• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.328-328
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• 2011

Wetting phenomena have been heavily studied for industrial and academic researches especially tuning the wettability between hydrophilicity and hydrophobicity. Wicking through the surface texture is shown on superhydrophilic surface while rolling (or dewetting) on the patterns of superhydrophobic surface. These wetting phenomena are known to be affected by surface wettability determined with physical surface patterns as well as chemical composition of surface layer. In this research, we introduce a method to control the wettability of a thin C-SiOx film from hydrophobic to hydrophilic using a mixture gas of HMDSO/$O_2$ by plasma polymerization with rf-CVD (radio frequency-Chemical Vapor Deposition). Wettability was finely controlled by changing the ratio of HMDSO/$O_2$. Hydrophilicity increased as the ratio decreased, while hydrophobicity was enhanced by the ratio. Moreover, fine control from superhydrophilicity to superhydrophobicity was achieved by C-SiOx coating on the Si wafer with prepatterns of submicron-sized pillar array formed by $CF_4$ plasma etching.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.378.2-378.2
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• 2016

Biosensors currently suffer from severe non-specific adsorption of proteins, which causes false positive errors in detection through overestimation of the affinity value. Overcoming this technical issue motivates our research. Polyethylene glycol (PEG) is well known for its ability to reduce the adsorption of biomolecules; hence, it is widely used in various areas of medicine and other biological fields. Likewise, amine functionalized surfaces are widely used for biochemical analysis, drug delivery, medical diagnostics and high throughput screening such as biochips. As a result, many coating techniques have been introduced, one of which is plasma polymerization - a powerful coating method due to its uniformity, homogeneity, mechanical and chemical stability, and excellent adhesion to any substrate. In our previous works, we successfully fabricated plasmapolymerized PEG (PP-PEG) films [1] and amine functionalized films [2] using the plasma enhanced chemical vapor deposition (PECVD) technique. In this research, an amine functionalized PP-PEG film was fabricated by using the plasma co-polymerization technique with PEG 200 and ethylenediamine (EDA) as co-precursors. A biocompatible amine functionalized film was surface characterized by X-ray photoelectron spectroscopy (XPS) and Fourier-transform infrared spectroscopy (FT-IR). The density of the surface amine functional groups was carried out by quantitative analysis using UV-visible spectroscopy. We found through surface plasmon resonance (SPR) analysis that non-specific protein adsorption was drastically reduced on amine functionalized PP-PEG films. Our functionalized PP-PEG films show considerable potential for biotechnological applications such as biosensors.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.381.1-381.1
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• 2014

In this study, we investigated the deposition behavior and the etch resistivity of plasma polymerized carbon hardmask (ppCHM) film with the variation of process temperature. The etch resistivity of deposited ppCHM film was analyzed by thickness measurement before and after direct contact reactive ion etching process. The physical and chemical properties of films were characterized on the Fourier transform infrared (FT-IR) spectroscope, Raman spectroscope, stress gauge, and ellipsometry. The deposition behavior of ppCHM process with the variation of temperature was correlated refractive index (n), extinction coefficient (k), intrinsic stress (MPa), and deposition rate (A/s) with the hydrocarbon concentration, graphite (G) and disordered (D) peak by analyzing the Raman and FT-IR spectrum. From this experiment we knew an optimal deposition condition for structure of carbon hardmask with the higher etch selectivity to oxide. It was shown the density of ppCHM film had 1.6~1.9 g/cm3 and its refractive index was 1.8~1.9 at process temperature, $300{\sim}600^{\circ}C$. The etch selectivity of ppCHM film was shown about 1:4~1:8 to undoped siliconoxide (USG) film (etch rate, 1300 A/min).