• Corrosion Science and Technology
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• 제12권1호
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• pp.27-33
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• 2013

According to its merits about high curing speed and low emission of volatile organic compounds, UV curable inorganic-organic coating technology has been developed as an alternative for toxic and carcinogenic chromate-based treatments for years. It is consistently observed that ultra-thin films offer excellent corrosion protection as well as paint adhesion to metals. Based on the tetra-ethylorthosilicate(TEOS) and methacryloxypropyl trimethoxysilane(MPTMS), inorganic sol was synthesized and formed hybrid networks with UV curable acrylic monomer, 6-hexanediol diacrylate(HDDA), trimethylolpropane triacrylate(TMPTA), pentaerylthritol triacrylate(PETA). Several methods were used to test their properties such as salt spray test, potentiodynamic measurement, tape peel test, etc. It was shown that anti-corrosive property and stability of storage were affected by the molecular ratios of inorganic and organic compounds. It was not only the stability of storage, but had a excellent anti-corrosive, paint adhesive, and anti-solvent properties in a final molar ratios of 0.6/0.04/0.86/0.005 (TEOS/MPTMS/Acetone/HNO3) and 0.08/0.106/0.081/0.02 (TMPTA/HDDA/PETA/photo initiator).

• 마이크로전자및패키징학회지
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• 제19권3호
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• pp.77-82
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• 2012

본 연구에서는 칩을 기판에 내장하기 위해 상용화된 CSR사의 bluetooth chip을 이용하여 표면의 솔더볼을 제거하고 PCB소재와 공정을 이용하는 embedded active PCB 공정에 관한 연구를 하였다. 솔더볼이 제거된 칩과 PCB는 구리 도금 공정으로 연결되었으나 열 충격시 표면처리를 하지 않았을 시 칩의 표면과 ABF 간의 de-lamination 현상이 발견되었고, 이를 해결하기 위해 칩의 polyimide passivation layer에 디스미어와 플라즈마 공정을 이용하여 조도 형성을 하는 연구를 진행하였다. SEM(Scanning Electron Microscope) 과 AFM(Atomic Force Micrometer)을 통하여 표면을 관찰하였고, XPS(X-ray Photoelectron Spectroscopy)를 이용하여 표면의 화학적 구조의 변화를 관찰하였다. 실험결과 플라즈마 처리 시 표면 조도형성이 되었으나 그 밀도가 조밀하지 못하였지만 디스미어 공정과 함께 처리하였을 시 조도의 조밀도가 높아 열 충격을 가하였을 시에도 칩의 polyimide layer와 ABF간의 de-lamination 현상이 발견되지 않았다.

• 한국산학기술학회논문지
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• 제15권3호
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• pp.1253-1258
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• 2014

CA 이온도금기술에 의한 TiC와 TiN 그리고 TiC/TiN 코팅재를 비교하기 위하여 트라이볼로지 물성을 연구하였다. 실험은 Falex journal V block 시스템을 이용한 터보시험기에서 수행하였다. 코팅재의 마찰과 마모특성은 작용된 하중과 미끄럼 속도에 의하여 다양하게 결정되었다. TiC와 TiN 그리고 TiC/TiN 코팅재는 표면에서 트라이볼로지 특성이 현저하게 증가하였다. 단층코팅에서는 TiC보다 TiN이 좋은 결과를 얻었다. 그러나, TiC/TiN의 다층코팅은 다른 어떤 단층코팅보다 좋은 성능을 보였다. 다층코팅의 성능이 향상된 핵심요소는 TiN층 외부와 강 사이에서 부착이 증가하게된 TiC의 역할 때문이다.

• 한국재료학회지
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• 제25권5호
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• pp.253-257
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• 2015

The implanting of metal products is performed with numerous surface treatments because of toxicity and adhesion. Recently, the surface modification of metal products has been actively studied by coating the surface of the TiC or TiN film. We prepared a Ti(10%)Ag Target which may be used in dental oral material by, using the AIP(arc ion plating) system TiAgN coating layer that was deposited on Ti g.23. The purpose of this study was to establish the optimal bias voltage conditions of the coated TiAgN layer formed by the AIP process. The TiAgN coatings were prepared with different bias voltage parameters (0V to -500V) to investigate the effect of bias voltage on their mechanical and chemical properties. The SEM(scanning electron microscope), EDS(energy dispersive X-ray spectrometer), XRD(X-ray diffraction), micro-hardness, and potentiodynamic polarization were measured and the surface characteristics of the TiAgN coating layers were evaluated. The TiAgN coating layer had different mechanical characteristics based on the bias voltage, which also showed differences in thickness and composition.

• 센서학회지
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• 제22권2호
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• pp.130-135
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• 2013

This study proposed a noble process to fabricate TSV (Through Silicon Via) structure which has lower cost, shorter production time, and more simple fabrication process than plating method. In order to produce the via holes, the Si wafer was etched by a DRIE (Deep Reactive Ion Etching) process. The via hole was $100{\mu}m$ in diameter and $400{\mu}m$ in depth. A dielectric layer of $SiO_2$ was formed by thermal oxidation on the front side wafer and via hole side wall. An adhesion layer of Ti and a seed layer of Au were deposited. Soldering process was applied to fill the via holes with solder paste and metal powder. When the solder paste was used as via hole metal line, sintering state and electrical properties were excellent. However, electrical connection was poor due to occurrence of many voids. In the case of metal powder, voids were reduced but sintering state and electrical properties were bad. We tried the via hole filling process by using mixing solder paste and metal powder. As a consequence, it was confirmed that mixing rate of solder paste (4) : metal powder (3) was excellent electrical characteristics.

• 보존과학회지
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• 제26권4호
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• pp.417-427
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• 2010

본 연구에서는 경주 황오동 100번지 유적에서 출토된 철지비단벌레장식금동투조유물을 대상으로 과학적 조사분석을 통한 비단벌레 날개장식의 제작기법을 연구하였다. 연구 결과 금동투조판과 철지판의 연결방법은 리벳팅을 사용하였으며, 수은아말감 기법으로 도금한 후 점선조기법으로 문양을 새긴 것으로 판단하였다. 비단벌레 날개 표면에 핀으로 고정한 흔적이 확인되었으나 재활용이나 가공 과정에 생긴 것으로 추정하였다. 단면 분석을 통해 날개 접착제로 옻칠이 사용되었을 가능성이 높다고 판단하였으며, 행엽 지판에도 부식방지를 위해 옻칠이 도포되었음을 확인하였다.

• 한국표면공학회지
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• 제50권6호
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• pp.473-479
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• 2017

CrN coatings have been used as protective coatings for cutting tools, forming tools, and various tribological machining applications because these coatings have high hardness. Cr-Al-N coatings have been investigated to improve the properties of CrN coatings. Cr-Al-N coatings were fabricated by a hybrid physical vapor deposition method consisting of unbalanced magnetron sputtering and arc ion plating with different working pressure and substrate bias voltage. The phase analysis of the composition was performed using XRD (x-ray diffraction). Cr-Al-N coatings were grown with textured CrN phase and (111), (200), and (220) planes. The adhesion strength of the coatings tested by scratch test increased. The friction coefficient and removal rate of the coatings were measured by a ball-on-disk test. The friction coefficient and removal rate of the coatings decreased from 0.46. to 0.22, and from $2.00{\times}10^{-12}m^2/N$ to $1.31{\times}10^{-13}m^2/N$, respectively, with increasing bias voltage. The tribological properties of the coatings increased with increasing substrate bias voltage.

• 한국표면공학회지
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• 제40권4호
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• pp.170-174
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• 2007

High Velocity Oxygen Fuel (HVOF) thermal spray coating of nano size WC-Co powder (nWC-Co) has been studied as one of the most promising candidate for the possible replacement of the traditional hard plating in some area which causes environmental and health problems. nWC-Co powder was coated on Inconel 718 substrates by HVOF technique. The optimal coating process obtained from the best surface properties such as hardness and porosity is the process of oxygen flow rate (FR) 38 FMR, hydrogen FR 57 FMR and feed rate 35 g/min at spray distance 6 inch for both surface temperature $25^{\circ}C\;and\;500^{\circ}C$. In coating process a small portion of hard WC decomposes to less hard $W_2C$, W and C at the temperature higher than its decomposition temperature $1,250^{\circ}C$ resulting in hardness decrease and porosity increase. Friction coefficient increases with increasing coating surface temperature from 0.55-0.64 at $25^{\circ}C$ to 0.65-0.76 at $500^{\circ}C$ due to the increase of adhesion between coating and counter sliding surface. Hardness of nWC-Co is higher or comparable to those of other hard coatings, such as $Al_2O_3,\;Cr,\;Cr_2O_3$ and HVOF Tribaloy 400 (T400). This shows that nWC-Co is recommendable for durability improvement coating on machine components such as high speed spindle.

• 대한금속재료학회지
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• 제48권10호
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• pp.951-956
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• 2010

This study examined the effect of copper and sulfuric acid concentrations on the surface morphology and physical properties of copper plated on a polyimide (PI) film. Electrochemical experiments with SEM and a four-point probe were performed to characterize the morphology and mechanical characteristics of copper electrodeposited in the composition of an electrolyte. The resistivity and peel strength were controlled using a range of electrolyte compositions. A lower resistivity and high flexibility were obtained when an electrolyte with 20 g/l of copper was used. However, a uniform surface was obtained when a high current density that exceeded $20mA/cm^2$ was applied, which was maintained at copper concentrations exceeding 40 g/l. Increasing sulfuric acid to >150 g/l decreased the peel strength and flexibility. The lowest resistivity and fine adhesion were detected at a $Cu^{2+}:H_2SO_4$ ratio of 50:100 g/l.

• 공업화학
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• 제22권1호
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• pp.98-103
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• 2011

DSSC의 광전 효율 증대와 Pt 상대전극의 접착성 향상을 위하여 FTO (Fluorine-doped Tin Oxide) 유리면에 Ni underlayer를 전기 도금 후 Pt 층을 전기 도금하였다. Ni underlayer는 $10mA/cm^2$에서 2 min 동안 도금한 경우 Ni 층과 FTO 면사이의 접착성이 가장 우수하게 나타났으며, Ni underlayer를 $10mA/cm^2$에서 2 min, Pt 층을 $5mA/cm^2$에서 1 min 동안 전기 도금한 상대전극의 XRD 분석 결과 Ni 및 Pt의 금속 회절 peak들을 관찰 할 수 있었다. 이렇게 제조한 상대전극을 사용하여 DSSC의 impedance 측정 결과 75 ohm의 가장 낮은 저항을 나타냈으며, 광전 효율은 5.6%로서 가장 높은 값을 나타내었다.