• Polymer(Korea)
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• v.24 no.5
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• pp.721-727
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• 2000

The electrolytic plating of a metallic nickel on carbon fiber surfaces was carried out to improve mechanical interfacial properties of carbon fiber/epoxy resin composites. The surface characteristics of carbon fibers and the mechanical interfacial properties of final composites were characterized by X-ray photoelectron spectroscopy (XPS) and interlaminar shear strength (ILSS), respectively. It was found that the electrolytic Ni-plating conditions significantly affected the degree of adhesion at interfaces between carbon fibers and epoxy resin matrix in a composite system. Especially, the increase of O,$_{1s}$/$C_{1s}$ ratio, production of NiO groups, and formation of metallic nickel on the nickel-plated carbon fiber surfaces led to an increase of the ILSS of the composites. Also, the ILSS of the composites was greatly correlated with the $O_{1s}$/$C_{1s}$ ratio of the carbon fibers treated in this work.is work.

• Journal of Surface Science and Engineering
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• v.19 no.2
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• pp.59-64
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• 1986

Pulse current was empolyed to the chromium electroplating bath of self-regulating high speed in the following range of conditions; 10-80$^{\circ}C$, 0-400A/$dm^2$, 10-100KHz. The current efficiency was compared with that of a conventional direct current plating in respect of current density and electrode interdistance. The effect of pulse current was found to increase the current efficiency at least 10-20 percent more than the conventional direct current plating in the high current density more than 100A/$dm^2$ and at 3-4mm of electrode interdistance. The surface appearance was also studied and known to be of great influenced by pulse frequency.

• Korean Journal of Materials Research
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• v.22 no.7
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• Journal of the Korean Applied Science and Technology
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• v.35 no.4
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• pp.1338-1347
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• 2018

In this study, Ti-mesh based electrodes were fabricated for the application of anode to the electrolysis process for wastewater treatment using Pd electroless plating method. The removal performance of the prepared Pd / Ti-mesh electrode was evaluated as representative dye RO16, and the durability and performance were maximized by varying the electrode manufacturing conditions. As a result, it was confirmed that the coating condition had no significant effect on the performance, and that the heat treatment process greatly affected the performance and the durability was improved. In addition, we tried to maximize performance and durability by complexing Ir, Ru, and Ta. However, as the thickness of the layer increased due to the limitation of the coating method, the resistance increased and the performance decreased accordingly.

• Korean Journal of Metals and Materials
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• v.49 no.12
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• pp.937-944
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• 2011

Studies have been carried out in order to reduce fuel-cladding chemical interaction (FCCI) behavior of metallic fuel in sodium-cooled fast reactors (SFR) using an electroplating technique. A $20{\mu}m$ thick Cr layer has been plated by the electrochemical method in the Sargent bath over the HT9 (12Cr-1Mo) clad material and diffusion couple tests of the U-10Zr metallic fuel as well as the rare earth alloy (70Ce-29La) have been conducted. The results show that the Cr plating can prevent FCCI behavior along the fuel-clad interface. However, cracks developed through the thickness during plating, which resulted in the migration of some fuel constituents. Variation of bath temperature, application of pulse current, and post heat treatment have been conducted to control such cracks. We found out that some conditions like the pulse current and the post heat treatment enhanced the layer property by reducing the internal cracks and improving the diffusion couple test.

• Journal of the Korean Electrochemical Society
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• v.25 no.2
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• pp.81-87
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• 2022

In this study, the effect of alkylamine on copper electroplating was analyzed using cyclic voltammetry. When water-soluble alkylamines were added to the plating solution, the reduction reaction of Cu²⁺ was inhibited. The inhibition effect of 1,12-diaminododecane has been investigated at various concentrations and conditions of the plating solution. 1,12-diaminododecane was protonated in the acidic plating solution, and therefore, it did not act as a complexing agent for Cu²⁺. Accordingly, it was confirmed that the inhibiton effect of 1,12-diaminododecane was attributed to adsorption on the Cu surface. The adsorption of 1,12-diaminododecane exhibits two characteristics: (i) protonation and subsequent electrostatic attraction with anions pre-adsorbed on Cu surface, and (ii) direct adsorption on Cu surface via amine functional group. The adsorbed 1,12-diaminododecane caused three-dimensional growth and grain refining, as well as the inhibition effect, during Cu electroplating.

• Journal of Surface Science and Engineering
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• v.31 no.6
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• pp.317-324
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• 1998

TiN and TiCN films were deposited on the high speed steel by Cathode Arc Ion Plating(CAIP) Process to investigate the tool life extension effect. The experiment variables were bias voltage and deposit time for the TiN coating and reactive gas flow rate ($CH_4:N_2$) under fixing deposit pressure, are current, bias voltage for the TiCN coating respectively. The micro structure and mechanical properties were investigated and compared for among the coating conditions using various methods and machining practice.

• Proceedings of the KAIS Fall Conference
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• 2006.05a
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• pp.184-187
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• 2006

Nickel was plated electrolessly on 304L stainless steel powder. To obtain uniform coating and dispension of powder, the bath was continuously agitated with magnetic stirrer. The various pH and bath temperatures were studied. The conditions were in the range of $pH4{\sim}10$ and $45{\sim}65^{\circ}C$, respectively. The coating morphologies were examined by SEM/EDS tests. The optimum condition was pH9 at $55^{\circ}C$.

• Proceedings of the KIEE Conference
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• 1998.07g
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• pp.2539-2540
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• 1998

The characteristics of the electroplated nickel were investigated for the MEMS applications. Nickel sulfate bath was used and saccharine was added as the brightener. The effects of the brightener concentration were investigated by comparison of the surface morphology and the hardness of the electroplated nickel. The polarization characteristics were also investigated. The best results were obtained at 1g/$\ell$ saccharin addition.

• Journal of Surface Science and Engineering
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• v.29 no.2
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• pp.100-108
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• 1996

The internal stress of acidic electroless nickel deposits on zincated aluminum was determined by spiral contractometer. Several plating conditions such as inhibitor and complexing agent concentrations and pH affecting the internal stress were studied. The resulting intrinsic stress contribution to the total stress was discussed in terms of phosphorous content of the deposit, solution pH, and surface morphology. However, the most important was found to be thermal stress for the total stress of Al substrate, because of high thermal expansion coefficient of the aluminum substrate.