• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.813-817
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• 1995

Structural analysis of horizontal cold chamber die casting machine is performed by the FEM. The analyzed model is made up of stationary die platen,movable die platen,link housing platen, C-frame, and tie bar which mainly undertake die locking force and injection force. In modeling, compression gap elements are used for to simulate contacting condition between tie bar and movable die platen, movable die platen and base frame, and link housing and base frame. Unbalanced die locking force imposed on four tie bars are considered. As the results, the deformed shape and the stresses of the die casting machine are given.

• 연구논문집
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• s.25
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• pp.5-12
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• 1995

Mold platen are one of the most important structural components of the injection molding machine. Mold platen had been designed, and manufactured based on the experience and the method of trial and error. Recently, as the computer progress, the numerical simulation method using commercial finite element analysis code has been used to analyze the characteristics of components. It's a urgent problem to reduce the weight of mold platen while preserving the safety and reliability for the structual failure. Finite element analyses to establish basic design technologies and reducing the weight of mold platen were carried out. As result, we are obtained the about 10% reducing the weight for mold platen.

• Journal of Korean Tunnelling and Underground Space Association
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• v.10 no.3
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• pp.303-312
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• 2008

Multi-axial compression tests have been frequently adopted for the evaluation of material properties of rock cores and rock fracture model tests. Special care has to be applied on the boundary condition between the specimen and loading platen to draw the precise test results of the multi-axial compression tests. With the use of dry steel platen, the stress rotation will occur, due to the frictional restraint from the boundary between the specimen and loading platen. The restraint will deviate the expected test results under the conditions of the given external pressures. Various methods have been applied to reduce the side restraint along the specimen/loading platen interface. The steel brush type loading platen is one example of the attempts. In this paper, a new type of loading platen is introduced to overcome the limitation caused by the use of the brush type loading platen, which requires some internal space for the installation of the brushes. The new type of loading platen, roller supported steel piston type loading platen. is constituted of shot steel pistons which have sufficient stiffness to deliver the external pressure and the shaft type roller installed at the rear of the pistons. The pistons are designed to follow the local deformation of the specimens. In this paper, structural details of the loading platen are presented and frictional and biaxial compression tests results are shown to verify the required functions of the loading platen. Furthermore, calibration process is followed by a comparison between the test results and numerical analyses.

• Journal of the Korean Wood Science and Technology
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• v.23 no.4
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• pp.39-45
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• 1995

The plywoods commonly used as decorative interior materials for the construction are inflammable and so it is a causative factor for making fire accidents, resulting in the destruction of human life and personal properties. Indeed, it is, therefore, required to produce fire-retardant plywoods. In this study, a special grade of defect-free, Kapur plywood was used. Specimens were cut into 3- by 20cm dimensions from 120- by 240- by 0.33-cm panels(thin panel) or 120- by 240- by 0.5-cm panels(thick panel). Some specimens were treated with diammonium phosphate(DAP), but some were not treated with diammonium phosphate to use as control panels. Chemical absorption, drying curves, drying rates and dynamic Young's modulus were investigated. The results were summaries as follows; 1. The specimens were soaked into 19% diammonium phosphate solution by a full cell pressure process and the diammonium phosphate retained in the thin and thick plywoods was 1.409kg/$(30cm)^3$, 1.487kg/$(30cm)^3$, respectively. 2. Diammonium phosphate-treated plywoods were redried with press-drying process at one of either condition dried on the platen($115^{\circ}C$) for a period of time or dried on the platen($50^{\circ}C$) for 3 hrs plus in a dry-oven($30^{\circ}C$) for 24 hrs. or dried on the platen($60^{\circ}C$) for 2 hrs plus in a dry-oven($30^{\circ}C$) for 24 hrs. The drying rate of treated thin specimens dried at $60^{\circ}C$ plus $30^{\circ}C$ and $115^{\circ}C$ only was found to be 0.04 %/min. and 8.53 %/min. Similarly, the drying rate of treated thick specimens were 0.03 %/min. and 6.77 %/min. respectively. 3. It was evident that highly-significantly different drying rate of treated plywoods was observed between plywood thicknesses and platen temperatures and the rate was increased by elevating the platen temperature up to $115^{\circ}C$. Based on the two-way variance analysis, highly significant drying rate was observed from the interaction between plywood thicknesses and platen temperatures. 4. After redrying, the specimens were weighed and reconditioned to a constant weight in a facility maintained temperature ($20^{\circ}C$) and relative humidity(65%) prior to test dynamic Young's modulus. The test revealed that the thin specimens dried at the platen temperature of $50^{\circ}C$, $60^{\circ}C$, $115^{\circ}C$ and untreated specimens showed 1.070E+09 dyne/$cm^2$, 1.156E+09 dyne/$cm^2$, 1.243E+09 dyne/$cm^2$, and 1.052E+09 dyne/$cm^2$, respectively. Likewise, the thick specimens revealed 5.647E+09 dyne/$cm^2$ 5.670E+09 dyne/$cm^2$, 6.395E+09 dyne/$cm^2$ and 5.415E+09 dyne/$cm^2$, respectively. 5. It was evident that significantly different dynamic Young's modulus was observed between the plywood thickness and the platen temperature, but not in the two-way interaction between the plywood thickness${\times}$the platen temperature.

• Tribology and Lubricants
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• v.32 no.2
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• pp.67-71
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• 2016

This study investigates the characteristics of the sapphire wafer chemical mechanical polishing (CMP) process. The material removal rate is one of the most important factors since it has a significant impact on the production efficiency of a sapphire wafer. Some of the factors affecting the material removal rate include the pressure, platen speed and slurry. Among the factors affecting the CMP process, we analyzed the trends in the material removal rate and surface roughness, which are mechanical factors corresponding to both the pressure and platen speed, were analyzed. We also analyzed the increase in the material removal rate, which is proportional to the pressure and platen speed, using the Preston equation. In the experiment, after polishing a 4-inch sapphire wafer with increasing pressure and platen speed, we confirmed the material removal rate via thickness measurements. Further, surface roughness measurements of the sapphire wafer were performed using atomic force microscopy (AFM) equipment. Using the measurement results, we analyzed the trends in the surface roughness with the increase in material removal rate. In addition, the experimental results, confirmed that the material removal rate increases in proportion to the pressure and platen speed. However, the results showed no association between the material removal rate and surface roughness. The surface roughness after the CMP process showed a largely consistent trend. This study demonstrates the possibility to improve the production efficiency of sapphire wafer while maintaining stable quality via mechanical factors associated with the CMP process.

• Journal of the Korean Wood Science and Technology
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• v.15 no.3
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• pp.56-67
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• 1987

Plywoods used for construction as a decorative interior material are inflammable and can make fire accidents, causing destruction of human life and property. Therefore, it is indeed required to make fire-retardant treated plywood. In this study, 3.7mm yellow meranti plywoods were soaked in 18% boric acid solutions and tap water by hot-cold bath for 1/2, 2/2, 4/2, 6/2 hours and redrying of treated plywoods was carried out by press drying at the platen temperature of 110, 130, 160, $180^{\circ}C$ and then it was conducted to investigate solution absorption, drying rates, dynamic young's modulus. specific gravity and fire-retardant factors such as burning point, flame spread length. flame exhausted time, back side carbonized area and weight loss by treating time, treating solutions and platen temperature. The results are as follows; 1. When plywood was impregnated with the hot bath temperature of $70^{\circ}C$ for 1. 2, 4, 6 hours and the cold bath temperature of $15^{\circ}C$ for 2 hours respectively, retentions of boric acid were 1.565, l.597, 1.643, 1.709kg/$(30cm)^3$ and all of them exceeded the minimum retention [1.125kg/$(30cm)^3$] even in the shortest treatment. 2. In hot-cold bath method for 1/2 hours, the drying rates of treated plywood remarkably increased with the extension of platen temperature of 110, 130, 160, $180^{\circ}C$ and the values of boric acid treated plywood were 5.900, 10.196, 45.42, 54.958m.c%/min and the values of water treated plywood were 6.014, 12.373, 46.520, 55.730m.c%/min and drying rates of water treated plywood were faster than those of boric acid treated plywood. 3. The values of boric acid treated plywoods in dynamic young's modulus were widely higher than those of water treated plywoods. And it can be observed that there were highly significant differences for treating time between dynamic young's modulus, and the values of boric acid plywoods increased with the extension of treating time but on the contrary water treated plywoods were decreased values with prolonged time 4. It was observed that there were highly significant differences for platen temperature between dynamic young's modulus. When the values of water treated plywoods in dyna nic young's modulus were abruptly decreased according to the rise of platen temperature. boric acid treated plywoods showed rather increased values at $160^{\circ}C$ of platen temperature. And in 2- way interactions, there were also highly significant for dynamic young's modulus between treating time x treating solutions and platen temperature x treating solutions. 5. Correlation coefficients of fire-retardant factors were shown in table 5. It could be recognized that there were close correlations between the treating solutions and burning point, flame spread length, back side carbonized area, flame exhausted time and weight loss, but there was no correlation between fire-retardant factors and treating time and platen temperature. 6. From table 6, it can be observed that there were highly significant differences for burning point, flame spread length, flame exhausted time, back side carbonized area, weight loss between treating solutions. And in 2-way interactions, there were highly significant for burning point, flame spread length, weight loss between treating time $\times$ treating solutions.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.241-242
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• 2011

• Journal of the Korean Vacuum Society
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• v.15 no.6
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• pp.630-636
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• 2006

Scale down of semiconductor gate pattern will make progress centrally line width into transistor according to the high integration and high density of flash memory semiconductor. Recently, the many researchers are in the process of developing research for using the ONO(oxide-nitride-oxide) technology for the gate pattern give body to line breadth of less 100 nm. Therefore, etch rate and etch profile of the line width detail of less 100 nm affect important factor in a semiconductor process. In case of increasing of the platen power up to 50 W at the ICP etcher, etch rate and PR selectivity showed good result when the platen power of ICP etcher has 100 W. Also, in case of changing of HBr gas flux at the platen power of 100 W, etch rate was decreasing and PR selectivity is increasing. We founded terms that have etch rate 320 nm/min, PR selectivity 3.5:1 and etch slope have vertical in the case of giving the platen power 100 W and HBr gas 35 sccm at the ICP etcher. Also notch was not formed.

• Journal of the Korean Wood Science and Technology
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• v.10 no.3
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• pp.167-167
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• 1982

Italian poplar (Populus euramericana) rotary veneers were press-dried and air-dried to study drying curves, thickness shrinkage and width shrinkage of them under several drying conditions such as drying temperatures and veneer thicknesses. The results of the study are summarized as follows; 1. In press-drying, drying times from green condition to about final moisture content of 10 percent with veneer thickness of 0.6mm by platen temperatures required about 10 minutes at platen temperature of $100^{\circ}C$, 3 minutes at $110^{\circ}C$, 1 minute at $120^{\circ}C$ and $130^{\circ}C$, respectively. 2. In press, drying, drying times from green condition to about final moisture content of 10 percent by veneer thicknesses required 2 minutes at veneer thickness of 0.6mm, 4 minutes at 1.2mm,6 minutes at 1.8mm and 9 minutes at 3.6mm, respectively. 3. In air-drying, drying times from green condition to air-dried moisture content by veneer thicknesses required 15 hours at veneer thickness of 0.6mm, 18 hours at 1.2mm and 23 hours at 2.4mm, respectively. 4. Thickness shrinkage of press-drying was remarkably greater than that of air-drying, but width shrinkage of press-drying was rather smaller. 5. Difference of thickness shrinkage among platen temperatures was insignificant, and width shrinkage at platen temperature of $130^{\circ}C$ was the least.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.5 no.2
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• pp.128-131
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• 2004

In this study Bosch etching process repeating etch and deposition by STS-ICP ASEHR was evaluated. Fundamentally etch depth changes were affected by thickness of deposited PR, $SiO_2$ and depth, and pattern size on the substrate. However etch rates were observed to be changed by variable parameters such as platen power, coil power, and process pressure. Etch rate showed $1.2\mu{m}/min$ and sidewall profile showed $90\pm0.2^\circ$ with platen power 12W, coil power 500W, and etch/passivation cycle 6/7sec. It was confirmed that this result was very typical to Bosch process utilizing ICP.