• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.183-183
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• 2000

Aigrain에 의해 Helicon이라는 이름이 명명된 이후, helicon은 저온의 금속과 같은 높은 전도도(conductivity)를 갖는 매질이나 강한 자기장이 걸려있는 plasma를 전파해 나가는 저주파 전자기장을 지칭해왔다. 이온화된 개스에서 이러한 전자기장은 전자 공명 주파수(electron cyclotron frequency)와 이온 공명 주파수(ion cyclotron frequency) 사이의 주파수로 전파하며 전리층 (ionosphere)을 통과하며 발생하는 가청 주파수 영역대의 음조가 강하하는 현상에 의해 low-frequency whistler라고도 불린다. Helicon wave plasma는 Boswell에 의해 처음 발생된 후, 높은 이온화율(~100%)로 인해 많은 연구가 이루어져 왔다. 1985년에 Chen은 helicon plasma의 높은 이온화율을 설명하기 위해 Landaudamping을 제시하였다. 이러한 설명은 1997년에 Shamrai에 의해 TG mode가 도입되기 전까지 직접적인 실험결과 없이 helicon plasma 발생의 mechanism으로 받아들여졌다. shamrai의 이론에 의하면 정전기파(electrostatic wave)는 plasma의 표면(surface)에서 강하게 감쇄되어 energy를 전달하게 된다. Cho는 radial density 분포가 외각보다 중심이 높을 경우 TG wave의 power 전달이 중심에서 일어날 수 있음을 계산하였다. Helicon plasma의 특성은 높은 이온화율에 의한 높은 밀도($\geq$1012cm3), 1-2 kW의 rf power에서 상대적으로 낮은 전자 온도( 4eV), $\omega$ci $\omega$LH<$\omega$ $\omega$ce $\omega$pe 영역대의 주파수, 자기장 50-1200 Gauss, 압력 1-10 mTorr로 특정지을 수 있다. 이러한 외부분수들의 조건에 k라 helicon plasma는 여러 종류의 mode로 존재한다. Degeling은 이러한 mode의 변화를 capacitive mode, inductive mode, 그리고 helicon mode(wave mode)의 세가지 부분으로 구분하였다. Helicon plasma가 갖는 높은 이온화율은 여러 가지 응용으로의 가능성을 가지고 있다. 그 예로 plasma processing, plasma wave에 의한 입자 가속, 그리고 가스 레이저 활성 매질 발생 등이 있다. 특히 plasma processing의 경우 helicon plasma는 높은 밀도, 비교적 낮은 자기장, remote operation 등이 가능하다는 점에서 현재 연구가 활발히 진행되고 있다. 상업용으로도 PMT와 Lucas Signatone Corp.에 서 helicon source가 제작되었다. 또한 높은 해리율을 이용하여 저유전 물질인 SiOF의 증착에서 적용되고 있다. 이 외에도 다수의 연구결과들이 발표되었다.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.478-478
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• 2012

Recently, there are many researches in order to increase the deposition rate (D/R) and improve film uniformity and quality in the deposition of microcrystalline silicon thin film. These two factors are the most important issues in the fabrication of the thin film solar cell, and for the purpose of that, several process conditions, including the large area electrode (more than 1.1 X 1.3 (m2)), higher pressure (1 ~ 10 (Torr)), and very high frequency regime (VHF, 40 ~ 100 (MHz)), have been needed. But, in the case of large-area capacitively coupled discharges (CCP) driven at frequencies higher than the usual RF (13.56 (MHz)) frequency, the standing wave and skin effects should be the critical problems for obtaining the good plasma uniformity, and the ion damage on the thin film layer due to the high voltage between the substrate and the bulk plasma might cause the defects which degrade the film quality. In this study, we will propose the new concept of the large-area multi-electrode (a new multi-electrode concept for the large-area plasma source), which consists of a series of electrodes and grounds arranged by turns. The experimental results with this new electrode showed the processing performances of high D/R (1 ~ 2 (nm/sec)), controllable crystallinity (~70% and controllable), and good uniformity (less than 10%) at the conditions of the relatively high frequency of 40 MHz in the large-area electrode of 280 X 540 mm2. And, we also observed the SEM images of the deposited thin film at the conditions of peeling, normal microcrystalline, and powder formation, and discussed the mechanisms of the crystal formation and voids generation in the film in order to try the enhancement of the film quality compared to the cases of normal VHF capacitive discharges. Also, we will discuss the relation between the processing parameters (including gap length between electrode and substrate, operating pressure) and the processing results (D/R and crystallinity) with the process condition map for ${\mu}c$-Si:H formation at a fixed input power and gas flow rate. Finally, we will discuss the potential of the multi-electrode of the 3.5G-class large-area plasma processing (650 X 550 (mm2) to the possibility of the expansion of the new electrode concept to 8G class large-area plasma processing and the additional issues in order to improve the process efficiency.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.183-183
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• 2015

Arc in plasma processing chamber results in high current discharge marks and particles on wafers, but it is hard to identify or observe it during the proc ess. In this paper, we report the observations of plasma arc s during various plasma proc esses through a non-invasive optic al plasma monitoring system (OPMS) devised for the in-situ detec tion of abnormal discharge.

• Journal of Adhesion and Interface
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• v.6 no.2
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• pp.6-12
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• 2005

The plasma generally, ionized gas state, is the 4th material state composed the universe. Generating the plasma artificially has been studied by spending energy and it has a lot of applications in human's life. There are several merits to modify the surface of polymer using plasma. Above all, plasma maintains the property of polymer because of it changes the property of surface only. Also, it doesn't use a organic solvent and it is the environment friendship because of there are no waste under processing. Furthemore, in case of high-pressure plasma, it is possible that automated-processing continuously. In this study, we tried the reforming of surface to rise the adhesive strength between the material of polymer, experimented the rising of adhesive strength through a experiment of peel strength by virtue of processing time and using gas, confirmed the change of polymer's surface through measuring the surface contact angle analyzer and scanning electron microscopy (SEM).

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.525-525
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• 2013

Low temperature plasma diagnosis is one of the big issues in laboratory scale or processing industry. One of the most powerful techniques of plasma diagnostics is the use of the scattering of electromagnetic radiation from the plasma. Electron temperature and density are important parameters for understanding the information of plasmas in the plasma processing industry. Laser scattering experiments on plasma can provide a substantial amount of information about plasma parameters such as the electron density ne, the electron temperature Te, and the neutral density nn and temperature Tn. Thomson scattering spectroscopy is used several method, in accordance with detector type. Commonly, Thomson scattering is used several notch filter to separate expanded wavelength. Since using a spectrometer with surface relief grating or notch filter, the system of the measurement will be complicated and bigger. In this study, using VPHG (Volume Phase Holographic Grating) in order to install the simple and cheap system. VPHG has the advantage of the system installation, because it can be Transmission Type. The diffraction efficiency and dispersion angle of VPHG is higher than the surface relief grating relatively. For a wavelength and bandwidth selection, Using a slit or mask to select a rejection wavelength instead of notch filter.

• Design & Manufacturing
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• v.12 no.1
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• pp.47-51
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• 2018

As the IT industry rapidly progresses, the functions of electronic devices and display devices are integrated with high density, and the model is changed in a short period of time. To implement the integration technology, a uniform micro-pattern implementation technique to drive and control the product is required. The most important technology for the micro pattern generation is the exposure processing technology. Failure to implement the basic pattern in this process cannot satisfy the demands in the manufacturing field. In addition, the conventional exposure method of the mask method cannot cope with the small-scale production of various types of products, and it is not possible to implement a micro-pattern, so an alternative technology must be secured. In this study, the technology to implement the required micro-pattern in semiconductor processing is presented through the photolithography process and plasma etching.

• Journal of the Korean institute of surface engineering
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• v.50 no.6
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• pp.455-459
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• 2017

The development of flexible transparent electrode has been paid attention for flexible electronics. In this study, we have developed transparent electrode based on silver nanowires with improved electrical property and stability through ion-beam treatment. The energetic particles of ion-beam could sinter junctions of each silver nanowires and etch out polyvinylpyrollidone(PVP) coated on silver nanowires. The sheet resistance of silver nanowire transparent electrode was reduced by 74%, and the resistance uniformity was increased about 3 times after exposure of ion beam. Moreover, the stability at $85^{\circ}C$ of temperature and 85% of relative humidity could be also improved.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.262.2-262.2
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• 2014

Plasma processing is an essential process for pattern etching and thin film deposition in nanoscale semiconductor device fabrication. It is necessary to maintain plasma chamber in steady-state in production. In this study, we determined plasma chamber state with residual gas analysis with self-plasma optical emission spectroscopy. Residual gas monitoring of fluorocarbon plasma etching chamber was performed with self-plasma optical emission spectroscopy (SPOES) and various chemical elements was identified with a SPOES system which is composed of small inductive coupled plasma chamber for glow discharge and optical emission spectroscopy monitoring system for measuring optical emission. This work demonstrates that chamber state can be monitored with SPOES and this technique can potentially help maintenance in production lines.

• Composites Research
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• v.23 no.5
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• pp.1-7
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• 2010

To increase the adhesive strength of acrylonitrile butadiene rubber(NBR) and steel plate, the atmospheric pressure flame plasma(APFP) treatment device is applied. The effect of various conditions(processing velocity and distance) is experimentally investigated to ascertain the optimum conditions to yield the best adhesive properties. It is found that the optimum distance between burner port and steel plate is 40mm and the optimum processing velocity is 50m/min at given condition. When the surface is coated twice with the bonding agent, the adhesion strength of APFP treated steel plate is increased to about 20.5%. It suggests that the surface modification of steel by flame plasma treatment at atmospheric pressure is a proper and applicable method to improve the adhesion strength between steel and rubber.

• Journal of the Korean Ceramic Society
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• v.46 no.2
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• pp.131-136
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• 2009

Radio frequency (RF) plasma treatment is studied for the size reduction and the spheroidization of coarse particles to change them into nano-sized powders of spherical shape in MLCC fields. The uni-nanoadditives manufactured by RF plasma processing for high dispersion have been investigated for the effect on core-shell structure in dielectrics of MLCC. Microstructures have been characterized using scanning electron microscope (SEM), transmission electron microscope (TEM) and Electron Probe Micro Analyzer (EPMA). We compared the distribution of core-shell grains between specimens manufactured using uni-nanoadditive and using mixed additive. In addition, the uniformity of rare earth elements in the core-shell structured grains was analyzed. It was shown, from TEM observations, that the sintered specimen manufactured using uni-nanoadditives had more dense small grains with well-developed core-shell structure than the specimen using mixed additives, which had a homogeneous microstructure without abnormal grain growth and shows broad temperature coefficient of capacitance (TCC) curves in all temperature ranges because of well dispersed additives.