• Title/Summary/Keyword: Plating adhesion

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Improvement of Interfacial Adhesion of Metal Plated Synthetic Fabrics for Electromagnetic Wave Shielding by Using Cold Plasma (저온 플라즈마 처리에 의한 전자파 차폐성 금속화 합성섬유의 계면 밀착성 개선)

  • 천태일
    • Textile Coloration and Finishing
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    • v.10 no.2
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    • pp.8-17
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    • 1998
  • In this study we have examined electroless chemical plating on the plasma grafted poly [ethylene terephathalate](PET) fabric in order to improve the interfacial adhesion between metal and fiber. The vapour phase of acrylic acid introduced on the PET surface and the graft polymerization was carried out by using cold plasma, resulting in the grafting yield of 0.8-1.3 wt%. The carboxyl group of the plasma grafted was identified by FT-IR-ATR spectra. The Interfacial adhesion was related to the carboxyl group. After electroless chemical plating of nickel, it showed that the more the carboxyl, the better the interfacial adhesion. Comparing to the untreated, the plasma grafted fabric showed fairly good interfacial adhesion(5B grade, ASTM D3359) . The shielding effect of electromagnetic wave showed 95dB. The shielding effect depends on the fabric structure, the surface structure, and the cross sectional shape of fibers. The dense fabric structure, the etched surface like a microcrater, and the trigonal cross sectional shape were prefered.

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Adhesion between Rubber Compound and Copper-Film-Coated Steel Plate Prepared by Vacuum Sputtering and Substitution Plating Methods (진공증착법과 치환도금법으로 제조한 구리박막 피복철판과 배합고무의 접착)

  • Moon, Kyung-Ho;Han, Min-Hyun;Seo, Gon
    • Journal of Adhesion and Interface
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    • v.4 no.3
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    • pp.1-8
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    • 2003
  • Adhesion between rubber compound and copper-film-coated steel plate (abbreviated hereafter as copper film plate) with different thicknesses of copper film was investigated. Two different methods were employed for the preparation of the copper film plates: a substitution plating of preelectroplated zinc with copper ion and a vacuum sputtering of copper on steel plate. Adhesion strength of the copper film plates with rubber compounds was largely dependent upon the thickness of copper film, regardless of their preparation methods. The copper film plates with thinner thickness than 75 nm showed high adhesion comparable to brass, while those with thicker copper film showed poor adhesion due to excessive growth of copper sulfide at adhesion interface.

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pH Effects of Electroless Ni Plating on ABS Plastics

  • Song, T.H.;Lee, J.K.;Ryoo, K.K.;Lee, Y.B.
    • Corrosion Science and Technology
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    • v.3 no.1
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    • pp.26-29
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    • 2004
  • Metal plated plastics are becoming more prevalent in materials of communication parts. A new technique MmSH is a process of injecting plastics to produce innovated physical properties compared to the conventional injection process. This study involves two ways of coating plastics Ni by electroless plating and varying bath and plasma treatment for improved adhesion strength between plating layer and surface. MmSH injection processed ASS with plasma treated after neutralization showed a superior adhesion force and a gloss and rate of deposition when it was in pH 7.5. On the other hand, conventional injection processed ASS was in pH 6.5.

Effect of the WC particle size and Co content on the adhesion property between AIP-TiN coating and WC-Co substrate (AIP-TiN/WC-Co계에서 WC입자크기와 Co함량이 밀착력에 미치는 영향)

  • 한대석;류정민;권식철;김광호
    • Journal of the Korean institute of surface engineering
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    • v.35 no.3
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    • pp.165-171
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    • 2002
  • TiN coating were deposited onto different WC-Co substrates using arc ion plating (AIP) technique. The structure and morphology for the deposited coating were characterized by x-ray diffraction (XRD) and scanning electron microscopy (SEM). The adhesion behavior of the deposited TiN coating was investigated with a conventional scratch test. Effects of WC particle size and Co content on the adhesion strength between the deposited TiN coating and substrate were studied. During the scratch test, the value of critical load was dependent of WC particle size and Co content on substrate. As the WC particle size and Co content on substrate decreased, the critical load increased. The highest critical load, approximately 110N, was obtained at WC particle size of 1$\mu\textrm{m}$ and Co content of 10wt.%.

A Study on the Wear Resistance Behaviors of TiN Films on Tool Steels by Cathode Arc Ion Plating Method (음극아크 이온 플레이팅법에 의한 공구강상의 TiN 피막의 내마모 특성에 관한 연구)

  • 김강범;정창준;백영남
    • Journal of the Korean institute of surface engineering
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    • v.28 no.6
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    • pp.343-351
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    • 1995
  • Titanium nitride films have been prepared on various substrates (silicon wafer, HSS) by cathode arc ion plating process to measure microhardness, adhesion and wear-resistant behaviors by changing the substrate bias voltages (0∼-300V), thickness and roughness. Microhardnesses were measured by micro vickers hardness tester, the adhesion strengths were evaluated by acoustic signals through the scratch test with incremental applied load. As the substrate bias voltages were increased, the {111} orientation was predominant, the microhardnesses and adhesion strengths of tool steel were observed to be stronger than those of without subatrate bias voltage. Adhesion strengths of the substrate bias were 4-7 times higher than those of without the substrate bias, confirmed by SEM with EDX. Wear resistances were used pin-on-disk tribotester and TiN costing reduced the abrasive wear. As the substrate bias was increased, the weight loss and the friction coefficient was decreased.

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Influence of processing parameters for adhesion strength of TiAlN films prepared by Arc Ion Plating

  • Ju, Yun-Gon;Fang, W.;Jo, Dong-Yul;Yun, Jae-Hong;Zhang, S.H.
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2007.11a
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    • pp.136-137
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    • 2007
  • Wear resistant TiAlN thin film has been widely deposited on the surface of cutting and forming tools by using Arc Ion Plating. TiAlN films are deposited by the processes designed by the Taguchi L18 experimental design. The L18 experimental design is applied to achieve surface properties and adhesion. The deposition parameters are working pressure, substrate temperature, bias voltage, arc power and pre-sputtering bias voltage and time. The most influential parameters on surface properties and adhesion are substrate bias voltage, working nitrogen pressure and arc power. The optimal coating processes are obtained for surface properties and adhesion.

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THE EFFECT OF AN APPLIED BIAS UPON THE REFLECTANCE AND ADHESION OF SILVER FILMS BEING SPUTTER-DEPOSITED ON POLYESTER SUBSTRATE

  • Ri, Eui-Jae;Hoang, Tae-Su
    • Journal of the Korean institute of surface engineering
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    • v.32 no.3
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    • pp.257-264
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    • 1999
  • Thin reflective films are synthesized by using PVD methods with a bright metal of Al or Ag. For purposes of improving the reflectance and adhesion of such films particularly, substrate bias was applied during sputtering (namely, ion-plating) to enhance the deposition process with higher energy. And we succeeded in fabricating a quality silver film which possesses an adhesion of $85{\;}Kg/\textrm{cm}^2$ and a high reflectivity of more than 96%. Both of reflectivity and adhesion are better in case of bias sputtering as controlled than nonbias sputtering, particularly the bias of 50-100 V showed most effective. The microstructures of sample films were examined by using various equipments and the XRD spectrum in particular showed that <111> direction is the preferred growth orientation.

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Review on Electroless Plating(I) (무전해도금(I))

  • Kim, Man;Kwon, Sik-Chol
    • Journal of the Korean institute of surface engineering
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    • v.19 no.3
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    • pp.121-127
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    • 1986
  • There are many plating methods already commercially employed in te surface technology. One of the plating methods is electroless (chemical) plating, which is deposited by auto-catalytic reduction of metallic ion with the reducing agent in the plating bath. And it has many advantages comparing with electrolytic plating in respect of properties of deposit, such as corrosion resistance, wear resistance, uniformity, hardness, adhesion and so on. So, electroless plating is the fatest growing process in metallization of plastic and electronic industry. The properties and numerous applications of electroless deposits are attracting more and more attention from finish specifies. Many metal finishers are considering set-up of new electroless line in their shops. This review will be beneficial to domestic metal finishers to understand the real status of present electroless plating technology. It will also provide some knowledge on the economic aspect of electroless plating for the commercial application of specific parts.

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Electroplating on the Lead Frames Fabricated from Domestic Copper Plate (국산동판을 사용한 리드프레임 도금기술에 관한 연구)

  • Jang, Hyeon-Gu;Lee, Dae-Seung
    • Journal of the Korean institute of surface engineering
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    • v.19 no.3
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    • pp.92-108
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    • 1986
  • An electroplating on the lead frame fabricated from domestic copper plate was studied experimentally. In this study, nickel was plated on the thin copper lead frame and silver layer was coated on the nickel film in the cyanide electrolyte. The effect of process variables such as current density, plating time, coating thickness and flow rate of electrolytic solution on the properties of coating was investigated. Some samples on each step were fabricated during electroplating. The results obtained from polarization measurement, observation of SEM photograph, adhesion test of coating and microhardness test are as follows. On silver plating, polarization resistance of potentiostatic cathodic polarization curve is reduced as the flow rate of Ag electrolytic solution increases. And above resistance is also reduced when the minor chemicals of sodium cyanide and sodium carbonate are added in potassium silver cyanide bath. The reduced polarization resistance makes silver deposition on the cathode easy. An increase in the current density and the coating thickness causes the particle size of deposit to coarsen, and consequently the Knoop microhardness of the coating decreases. On selective plating an increase in the flow rate of plating solution lead to do high speed plating with high current density. In this case, the surface morphology of deposit is of fine microstructure with high Knoop hardness. An increasing trend of the adhesion of coating was shown with increasing the current density and flow rate of electrolytic solution.

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Preparation of Electromagnetic Wave Shielding Fabrics by Electroless Silver Plating using PdCl2 and Dextrose (포도당 환원제와 PdCl2 촉매를 사용한 무전해 은도금 PET 직물의 제조)

  • Kim, Su-Mi;Song, Wha-Soon
    • Journal of the Korean Society of Clothing and Textiles
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    • v.32 no.2
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    • pp.319-327
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    • 2008
  • The purpose of this study is to propose the development of high quality electromagnetic wave shielding fabrics. Silver nitrate is used for polyester fabric as an electromagnetic wave shielding material. The effects of activators and electroless silver plating condition on the evenness and adhesion of silver to fabrics, are observed through the SEM micrographs. Surface morphology and wash-ability are measured using SEM. The results are as follows: The optimum weight loss by alkaline hydrolysis of polyester fabrics is about 20%. The optimum concentration of $SnCl_2$ and $PdCl_2$in catalyst reaction using $PdCl_2$ as an activator is 2.5g/L and 0.5g/L, respectively. The optimum concentration of dextrose to improve adhesion between the silver plating and fabrics is 45g/L. The optimum concentration of silver nitrate in the catalyst reaction, using $PdCl_2$ as an activator is 56g/L, respectively. The optimum plating temperature and time are $15^{\circ}C$ and 30minutes, respectively.