• Journal of Korean Society of Steel Construction
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• v.23 no.4
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• pp.503-514
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• 2011

In this research, the seismic connection details for two concrete-filled U-shape steel beam-to-H columns were proposed and cyclically tested under a full-scale cruciform configuration. The key connecting components included the U-shape steel section (450 and 550 mm deep for specimens A and B, respectively), a concrete floor slab with a ribbed deck (165 mm deep for both specimens), welded couplers and rebars for negative moment transfer, and shear studs for full composite action and strengthening plates. Considering the unique constructional nature of the proposed connection, the critical limit states, such as the weld fracture, anchorage failure of the welded coupler, local buckling, concrete crushing, and rebar buckling, were carefully addressed in the specimen design. The test results showed that the connection details and design methods proposed in this study can well control the critical limit states mentioned above. Especially, the proposed connection according to the strengthening strategy successfully pushed the plastic hinge to the tip of the strengthened zone, as intended in the design, and was very effective in protecting the more vulnerable beam-to-column welded joint. The maximum story drift capacities of 6.0 and 6.8% radians were achieved in specimens A and B, respectively, thus far exceeding the minimumlimit of 4% radians required of special moment frames. Low-cycle fatigue fracture across the beam bottom flange at a 6% drift level was the final failure mode of specimen A. Specimen B failed through the fracture of the top splice plate of the bolted splice at a very high drift ratio of 8.0% radian.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.39-46
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• 2021

The quantitative measurement of interfacial adhesion energy (Gc) of multilayer thin films for Cu interconnects was investigated using a double cantilever beam (DCB) and 4-point bending (4-PB) test. In the case of a sample with Ta diffusion barrier applied, all Gc values measured by the DCB and 4-PB tests were higher than 5 J/㎡, which is the minimum criterion for Cu/low-k integration without delamination. However, in the case of the Ta/Cu sample, measured Gc value of the DCB test was lower than 5 J/㎡. All Gc values measured by the 4-PB test were higher than those of the DCB test. Measured Gc values increase with increasing phase angle, that is, 4-PB test higher than DCB test due to increasing plastic energy dissipation and roughness-related shielding effects, which matches well interfacial fracture mechanics theory. As a result of the 4-PB test, Ta/Cu and Cu/Ta interfaces measured Gc values were higher than 5 J/㎡, suggesting that Ta is considered to be applicable as a diffusion barrier and a capping layer for Cu interconnects. The 4-PB test method is recommended for quantitative adhesion energy measurement of the Cu interconnect interface because the thermal stress due to the difference in coefficient of thermal expansion and the delamination due to chemical mechanical polishing have a large effect of the mixing mode including shear stress.