• Title/Summary/Keyword: Plasma processing

Search Result 641, Processing Time 0.034 seconds

LOW TEMPERATURE DEPOSITION OF SILICON OXIDE FILMS BY UV-ASSOSTED RF PLASMA-ENHANCED CVD

  • Hozumi, Atsushi;Sugimoto, Nobuhisa;Sekoguchi, Hiroki;Takai, Osamu
    • Journal of the Korean institute of surface engineering
    • /
    • v.29 no.6
    • /
    • pp.773-780
    • /
    • 1996
  • Silicon oxide films were prepared by using five kinds of organosilicon compound as gas sources without oxygen by rf plasma-enhanced CVD (PECVD). UV light was irradiated on a substrate vertically during deposition to enhance film oxidation and ablation of carbon contamination in a deposited films. Films prepared with UV irradiation contained less carbon than those prepared without UV irradiation. The oxidation of the films was improved by UN irradiation. The effect of UV irradiation was, however, not observed when the films were prepared with tetramethy lsilane (TMS) which contained no oxygen atom. Dissociated oxygen atoms from an organosilicon compound were excited in the plasma with UV irradiation around the substrate surface and affected the enhancement of film oxidation and ablation of carbon in the films.

  • PDF

Synthesis and Characterization of Glold Nanofluid Prepared by the Solution Plasma Processing (용액 플라즈마 공정을 이용하여 제조된 금 나노유체의 특성평가)

  • Heo, Yong-Kang;Lee, Sang-Yul
    • Journal of Powder Materials
    • /
    • v.17 no.4
    • /
    • pp.342-346
    • /
    • 2010
  • In the present work, water-based gold nanofluids were synthesized by the solution plasma processing (SPP). The size distribution and the shape of gold nanoparticles in the nanofluids were investigated using high resolution transmission electron microscopy (HR-TEM). The dispersion stability of gold nanofluids was characterized using zeta potential, as well. The thermal properties of gold nanofluids were measured by utilizing lambda measurement device. Nanofluids containing nanoparticles with $64.0{\pm}42.1\;nm{\sim}18.10{\pm}5.0\;nm$ in diameter were successfully synthesized. As diameter of nanoparticles decreased, dispersion stability of nanofluids increased and the enhanced ratio of thermal conductivity increased. The nanofluid with nanoparticles of $18.10\;{\pm}\;5.0\;nm$ in diameter showed approximately 3% improvement in thermal conductivity measurement and this could be due to the enhanced Brownian movement.

Study on Improvement of Diamond Deposition on Al2O3 Ceramic Substrates by a DC Arc Plasmatron

  • Kang, In-Je;Joa, Sang-Beom;Chun, Se-Min;Lee, Heon-Ju
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2012.02a
    • /
    • pp.457-457
    • /
    • 2012
  • We presented plasma processing using a DC Arc Plasmatron for diamond deposition on Al2O3 ceramic substrates. Plasma surface treatments were conducted to improve deposition condition before processing for diamond deposition. The Al2O3 ceramic substrates deposited, $5{\times}15mm^2$, were investigated by Scanning Electron Microscopy (SEM), Fourier Transform Infrared Spectroscopy (FTIR) and X-ray Diffraction (XRD). Properties of diamond (111), (220) and (311) peaks were shown in XRD. We identified nanocrystalline diamond films on substrates. The results showed that deposition rate was approximately $2.2{\mu}m/h$ after plasma surface treatments. Comparing the above result with a common processing, deposition rate was improved. Also, the surface condition was improved more than a common processing for diamond deposition on Al2O3 ceramic substrates.

  • PDF

Efficiency enhancement of the organic light-emitting diodes by oxygen plasma treatment of the ITO substrate

  • Hong, J.W.;Oh, D.H.;Kim, C.H.;Kim, G.Y.;Kim, T.W.
    • Journal of Ceramic Processing Research
    • /
    • v.13 no.spc2
    • /
    • pp.193-197
    • /
    • 2012
  • Oxygen plasma has been treated on the surface of indium-tin-oxide (ITO) to improve the efficiency of the organic light-emitting diodes (OLEDs) device. The plasma treatment was expected to inject the holes effectively due to the control of an ITO work-function and the reduction of surface roughness. To optimize the treatment condition, a surface resistance and morphology of the ITO surface were investigated. The effect on the electrical properties of the OLEDs was evaluated as a function of oxygen plasma powers (0, 200, 250, 300, and 450 W). The electrical properties of the devices were measured in a device structure of ITO/TPD/Alq3/BCP/LiF/Al. It was found the plasma treatment of the ITO surface affects on the efficiency of the device. The efficiency of the device was optimized at the plasma power of 250 W and decreased at higher power than 250 W. The maximum values of luminance, luminous power efficiency, and external quantum efficiency of the plasma treated devices increase by 1.4 times, 1.4 times, and 1.2 times, respectively, compared to those of the non-treated ones.

Effects of Atmospheric Pressure Microwave Plasma on Surface of SUS304 Stainless Steel

  • Shin, H.K.;Kwon, H.C.;Kang, S.K.;Kim, H.Y.;Lee, J.K.
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2012.08a
    • /
    • pp.268-268
    • /
    • 2012
  • Atmospheric pressure microwave induced plasmas are used to excite and ionize chemical species for elemental analysis, for plasma reforming, and for plasma surface treatment. Microwave plasma differs significantly from other plasmas and has several interesting properties. For example, the electron density is higher in microwave plasma than in radio-frequency (RF) or direct current (DC) plasma. Several types of radical species with high density are generated under high electron density, so the reactivity of microwave plasma is expected to be very high [1]. Therefore, useful applications of atmospheric pressure microwave plasmas are expected. The surface characteristics of SUS304 stainless steel are investigated before and after surface modification by microwave plasma under atmospheric pressure conditions. The plasma device was operated by power sources with microwave frequency. We used a device based on a coaxial transmission line resonator (CTLR). The atmospheric pressure plasma jet (APPJ) in the case of microwave frequency (880 MHz) used Ar as plasma gas [2]. Typical microwave Pw was 3-10 W. To determine the optimal processing conditions, the surface treatment experiments were performed using various values of Pw (3-10 W), treatment time (5-120 s), and ratios of mixture gas (hydrogen peroxide). Torch-to-sample distance was fixed at the plasma edge point. Plasma treatment of a stainless steel plate significantly affected the wettability, contact angle (CA), and free energy (mJ/$m^2$) of the SUS304 surface. CA and ${\gamma}$ were analyzed. The optimal surface modification parameters to modify were a power of 10 W, a treatment time of 45 s, and a hydrogen peroxide content of 0.6 wt% [3]. Under these processing conditions, a CA of just $9.8^{\circ}$ was obtained. As CA decreased, wettability increased; i.e. the surface changed from hydrophobic to hydrophilic. From these results, 10 W power and 45 s treatment time are the best values to minimize CA and maximize ${\gamma}$.

  • PDF

Large Area Plasma Characteristics using Internal Linear ICP (Inductively Coupled Plasma) Source for the FPD processing

  • Kim, Kyong-Nam;Lim, Jong-Hyeuk;Yeom, Geun-Young
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2006.08a
    • /
    • pp.544-547
    • /
    • 2006
  • In this study, the characteristics of large area internal linear ICP sources of $1,020mm{\times}920mm$ (substrate area is $880mm{\times}660mm$) were investigated using a multiple linear antennas with U-type parallel connection. Using the multiple linear antennas with U-type parallel connection, a high plasma density of $2{\times}10^{11}/cm^3$ and a high power transfer efficiency of about 88% could be obtained at 5kW of RF power and with 20mTorr Ar. A low plasma potential of less than 26V and a low electron temperature of $2.6{\sim}3.2eV$ could be also obtained. The measured plasma uniformity on the substrate size of 4th generation $(880mm{\times}660mm)$ was about 4%, therefore, it is believed that the multiple linear antennas with U-type parallel connection can be successfully applicable to the large area flat panel display processing.

  • PDF

EVALUATION OF WATER REPELLENCY FOR SILICON OXIDE FILMS PREPARED BY RF PLASMA-ENTRANCED CVD

  • Sekoguchi, Hiroki;Hozumi, Atsuhi;Kakionoki, Nobuyuki;Takai, Osamu
    • Journal of the Korean institute of surface engineering
    • /
    • v.29 no.6
    • /
    • pp.781-787
    • /
    • 1996
  • Silicom oxide films with good water repellency were prepared by rf plasma-enhanced CVD (rf-PECVD) using four kinds of organosilicon compound, which had different number of methyl ($CH_3$) groups, and oxygen as gas sources. The differences in the deposition rates, film composition and film properties were studied in detail. Water repellency depended on the number of $CH_3$ groups in the organosilicon compounds and the partial pressure of oxygen in the plasma. The highest contact angle for water drops, about 95 degrees, was obtained when trimethy lmethoxy silane (TMMOS) was used. The contact angle decreased with the amount of oxygen gas introduced into the plasma. The dissociation of $CH_3$ groups by adding oxygen was comfirmed by Fourier transform infrared spectroscopy(FTIR) and X-ray photoelectron spectroscopy (XPS). The optical properties were estimated by double-beam spectroscopy and ellipsometry. The transmittance of the glass plate coated by the film prepared with tetramethoxy silane (TMOS) was about 90% and the refractive index of film was 1.44. This value was smaller than the refractive index of a glass plate(soda lime glass, refractive index is 1.515) and this film played a role of anti-refractive coating.

  • PDF

Innovative Application of Cold Plasma Technology in Meat and Its Products

  • Dinesh D. Jayasena;Taemin Kang;Kaushalya N. Wijayasekara;Cheorun Jo
    • Food Science of Animal Resources
    • /
    • v.43 no.6
    • /
    • pp.1087-1110
    • /
    • 2023
  • The growing demand for sustainable food production and the rising consumer preference for fresh, healthy, and safe food products have been driving the need for innovative methods for processing and preserving food. In the meat industry, this demand has led to the development of new interventions aimed at extending the shelf life of meats and its products while maintaining their quality and nutritional value. Cold plasma has recently emerged as a subject of great interest in the meat industry due to its potential to enhance the microbiological safety of meat and its products. This review discusses the latest research on the possible application of cold plasma in the meat processing industry, considering its effects on various quality attributes and its potential for meat preservation and enhancement. In this regard, many studies have reported substantial antimicrobial efficacy of cold plasma technology in beef, pork, lamb and chicken, and their products with negligible changes in their physicochemical attributes. Further, the application of cold plasma in meat processing has shown promising results as a potential novel curing agent for cured meat products. Understanding the mechanisms of action and the interactions between cold plasma and food ingredients is crucial for further exploring the potential of this technology in the meat industry, ultimately leading to the development of safe and high-quality meat products using cold plasma technology.

Development of Virtual Integrated Prototyping Simulation Environment for Plasma Chamber Analysis and Design (VIP-SEPCAD) (플라즈마 챔버의 특성 분석 및 최적 설계를 위한 가상의 시뮬레이션 환경 개발)

  • 김헌창;설용태
    • Journal of the Semiconductor & Display Technology
    • /
    • v.2 no.4
    • /
    • pp.9-12
    • /
    • 2003
  • This paper describes a newly developed simulation environment for analysis and design of a plasma processing chamber based on first principles including complicated physical and chemical interactions of plasma, fluid dynamics of neutrals, and transport phenomena of particles. Capabilities of our simulator, named VIP-SEPCAD (Virtual Integrated Prototyping Simulation Environment for Plasma Chamber Analysis and Design), are demonstrated through a two dimensional simulation of an oxygen plasma chamber. VIP-SEPCAD can provide plasma properties such as spatiotemporal profiles of plasma density and potential, electron temperature, ion flux and energy, etc. By coupling neutral and particle transport models with a three moment plasma model, VIP-SEPCAD can also predict spatiotemporal profiles of chemically reactive species and particles exist in plasma.

  • PDF

Production of Dispersion-strengthened Cu-TiB2 Alloys by Ball-milling and Spark-plasma Sintering

  • Kwon, Dae-Hwan;Kum, Jong-Won;Nguyen, Thuy Dang;Dudinad, Dina;Choi, Pyuck-Pa;Kim, Ji-Soon;Kwon, Young-Soon
    • Proceedings of the Korean Powder Metallurgy Institute Conference
    • /
    • 2006.09b
    • /
    • pp.1205-1206
    • /
    • 2006
  • Dispersion-strengthened copper with $TiB_2$ was produced by ball-milling and spark plasma sintering (SPS).Ball-milling was performed at a rotation speed of 300rpm for 30 and 60min in Ar atmosphere by using a planetary ball mill (AGO-2). Spark-plasma sintering was carried out at $650^{\circ}C$ for 5min under vacuum after mechanical alloying. The hardness of the specimens sintered using powder ball milled for 60min at 300rpm increased from 16.0 to 61.8 HRB than that of specimen using powder mixed with a turbular mixer, while the electrical conductivity varied from 93.40% to 83.34%IACS. In the case of milled powder, hardness increased as milling time increased, while the electrical conductivity decreased. On the other hand, hardness decreased with increasing sintering temperature, but the electrical conductiviey increased slightly

  • PDF