increased as the substrate bias voltage increased. The microstructure of the Cr₂N film was dense and no columnar structure was observed. The films in the mixed state of Cr₂N and CrN were also dense without columnar structure. The maximum microhardness of the Cr-N films was 2400 kg/㎟ at 10 gf load.

• Transactions on Electrical and Electronic Materials
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• 제11권4호
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• pp.174-177
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• 2010

We have developed an environment-friendly etching process, an alternative to the dichromic acid etching process, as a pretreatment of acrylonitrile-butadiene-styrene (ABS) plastic for electroless plating. In order to plate ABS plastic in an electroless way, there should be fine holes on the surface of the ABS plastic to enhance mechanically the adhesion strength between the plastic surface and the plate. To make these holes, the surface was coated uniformly with dispersed chemical foaming agents in a mixture of environmentally friendly dispersant and solvent by the methods of dipping or direct application. The solvent seeps into just below the surface and distributes the chemical foaming agents uniformly beneath the surface. After drying off the surface, the surface was heated at a temperature well below the glass transition temperature of ABS plastic. By pyrolysis, the chemical foaming agents made fine holes on the surface. In order to discover optimum conditions for the formation of fine holes, the mixing ratio of the solvent, the dispersant and the chemical foaming agent were controlled. After the etching process, the surface was plated with nickel. We tested the adhesion strength between the ABS plastic and nickel plate by the cross-cutting method. The surface morphologies of the ABS plastic before and after the etching process were observed by means of a scanning electron microscope.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2002년도 춘계학술발표회 초록집
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• pp.43-43
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• 2002

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 1998년도 춘계학술발표회 초록집
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• pp.91-92
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• 1998